JPH01318297A - Electronic component mounting device - Google Patents

Abstract

PURPOSE:To reduce variations in product quality and improve the productivity by picking up an image of an electronic component on a wafer by a TV camera to generate actual positional data of the component and by providing means for correlate the characteristic data with the positional data for every electronic component. CONSTITUTION:Characteristic data stored in a memory 26 by control means 27 is correlated with actual positional data on a wafer 21 to generate such data as rank of luminance, coordinates, inclination, and quality for every light- emitting diode. When rank A is specified as the luminance of a light-emitting diode, such other data as coordinates, inclination, quality for diodes whose rank of luminance is A will be picked up. As mounting start instruction is given based on these data, an sucking nozzle of a transfer head sucks only good light-emitting diodes whose rank of intensity is A to mount them at predetermined positions on a printed board. Accordingly, it is possible not only to eliminate variations in the quality of products having substrates but also to improve their productivity.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components such as light emitting diodes on a substrate.

BACKGROUND ART FIG. 4 is a perspective view showing an example of a conventional electronic component mounting apparatus, in which 1 is a magazine for stocking printed circuit boards 2;
4 is a lifter device that moves the magazine 1 up and down; 4 is a pusher that pushes out the printed circuit boards 2 stored in the magazine 1; 15 is a conveyor that guides the conveyance of the printed circuit boards 2; and 6 is a board holder that positions the printed circuit boards 2. , 7 is an unloading device for unloading the printed circuit boards 2, 8 is a magazine for stocking the printed circuit boards 2 unloaded by the unloading device 7, 9 is a lifter device for vertically moving the magazine 8, 10 is a motor 11 for driving the X axis, and An X-Y table driven by a motor 12 that drives the Y-axis; 13 an electronic component supply device provided on the X-Y table 10 and stocking electronic components; 14 an electronic component supply device 14 stocked in the electronic component supply device 11; Recognition device that recognizes the condition of parts,
15 is a drive device.

Furthermore, FIG. 5 is a top view of essential parts showing an example of a conventional electronic component mounting apparatus, and 16, 17 and 18 are a first transfer head, a second transfer head and a second transfer head provided in the drive device 15, respectively. An adhesive application head, 19 an electronic component positioning device for correcting the posture of electronic components, and 20 an electronic component supply device J1.
21 and 22 are wafers and trays for stocking electronic components, respectively;
Reference numeral 3 denotes an adhesive supply device for applying adhesive to the printed circuit board 2.

The operation of the electronic component mounting apparatus configured as described above will be described below.

First, the printed circuit board 2 is pushed out from the magazine 1 by the pusher 4 and conveyed along the conveyor 5. The transported printed circuit board 2 is positioned above the board holder 6. Thereafter, the first transfer head 16, second transfer head 17, and adhesive application head 18 provided in the drive device 15 slide in the direction of arrow A. Then, the suction nozzle of the first transfer head 16 suctions the electronic components stocked in the electronic component supply device 13.

Thereafter, the first transfer head 16 moves from the top of the electronic component supply device 13 to the top of the electronic component positioning device 19, places the electronic component on the electronic component positioning device 19, and positions the electronic component. At the same time, a coating bottle provided on the adhesive coating head 18 is applied with adhesive by the adhesive supply device 23. The adhesive application head 18 equipped with an application bottle with adhesive adhered thereto moves from the top of the adhesive supply device 23 to the top of the board holder 6, and applies the adhesive adhered to the application bottle to a predetermined position on the printed circuit board 2. . At the same time, the second transfer head 17
moves to the upper part of the electronic component positioning device 19, and a suction nozzle provided on the second transfer head 17 suctions the positioned electronic component.

Thereafter, the second transfer head 17 moves to the upper part of the board holder 〇, and mounts the electronic component to a predetermined position on the printed circuit board 2 where the adhesive is applied.

Electronic components are successively mounted by repeating the above operations.

Problems to be Solved by the Invention However, in the conventional configuration described above, in the case of the light emitting diodes formed on the wafer 21, not all the light emitting diodes have the same brightness and there is always variation in brightness. When trying to supply light emitting diodes from the wafer 21 as shown in FIG.
The suction nozzle provided on the second transfer head 17 finally mounts the light emitting diodes on the printed circuit board 2 in the order shown by arrow B.

Therefore, light emitting diodes with different brightness will be mounted on each printed circuit board 2, and as a result, printed circuit boards 1 to 2 will have different brightness.
There was a problem that variations occurred in products having the substrate 2.

In addition, in order to eliminate variations between products, the light emitting diodes formed on the wafer 21 are classified from the wafer 21 to the tray 22 according to the brightness of the light emitting diodes formed on the wafer 21, and the light emitting diodes classified by the same brightness are provided. A suction nozzle provided on the first transfer head 16 picks up the light emitting diode from the tray 22 , and finally a suction nozzle provided on the second transfer head 17 transfers the light emitting diode onto the printed circuit board 2 .
It was also implemented on top.

However, in this case, the task of sorting the light emitting diodes formed on the wafer 21 into the trays 22 according to their brightness has conventionally been done manually, which requires a large amount of man-hours, which poses the problem of not increasing productivity. was.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention prepares in advance characteristic value data indicating the relationship between the characteristics and relative positions of a plurality of electronic components on a wafer. This system is provided with means for capturing images of electronic components using a television camera and generating actual position data, and at the same time associating characteristic value data with position data for each electronic component.

Function: With this configuration, it is possible to take out only electronic components of the same rank from the wafer with respect to the characteristics of the electronic components on the wafer.

Embodiment FIG. 1 is a functional block diagram of a control section of an electronic component mounting apparatus in an embodiment of the present invention, in which 24 is a television camera provided in the recognition device 14 and captures an image of the electronic component on the wafer 21; 26 is a recognition means that recognizes the image of the electronic component captured by the television camera 24 and outputs data such as the coordinates, inclination, and shape of the electronic component on the wafer 21, such as quality, etc.; 26 is the electronic component formed on the wafer 21; The memory 26 stores characteristic value data indicating the relationship between characteristics and relative positions of each electronic component; for example, if the electronic component is a light emitting diode, characteristic value data characterized by brightness is stored in the memory 26. That will happen. 27 is recognition means 2
Control means 28 controls the electronic component mounting apparatus based on the data and characteristic value data obtained by 5;
7, that is, data generated from the data obtained by the recognition means 25 and the characteristic value data, is a storage means for temporarily storing the data when the data is used many times.

Next, the operation of the control means 27 will be explained. FIG. 2 is a flowchart showing the operation of the control means 27.

In step 1, data required to recognize the electronic components on the wafer 21 is taught, such as the pitch between the electronic components on the wafer 21, the pixel rate, and the starting point for recognizing the electronic components on the wafer 21. conduct. In step 2, characteristic value data representing the characteristics and relative positional relationships of the electronic components on the wafer 21 is externally transferred onto the RAM of the electronic component mounting apparatus. In step 3,
The electronic components on the wafer 21 are recognized, and position data is created by obtaining recognition results based on the position coordinates and shape of each electronic component and whether it is good or bad. In step 4, new data (hereinafter referred to as address data) is generated by associating the characteristic value data transferred from the outside with the position data obtained in step 3 for each electronic component. Therefore, this address data includes information regarding each electronic component formed on the wafer 21 based on its characteristics (rank, position coordinates required for mounting on the printed circuit board 2, and quality information associated with the shape). In step 5, the electronic components on the wafer 21 are mounted on the printed circuit board 2 based on the address data obtained in step 4.In step 6, the address data obtained in step 4 is mounted on the printed circuit board 2. Furthermore, Fig. 3 is a flowchart showing the operation of step 5 in detail.In step 7, the address data obtained in step 4 is first loaded from the floppy disk.In step 8, the address data to be implemented is loaded. Enter the rank of the electronic component and the number of printed circuit boards 2 to be produced.

In step 9, only the electronic components of the rank designated in step 8 are mounted on the printed circuit board 2.

Here, suppose that the electronic component is a light emitting diode, and the wafer 21
The brightness rank of the light emitting diode formed above is A.
Assume that the items are classified into five levels from rank to E rank.

At this time, if it is desired to mount only light-emitting diodes having A-rank brightness on the printed circuit board 2, data regarding the brightness of the light-emitting diodes formed on the wafer 21 is first stored in the memory 26.

Next, the control means 27 associates the data stored in the memory 26 with the actual position data on the wafer 21 and determines the brightness rank, coordinates, inclination, and quality of each light emitting diode formed on the wafer 21. etc. will be generated.

When the brightness rank designation of the light emitting diode is input as A rank based on this generated data, data such as coordinates, inclination, quality, etc. regarding the light emitting diode with brightness rank A among the light emitting diodes formed on the wafer 21 is displayed. is picked up, and when a mounting start command is input based on this data, the suction nozzle of the transfer head 16 picks up only those light-emitting diodes formed on the wafer 21 whose brightness is rank A and which are non-defective. adsorbs,
Mount it on a predetermined position on the printed circuit board 2. Therefore, even if the brightness is A rank, the defective light emitting diodes remain on the wafer 21.

As described above, according to this embodiment, characteristic value data indicating the relationship between the individual characteristics and relative positions of a plurality of electronic components on the wafer 21 is prepared in advance, and images of the electronic components on the wafer 21 are At the same time, address data with characteristic value data and position data is generated by providing a means for associating characteristic value data and position data for each electronic component, while capturing data with a television camera and generating actual position data. Therefore, from among the plurality of electronic components on the wafer 21, one having desired characteristics can be selected and mounted at a predetermined position on the printed circuit board 2.

Effects of the Invention The present invention prepares in advance characteristic value data indicating the relationship between the individual characteristics and relative positions of a plurality of electronic components on a wafer, captures images of the electronic components on the wafer with a television camera, and displays the actual By providing a means to generate positional data and at the same time associating characteristic value data and positional data for each electronic component, one of the multiple electronic components on the wafer that has desired characteristics can be selected and placed on the substrate. It can be mounted at a predetermined position of the board, which eliminates variations in products having a board and further improves productivity.

[Brief explanation of the drawing]

FIG. 1 is a functional block diagram of a control unit of an electronic component mounting apparatus in an embodiment of the present invention, FIG. 2 is a flow chart showing the operation of the control means in an embodiment of the present invention, and FIG. A flowchart showing a partial operation of the control means in an embodiment of the present invention, FIGS. 4 and 5 are a perspective view and a top view of essential parts, respectively, showing an example of a conventional electronic component mounting apparatus, and FIG. 6 is a conventional FIG. 3 is a top view of main parts of the electronic component supply device of the electronic component mounting apparatus of FIG. 2... Printed circuit board 5... Conveyor 1
0...X-Y table 13...Electronic component supply device 21...Wafer 22...Tray 26...
...Memory 27...Name of control means agent Patent attorney Toshio Nakao et al. 1 year old, Luther-2F-wafer

Claims (1)

[Claims] Characteristic value data indicating the relationship between individual characteristics and relative positions of multiple electronic components on a wafer is prepared in advance, images of the electronic components on the wafer are captured by a television camera, and actual position data is generated. At the same time, it has means for associating the characteristic value data and the position data for each electronic component, and selects one having a desired characteristic from among the plurality of electronic components on the wafer and places it at a predetermined position on the substrate. An electronic component mounting device characterized by being able to mount electronic components.