JP4607837B2 - LED chip mounting method and apparatus, and LED chip mounted substrate - Google Patents

Description

  The present invention relates to an LED chip mounting method and mounting apparatus for mounting a plurality of LED chips on a substrate, and an LED chip mounted substrate manufactured as a result of the mounting.

  Conventionally, an LED chip mounted substrate on which a large number of LED (light emitting diode) chips are mounted in a grid pattern on a substrate is a backlight installed on the back side of various illumination devices such as a liquid crystal display device. Are used as LED lighting substrates. In such an LED illumination board, a large number of LED chips of the same type are mounted with high density in a grid-like arrangement in which they are arranged in the vertical and horizontal directions. For example, a component mounting apparatus is preset. By being controlled based on the NC data, mounting on the board is efficiently performed.

Japanese Patent Laid-Open No. 11-305198

  Such an LED illumination board is required to emit light uniformly without unevenness. However, the LED chip itself has a problem that brightness varies from product to product, in particular, brightness variation from production lot to production lot. For this reason, in conventional backlights, the amount of current flowing through the LED chip is controlled in order to reduce the effect of variations in brightness between products due to the characteristics of the LED chip on the luminous properties of the entire backlight. This is dealt with by a control method such as (see, for example, Patent Document 1).

  However, with such a control method, even though it is possible to adjust the entire backlight or a partial light amount, it is possible to individually control even the brightness variation of each LED chip. There is a problem that is difficult. In particular, as high-density mounting of a large number of LED chips progresses, it becomes more difficult to cope with such a control method.

  Accordingly, an object of the present invention is to solve the above-described problem, and in the LED chip mounted substrate on which the same kind of LED chips are mounted in a grid arrangement, the variation in luminance for each LED chip product is a substrate. An object of the present invention is to provide an LED chip mounting method and apparatus, and an LED chip mounted substrate, which can reduce the influence on the uniformity of light emission as a whole.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, a plurality of chips supplied from a component supply apparatus equipped with a plurality of component supply cassettes for supplying the same type of LED chips are sucked and held by a plurality of suction nozzles, respectively. In the LED chip mounting method of mounting the chip in a grid pattern on the substrate,
In the first combination of the individual suction nozzles and the component supply cassette, the respective chips are collectively suctioned and held by the plurality of suction nozzles from the plurality of component supply cassettes, and the suction holding is performed. Mounted chips in a row on the substrate,
Thereafter, in a second combination different from the first combination, the respective chips are collectively sucked and held by the respective suction nozzles from a plurality of the component supply cassettes, and then mounted first. Provided is an LED chip mounting method, wherein the suction held chips are mounted in a row adjacent to the chip row.

According to the second aspect of the present invention, in each of the suction nozzles whose arrangement interval is set to an integer multiple of the arrangement interval of each of the component supply cassettes, one suction nozzle and one component supply By performing alignment with the cassette, collective suction based on the first combination is performed,
The LED chip mounting method according to the first aspect is provided in which batch suction based on the second combination is performed by aligning the one suction nozzle with the other component supply cassette.

  According to the third aspect of the present invention, the second combination is determined by aligning the one suction nozzle with the other one component supply cassette adjacent to the one component supply cassette. The LED chip mounting method according to the second aspect is provided.

  According to the fourth aspect of the present invention, the second combination may be applied to the other one component supply cassette selected at random from the respective component supply cassettes other than the one component supply cassette. The LED chip mounting method according to the second aspect, which is determined by aligning one suction nozzle.

According to the fifth aspect of the present invention, LED chips with different production lots are accommodated for the respective component supply cassettes,
In the row of chips mounted in the first combination on the substrate and the row of chips mounted in the second combination, the chips adjacent to each other are chips different in the production lot. An LED chip mounting method according to any one of the first to fourth aspects is provided.

According to the sixth aspect of the present invention, a component supply apparatus equipped with a plurality of component supply cassettes for supplying the same type of LED chip;
A mounting head equipped with a plurality of suction nozzles;
A chip suction positioning device that performs relative movement between the component supply device and the mounting head so that the plurality of component supply cassettes and the respective suction nozzles are aligned;
A substrate holding device for holding a substrate having mounting positions arranged in a lattice shape on which each of the LED chips is mounted;
The mounting head and the substrate holding device are moved relative to each other so that the chips sucked and held by the respective suction nozzles are mounted at one row of the grid-shaped mounting positions. A chip mounting positioning device;
The combination of the individual suction nozzles and the component supply cassettes capable of batch suction of the chips from a plurality of the component supply cassettes by the respective suction nozzles is changed every time the batch suction is performed. The chip mounting is performed so that the respective chips sucked together by controlling the positioning device are mounted at the mounting position of the row adjacent to the previously mounted row at the grid-like mounting position of the substrate. And a control device for controlling the positioning device for an LED.

According to the seventh aspect of the present invention, in the component supply apparatus, the component supply cassette is provided in a number larger than the number of the suction nozzles in the mounting head, and each of the component supply cassettes is a predetermined number. Equipped with arrangement at intervals,
In the component mounting head, the arrangement interval is set to an integer multiple of the arrangement interval of the cassette, and the respective suction nozzles are equipped.
The controller changes the combination of the individual suction nozzles and the component supply cassette by changing the suction position data from the one component supply cassette by the one suction nozzle every time the batch suction is performed. An LED chip mounting apparatus according to a sixth aspect is provided.

  According to an eighth aspect of the present invention, in the component supply apparatus, the sixth aspect in which the LED chips of different production lots are accommodated for each of the respective component supply cassettes is the LED chip mounting according to the seventh aspect. Providing equipment.

  According to the ninth aspect of the present invention, in the LED chip mounted substrate on which the same type of LED chips are mounted in a grid array, the LED chips adjacent in the vertical direction and the horizontal direction of the grid array are: Provided is an LED chip mounted substrate which is an LED chip manufactured in different manufacturing lots.

  According to the present invention, in the first combination of the individual suction nozzles and the component supply cassette, the respective chips are sucked and held collectively by the plurality of suction nozzles from the plurality of component supply cassettes. After the respective chips are mounted in one row of the mounting positions having a lattice arrangement, the respective chips that are collectively sucked by the second combination different from the first combination are arranged adjacent to the row. As a result, it is possible to prevent chips supplied from the same component supply cassette from being adjacent to each other in a grid-like arrangement. Therefore, it is possible to prevent the LED chips of the same production lot from being concentrated and mounted at a specific location, and even if there is a variation in the brightness of the LED chips, the illuminance of the entire LED chip mounted substrate The uniformity can be ensured, and the quality can be improved.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

  A schematic plan view of a component mounting apparatus 101 that is an example of an LED chip mounting apparatus that performs an LED chip mounting method according to an embodiment of the present invention is shown in FIG. In the component mounting apparatus 101 of FIG. 1, a substrate 5 on which a large number of LED chips of the same type are mounted is carried by a loader 10 from outside the apparatus, and is positioned and fixed at a predetermined position in a held state. After being performed, the unloader 11 carries out the apparatus. A mounting head 6 is mounted on the X-axis arm 7 driven in the Y-axis direction on the pair of Y-axis arms 8 so that the mounting head 6 can move in the X-axis direction. Along with the above movement, the mounting head 6 can freely move on the XY plane. Furthermore, a plurality of parts cassettes 3 storing the same type of LED chip are arranged, and a first component supply device 1 and a second component supply device 2 are arranged and mounted on the opposing front end side. The stored LED chips are sequentially supplied from the arranged component supply positions.

  The mounting head 6 has, for example, eight suction nozzles 4 arranged in a row as a plurality of suction nozzles. From the first component supply device 1 and the second component supply device 2, eight mounting nozzles are mounted. LED chips can be sucked and held together. The arrangement interval of the suction nozzles 4 is set, for example, as an interval that is an integral multiple of the arrangement interval of the parts cassettes 3 (the arrangement interval of the feeders described later), so that one adsorption nozzle 4 is set to 1 By positioning above the base parts cassette 3, all the eight suction nozzles 4 can be positioned above the parts cassette 3, and eight LED chips can be sucked and held simultaneously.

  The suction nozzle 4 is detachably mounted on a lifting device and a rotating device (both not shown), and is lowered by the lifting device on the parts cassette 3 to hold the LED chip by vacuum suction. When the mounting head in a state where the LED chip is held by the suction nozzle 4 moves to a predetermined position on the substrate 5, that is, the LED chip mounting position, the predetermined suction nozzle 4 is lowered by the elevating device and the rotating device. Is rotated to a predetermined mounting angle and mounted at a mounting position on the substrate 5. In order to recognize the holding posture of the chip held by the suction nozzle 4 as described above, the component mounting apparatus 101 is provided with two recognition cameras 15. In the present embodiment, the loader 10 and the unloader 11 are examples of the substrate holding device, and the X-axis arm 7 and the Y-axis arm 8 (XY robot) are the component supply devices 1 and 2 and the held substrate. 5 is an example of a chip suction positioning device and a chip mounting positioning device that move the mounting head 6 in the XY plane.

  The component mounting apparatus 101 having such a configuration is provided with a control device 14 that performs overall control based on a mounting program (for example, NC data) while associating operations of the respective components.

  Here, FIG. 2 is a block diagram showing a main configuration of the control device 14. As shown in FIG. 2, the control device 14 has, as its main configuration, a storage unit 16 that stores information related to chip mounting such as a mounting program input by an input unit (not shown) in a readable manner, and the storage unit 16 The stored information is read out, and based on the information, the calculation unit 17 that calculates and determines information necessary for chip mounting, for example, the position information of the suction position of the chip, is determined by the calculation unit 17. Specifically, a drive control unit 18 that performs drive control of each component in the component mounting apparatus 101 based on the obtained information is provided. In addition to information such as a mounting program input from the outside of the control device 14, the storage unit 16 uses a series of controls until the chip sucked from the component supply device is mounted on the board as a task. It also has a function of storing task numbers. The specific operation of each component in the control device 14 will be described later.

  Next, an LED chip mounting method according to this embodiment will be described.

  Prior to describing the mounting method of the present embodiment, first, a mounting method according to a comparative example of the mounting method of the present embodiment will be described with reference to a schematic explanatory diagram shown in FIG. Note that the schematic explanatory diagram shown in FIG. 3 shows which of the LED cassettes from which one of the parts cassettes 3 of the parts supply devices 1 and 2 is provided by the eight suction nozzles 4 of the mounting head 6. It is a figure which shows whether it picks up and mounts and mounts on the board | substrate 5 using a conceptual diagram.

  As shown in FIG. 3, the component supply device (which may be either the first or the second, but here the second component supply device) 2 is equipped with a plurality of parts cassettes 3. Two feeders 3 a are attached to the parts cassette 3. Each feeder stores the same type of LED chip wound around a reel as a tape-like component. In each feeder, one chip is always located at the feeder position (component extraction position). The suction nozzle 4 is in a state capable of being suction-held. As shown in FIG. 3, each feeder position is given a Z number as an identification number, and is Z1, Z2, Z3, Z4,..., Z23,. ing.

  Further, the eight suction nozzles 4 equipped with the mounting heads 6 are also given numbers for identification, and are assigned H1, H2, H3,..., H8 in order from the left end in FIG. ing. In addition, the space | interval twice the arrangement | positioning space | interval of a feeder position is the space | interval space | interval of the suction nozzle 4. FIG.

  In the mounting method of the comparative example, first, as a first task, the mounting head 6 and the component supply device 2 are aligned so that the suction nozzle H1 is positioned above the feeder position Z1. By this alignment, the suction nozzle H2 is above the feeder position Z3, the suction nozzle H3 is above the feeder position Z5, the suction nozzle H4 is above the feeder position Z7,..., And the suction nozzle H8 is at the feeder position Z15. It will be positioned upward. Accordingly, as shown in FIG. 3, the chips C supplied from the feeder positions Z1, 3, 5, 7, 9, 11, 13, 15 are collectively sucked and held by the suction nozzles H1 to H8, and the chips are taken out. Is done.

  FIG. 4 is a schematic explanatory diagram of the substrate 5. As shown in FIG. 4, on the substrate 5, the mounting positions P of the chips C are set in a grid pattern in the X-axis method and the Y-axis direction, and in order to specify the individual mounting positions P, the X-axis direction , X1 to X10..., And Y1 to Y7. For example, the mounting position P is specified as a mounting position (X9, Y7).

  The mounting head 6 that has collectively sucked the chips is moved above the substrate 5 by the XY robot, and after the mounting position (X1, Y1) and the suction nozzle H1 are aligned, the mounting head 6 is moved to the mounting position. The chip C supplied from the feeder position Z1 is mounted. Next, after the mounting position (X2, Y1) and the suction nozzle H2 are aligned, the chip C supplied from the feeder position Z3 is mounted on the mounting position, and the mounting position (X3, Y1) is sequentially installed. The chip C supplied from the feeder position Z5 is mounted, and the chip C supplied from the feeder position Z15 is mounted at the mounting position (X8, Y1). That is, the chips C sucked and held by the eight suction nozzles H1 to H8 in a lump are eight places arranged in a line in the Y-axis direction among the mounting positions P set in a lattice arrangement on the substrate 5. Are sequentially mounted at the mounting positions (X1, Y1) to (X8, Y1). In FIG. 4, the number attached to the chip C indicates from which feeder position the chip is supplied. For example, the chip C labeled “5” is supplied from the feeder position Z5. Chip C.

  After the mounting on the substrate 5 is completed, the second task is performed. Specifically, as in the first task, the mounting head 6 and the component supply device 2 are aligned so that the suction nozzle H1 is positioned above the feeder position Z1, and the suction nozzles H1 to H8 are The feeder positions Z1, Z3, Z5, Z7, Z9, Z11, Z13, and Z15 are simultaneously positioned above. After performing the collective suction of the chip C from each feeder position, the chip C is moved above the substrate 5 and moved to the second column in the Y-axis direction of the grid-like mounting position P of the substrate 5, that is, the column of Y2. Each chip C is mounted sequentially. By sequentially performing such tasks, the chip C is mounted at each mounting position P as shown in FIG. Specifically, on the substrate 5, each chip C supplied from the feeder position Z1 is mounted in the row of X1, and the chip C supplied from the feeder position Z3 is mounted in the row of X2. Each chip C supplied from the feeder position Z15 is mounted in the row of X8.

  On the other hand, although the same type of LED chip C is stored in the reel as a tape-like component, the feeder 3a equipped in each part cassette 3 has the LED chip manufacturing process and the tape-like component manufacturing process. In many cases, LED chips C of a production lot are stored in a certain reel, and if the reels are different, the production lots of the LED chips C are often different. As a result, the LED chips C of different production lots are stored for each feeder, and there is a high possibility that the brightness of the LED chips C varies among the feeders. Therefore, in the mounting method according to the comparative example described in FIGS. 3 and 4, the LED chips C supplied from the same feeder position are mounted in a line in each column in the X-axis direction. For example, in the case where the LED chip C supplied from the feeder position Z5 has a characteristic that the luminance is lower than that of the other LED chips C, the LED chips C are arranged in a row X3 as shown in FIG. Since the LED chip C is mounted, the luminance variation is conspicuous in appearance, and there is a high possibility that a quality problem will occur.

  The mounting method according to the present embodiment solves the problems that may occur in such a comparative example, and devise the mounting procedure, so that the LED chip can be used regardless of the presence of luminance variations that occur in the LED chip itself. This is to improve the uniformity of the amount of light in the chip mounted substrate.

  First, a mounting program for performing the mounting method according to the present embodiment will be described with reference to the data tables shown in FIG. 5, FIG. 6, and FIG. FIG. 5 shows NC data in a table format, and shows the correspondence between the data number N, the feeder number installed in the component supply device 2, and the suction nozzle number installed in the mounting head 6. For example, the data number 4 indicates that the chip is sucked and held by the suction H4 from the feeder position Z7, and indicates a combination for batch suction and pick-up of each suction nozzle 4 and each feeder. FIG. 6 shows a component shape code as the type of component stored in each feeder included in the component supply device 2, and shows that all the same types of LEDs are stored in the feeders Z1 to Z23. Yes. By using these data, the control device 14 performs a calculation as described later, and as shown in FIG. 7, the suction nozzle 4 picks up the chip from which feeder position for each task of the mounting head 6. A specific operation program indicating a combination of whether or not is performed is determined. The NC data and the like shown in FIG. 5 and FIG. 6 are input and held in advance in the storage unit 16 of the control device 14, and calculation is performed by the calculation unit 17 using these data. A specific operation program is determined as shown.

  Next, in the mounting method of the present embodiment, FIG. 8 shows a flowchart of a procedure for determining for each task from which feeder 3a the chip 3 is to be sucked and taken out by the suction nozzle 4, and is a schematic diagram for explaining the mounting method. An explanatory diagram is shown in FIG.

  In the flowchart of FIG. 8, when the suction position search is started in step S1, first, the task number T (for example, T = 2 for the second task) is read from the storage unit 16 by the calculation unit 17 (step S2). ). Next, in step S3, using the functional expression S = f (T) of the task number T, the calculation unit 17 calculates the shift amount S of the suction position where suction pickup is performed in the component supply device 2. That is, the shift amount S is different for each task. After that, in step S4, the suction position Z 'is calculated by using this shift amount S so that Z' = Z + S. For example, when the suction removal is performed from the feeder Z1 by the suction nozzle H1 using the NC data shown in FIG. 5, if the shift amount S = 3 is calculated, the suction position Z 'is determined to be Z4.

  Next, in step S5, when it is confirmed that no part (chip) breakage has occurred in the determined feeder Z4, the suction position search is completed in step S9, and suction pickup by the suction nozzle 4 is performed. Is implemented. On the other hand, if the component has run out, whether or not there is a spare feeder in step S6 is determined based on the data shown in FIG. If there is no spare, the process is stopped due to the out of parts in step S7. If there is a spare, for example, if it is determined that the feeder Z5 can be used as a spare, Z5 is determined in step S8. And the suction position search is completed. The suction position is shifted by such a method. As described above, one suction position is determined for each task, so that one suction nozzle 4 is aligned with the determined suction position (feeder position), and the other suction nozzles 4 are individually set. Can be aligned with the feeder position. That is, by determining such a suction position, combinations of individual suction nozzles 4 and feeder positions are determined, and the above combinations are also changed (shifted) by shifting the suction position for each task. )

  In the specific example of the mounting operation shown in FIG. 9, the suction position is increased by one for each task in the case where suction pickup is performed collectively by the eight suction nozzles 4 provided in the mounting head 6 ( (Shifted) is described. In the first task, the suction nozzle H1 is aligned above the feeder position Z1, so that the suction nozzle H2 is at the feeder position Z3, the suction nozzle H3 is at the feeder position Z5,..., And the suction nozzle H8 is at the feeder position. Aligned with Z15. That is, the position of each suction nozzle 4 and the feeder position is adjusted by the first combination. After the chips C are sucked and taken out from the respective feeder positions, the eight chips C are mounted on the substrate 5 in a line in the Y direction (in the line Y1) as in the comparative example.

  Next, in the second task, each suction position is shifted one by one. Specifically, the suction nozzle H1 is aligned with the feeder position Z2, the suction nozzle H2 is aligned with the feeder position Z4,..., And the suction nozzle H8 is aligned with the feeder position Z16. That is, the position of each suction nozzle 4 and the feeder position is adjusted by a second combination different from the first combination. Thereafter, the suction and take-out of the chips C are collectively performed with the second combination. The chips C held by suction are sequentially mounted in a row on the Y2 row of the substrate 5. As shown in FIG. 9, such a suction position shift is sequentially repeated to perform suction pickup and mounting.

  As a result of such mounting, as shown in the schematic diagram of the mounting position of the substrate 5 in FIG. 10, the chip C supplied from the same feeder position in each of the mounting positions P in the X direction and the Y direction is obtained. It can be made not to be adjacent. For example, even if the LED chip C supplied from the feeder Z5 has a characteristic that the luminance is low, the low-luminance chips C are not adjacent to each other or arranged in a row, to some extent. It is possible to disperse and arrange them so as to be separated by an interval of. Therefore, compared with the mounting arrangement of the chip C in the comparative example shown in FIG. 4, the mounting arrangement of the chip C in the present embodiment shown in FIG. 10 is a case where the luminance variation occurs in the LED chip C for each manufacturing lot. Even if it distributes and arrange | positions the LED chip C of the same manufacturing lot disperse | distributing, the uniformity of the illumination intensity as the whole chip | tip mounted substrate 5 can be improved, and the quality can be improved. In addition, since the shift of the suction position of the chip C can be performed by simple calculation for each task, it is not necessary to process the NC data itself in advance and input it, and control load Does not grow.

  Further, as shown in FIG. 9, since the arrangement interval of the suction nozzles 4 is set at an interval twice the arrangement interval of the individual feeders 3a, the adsorption position is shifted one by one for each task. Even if the control method is performed, it is possible to prevent the chips C supplied from the same feeder 3a from being adjacently arranged in the oblique direction in the chip mounting arrangement of FIG. Therefore, it is possible to manufacture a chip-mounted substrate in which chips C of the same production lot are not adjacent in the vertical direction, the horizontal direction, and the diagonal direction, and the quality can be further improved.

  In the above description, the case where the suction position is shifted one by one for each task has been described. However, an integer of 2 or more may be adopted as such a shift amount. . Further, by adopting, for example, “7” of the prime numbers as such a shift amount, the dispersibility of the mounting positions for each task can be further improved.

  Note that the present embodiment is not limited to the mounting method described above, and various other modifications can be applied. For example, FIG. 11 shows a schematic explanatory diagram of a mounting method according to a modification of the present embodiment, and FIG. 12 shows a schematic diagram showing the arrangement of the chips mounted as a result.

  As shown in FIG. 11, in this modification, collective suction is performed by four of the eight suction nozzles 4 included in the mounting head 6. Specifically, in the first task, the suction nozzle H1 is aligned with the feeder position Z1, the suction nozzle H2 is aligned with the feeder position Z3,..., And the suction nozzle H4 is aligned with the feeder position Z7. By the nozzles H1 to H4, the suction and removal of the chips C are performed in a lump. Thereafter, the suction nozzle H5 is aligned with the feeder position Z1, the suction nozzle H6 is aligned with the feeder position Z3,..., The suction nozzle H8 is aligned with the feeder position Z7, and the remaining four suction nozzles H5 to H8 collectively. Then, the suction and removal of the chip C is performed. The chips C sucked and held in this way are sequentially mounted in a row at each mounting position P in the Y1 row as shown in FIG. Next, in the second task, the suction position is shifted one by one, the suction nozzle H1 is aligned with the feeder position Z2, ... the suction nozzle H4 is aligned with the feeder position Z8, and the four suction nozzles H1 to H1 are aligned. The chips C are picked up and taken out collectively by H4, and the chips C are picked up and picked up by the remaining four suction nozzles H5 to H8 from the same suction position. These chips are sequentially mounted in a row at each mounting position P in the Y2 row in FIG.

  By repeatedly performing such a mounting operation, as shown in FIG. 12, it is possible to prevent the chips C supplied from the same feeder position from being gathered adjacent to each other, and the LED chips C having the same manufacturing lot can be prevented. The effect of this embodiment that the uniformity of illuminance can be improved can be obtained.

  FIG. 13 shows a schematic explanatory view of a mounting method for still another modified example of the present embodiment, and FIG. 14 shows a schematic diagram of the arrangement of the chips C mounted as a result. As shown in FIG. 13, the present modification is different from the mounting method of FIG. 9 in that the suction position shift is not determined by a certain function expression but is shifted at random. As shown in FIG. 13, for example, the shift amount of the suction position in the second task is “3”, the shift amount in the third task is “−1”,. 7 ”, the shift amount is determined at random. As a result, as shown in FIG. 14, the effects of the present embodiment can be obtained without the chips C supplied from the same feeder position being adjacent to each other or arranged in a line. In particular, in the method of determining the shift amount randomly as described above, the chips C supplied from a certain feeder position are not arranged based on a certain regularity, and a more dispersed chip arrangement can be realized. it can.

  In the above description, the case where the mounting head 6 has eight suction nozzles 4 arranged in a row has been described. However, if the number of suction nozzles 4 is two or more, the present invention is not limited to this. An effect can be obtained. In addition, even if the individual suction nozzles 4 are sequentially picked up instead of collectively, the effects of the present invention can be obtained, but such a large number of LED chips are efficiently mounted. From this point of view, it is preferable that the plurality of suction nozzles 4 collectively perform suction and extraction.

  Further, the case where the present invention is applied to the so-called modular type component mounting apparatus 101 has been described as an example, but the present invention is also applied to a rotary type component mounting apparatus that includes a plurality of suction nozzles and performs batch suction. The implementation method of the invention can be applied.

  Further, the above-described mounting method is described on the premise that the mounting positions of the “grid array” are formed on the substrate 5. In the present invention, the “lattice array” means a certain regularity. In addition to the arrangement in the vertical direction and the horizontal direction, it also includes an arrangement in the oblique direction.

  Further, in the description of the mounting method described above, the shift amount of the suction position is changed for each task, but of course, the shift amount may be changed for each of a plurality of tasks. Further, by changing the shift amount for each substrate instead of for each task, it is possible to prevent a portion where illuminance is biased from occurring at the same location in a plurality of substrates. From such a viewpoint, the shift amount of the suction position is changed for each task, and the change amount of the shift amount is changed for each substrate, so that the LED chips are dispersedly arranged on the substrate and the LED chips are arranged between the substrates. , And the quality of the LED chip mounted substrate can be improved.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

1 is a schematic plan view of a component mounting apparatus according to an embodiment of the present invention. The control block diagram which shows the main structures of the control apparatus with which the component mounting apparatus of FIG. 1 is provided. Model explanatory drawing of the mounting operation | movement concerning the comparative example of the said embodiment. The schematic diagram which shows arrangement | positioning of the chip | tip mounted by mounting operation | movement of the said comparative example. The data table which shows NC data used for the mounting method of the said embodiment. The data table which shows the relationship between the feeder used for the mounting method of the said embodiment, and a component shape code. The table | surface which shows the mounting program used for the mounting method of the said embodiment. The flowchart which shows the procedure of a suction position search in the mounting method of the said embodiment. Model explanatory drawing of the mounting operation | movement in the mounting method of the said embodiment. The schematic diagram which shows arrangement | positioning of the chip | tip mounted by the mounting operation | movement of FIG. The model explanatory drawing of the mounting operation | movement in the mounting method concerning the modification of the said embodiment. The schematic diagram which shows arrangement | positioning of the chip | tip mounted by the mounting operation | movement of FIG. The model explanatory drawing of the mounting operation | movement in the mounting method concerning another modification of the said embodiment. The schematic diagram which shows arrangement | positioning of the chip | tip mounted by the mounting operation | movement of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st component supply apparatus 2 2nd component supply apparatus 3 Parts cassette 3a Feeder 4 Suction nozzle 5 Substrate 6 Mounting head 7 X-axis arm 8 Y-axis arm 10 Loader 11 Unloader 14 Control unit 16 Storage unit 17 Calculation unit 18 Drive Control unit 101 Component mounting device C Chip H Suction nozzle number P Mounting position T Task number Z Feeder position number

Claims (9)

A plurality of chips supplied from a component supply apparatus equipped with a plurality of component supply cassettes for supplying the same type of LED chips are sucked and held by a plurality of suction nozzles, and the chips are mounted on a substrate in a grid pattern. In the mounting method of the LED chip
In the first combination of the individual suction nozzles and the component supply cassette, the respective chips are collectively suctioned and held by the plurality of suction nozzles from the plurality of component supply cassettes, and the suction holding is performed. Mounted chips in a row on the substrate,
Thereafter, in a second combination different from the first combination, the respective chips are collectively sucked and held by the respective suction nozzles from a plurality of the component supply cassettes, and then mounted first. An LED chip mounting method, wherein the suction held chips are mounted in a row adjacent to the chip row. In each of the suction nozzles whose arrangement interval is set to an integral multiple of the arrangement interval of each of the component supply cassettes, by aligning one of the suction nozzles with one of the component supply cassettes, Collective adsorption based on the first combination is performed,
The LED chip mounting method according to claim 1, wherein batch suction based on the second combination is performed by aligning the one suction nozzle with the other component supply cassette.   3. The LED chip mounting according to claim 2, wherein the second combination is determined by aligning the one suction nozzle with the other one component supply cassette adjacent to the one component supply cassette. Method.   In the second combination, the one suction nozzle is aligned with the other one component supply cassette selected at random from the respective component supply cassettes other than the one component supply cassette. The LED chip mounting method according to claim 2, wherein the LED chip mounting method is determined. For each of the above component supply cassettes, LED chips with different production lots are accommodated,
In the row of chips mounted in the first combination on the substrate and the row of chips mounted in the second combination, the chips adjacent to each other are chips different in the production lot. The mounting method of the LED chip as described in any one of Claim 1 to 4 performed. A component supply device equipped with a plurality of component supply cassettes for supplying the same type of LED chips;
A mounting head equipped with a plurality of suction nozzles;
A chip suction positioning device that performs relative movement between the component supply device and the mounting head so that the plurality of component supply cassettes and the respective suction nozzles are aligned;
A substrate holding device for holding a substrate having mounting positions arranged in a lattice shape on which each of the LED chips is mounted;
The mounting head and the substrate holding device are moved relative to each other so that the chips sucked and held by the respective suction nozzles are mounted at one row of the grid-shaped mounting positions. A chip mounting positioning device;
The combination of the individual suction nozzles and the component supply cassettes capable of batch suction of the chips from a plurality of the component supply cassettes by the respective suction nozzles is changed every time the batch suction is performed. The chip mounting is performed so that the respective chips sucked together by controlling the positioning device are mounted at the mounting position of the row adjacent to the previously mounted row at the grid-like mounting position of the substrate. And a control device for controlling the positioning device for LED. In the component supply apparatus, the component supply cassette is provided in a number larger than the number of the suction nozzles in the mounting head, and the component supply cassettes are arranged and installed at a predetermined arrangement interval.
In the component mounting head, the arrangement interval is set to an integer multiple of the arrangement interval of the cassette, and the respective suction nozzles are equipped.
The controller changes the combination of the individual suction nozzles and the component supply cassette by changing the suction position data from the one component supply cassette by the one suction nozzle every time the batch suction is performed. The LED chip mounting apparatus according to claim 6.   8. The LED chip mounting apparatus according to claim 6, wherein LED chips of different production lots are accommodated in each of the component supply cassettes.   LED in which LED chips of the same type are mounted in a grid arrangement and the LED chips adjacent in the vertical and horizontal directions of the grid arrangement are manufactured in different production lots. An LED chip mounted substrate characterized by being a chip.

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