WO2022107303A1

WO2022107303A1 - Nc data generation method, nc data generation device, and component mounting system

Info

Publication number: WO2022107303A1
Application number: PCT/JP2020/043348
Authority: WO
Inventors: 宜紀奥村
Original assignee: ヤマハ発動機株式会社
Priority date: 2020-11-20
Filing date: 2020-11-20
Publication date: 2022-05-27
Also published as: JP7343719B2; CN116349421A; JPWO2022107303A1

Abstract

This NC data generation method comprises: an LED arrangement setting step in which LED chips to be mounted at a plurality of mounting points provided in a lattice shape on a substrate are set in relation to a reel loaded in a tape feeder; a region setting step in which a plurality of unit regions are set on the substrate; a luminance calculation step in which an average luminance of the LED chips is calculated for each of the plurality of unit regions; and an arrangement adjustment step in which, if there is a unit region in which the average luminance of the LED chips is outside a predetermined range, at least one of the LED chips in the region outside the predetermined range is changed, and then the LED chips to be mounted at the mounting points are finally determined. In the LED arrangement setting step, the LED chips to be mounted at the mounting points are set so that the LED chips to be supplied from the same reel are not adjacent to each other vertically, horizontally, or diagonally. In the arrangement adjustment step, at least one of the plurality of LED chips is changed to an LED chip of a reel different from the reel that supplies the at least one LED chip.

Description

NC data generation method, NC data generation device and component mounting system

The present invention is a method of generating NC data suitable for a component mounting device that produces an LED mounting board in which a plurality of LED (Light Emitting Diode) chips are mounted in a grid pattern on the board, and NC data for generating the NC data. Regarding the generator and the component mounting system.

LED mounting boards in which a plurality of LED chips are mounted in a grid pattern at high density on the board are used in various lighting devices. The LED mounting board can be efficiently produced by the component mounting device. In the component mounting device, the LED chip is supplied by a tape feeder. The mounting head attracts the LED chip and conveys it onto the substrate for mounting.

Even if the LED chips are of the same type, the brightness of each individual varies, and if LED chips of the same brightness are mounted intensively in a specific area of the substrate, it causes uneven brightness and the emission quality of the lighting device deteriorates. do. Therefore, attention should be paid to this point.

For example, Patent Document 1 discloses a method for mounting an LED chip in view of this problem. Specifically, Patent Document 1 discloses that LED chips supplied from the same tape feeder (same reel) are mounted so as not to be adjacent to each other in the vertical direction, the horizontal direction, and the diagonal direction. There is.

In this method, the component supply tape wound around the reel (hereinafter, abbreviated as tape as appropriate) usually contains LED chips of the same manufacturing lot, that is, the brightness is almost the same (the brightness rank is the same). The focus is on the manufacturing situation of the tape in which the LED chip is housed. In other words, it focuses on the fact that even if the same type of LED chip is used, the brightness differs (the brightness rank differs) when the reel (tape) is different.

According to the method of Patent Document 1, when the same type of LED chips are supplied by a plurality of tape feeders, the LED chips supplied by the same tape feeder are mounted adjacent to each other in the vertical direction, the horizontal direction, and the diagonal direction. Therefore, it is suppressed that LED chips having the same brightness are intensively mounted in a specific area.

The mounting method disclosed in Patent Document 1 is effective in suppressing uneven brightness of the substrate. However, even when the LED chips adjacent to each other in the vertical method, the horizontal direction, and the diagonal direction are supplied from different tape feeders, if the brightness of the LED chips supplied from some plurality of tape feeders are close to each other, When LED chips with similar brightness are intensively mounted in a specific area, uneven brightness may still occur. Therefore, there is room for improvement in this regard.

Japanese Patent No. 4607738

INDUSTRIAL APPLICABILITY The present invention provides a technique for more highly suppressing the occurrence of uneven brightness in an LED mounting board when an LED mounting board in which a plurality of LED chips are mounted in a grid pattern is produced by a component mounting device. The purpose is to do.

The NC data generation method according to the present invention comprises a plurality of tape feeders for supplying the same type of LED chips, and at least one mounting head for taking out the LED chips from the plurality of tape feeders and mounting them on a substrate. It is a method of generating NC data for manufacturing an LED mounting board in which a plurality of the same type of LED chips are mounted in a grid pattern by a component mounting device provided, and a plurality of mountings provided in a grid pattern on the board. An LED arrangement setting step of setting the LED chip to be mounted on each of the points in association with the reel loaded in the tape feeder, and an area setting step of setting a plurality of unit areas including a plurality of mounting points on the board. Based on the known information regarding the brightness of the LED chip, for each of the plurality of unit regions, the brightness calculation step for obtaining the average brightness of the LED chips mounted in the unit region and the average brightness of the LED chips in each unit region are within the default range. If there is a unit area outside the default range, change at least one of the LED chips mounted in the non-default range so that the average brightness falls within the default range. This includes an arrangement adjustment step of finally determining the LED chip to be mounted on each of the plurality of mounting points provided in the grid pattern, and in the LED arrangement setting step, the LEDs supplied from the same reel are included. In the arrangement adjustment step, the LED chips to be mounted are set at each of the plurality of mounting points provided in the grid pattern so that the chips are not adjacent to each of the row direction, the column direction, and the diagonal direction. At least one of the plurality of LED chips mounted in the out-of-predetermined range is changed to an LED chip supplied by a reel different from the reel that supplies the LED chip.

Further, the NC data generation device according to the present invention includes a plurality of tape feeders for supplying the same type of LED chips, and at least one mounting head for taking out the LED chips from the plurality of tape feeders and mounting them on the substrate. It is a device for generating NC data for manufacturing an LED mounting board in which a plurality of the same type of LED chips are mounted in a grid pattern by a component mounting device provided, and a plurality of devices provided in a grid pattern on the board. An LED arrangement setting unit that sets the LED chips to be mounted on each of the mounting points in association with the reel loaded in the tape feeder, and an area setting unit that sets a plurality of unit areas including a plurality of mounting points on the board. , A brightness calculation unit for obtaining the average brightness of the LED chip mounted in the unit region and the average brightness of the LED chip in each unit region are defaulted for each of the plurality of unit regions based on the known information regarding the brightness of the LED chip. It is determined whether or not it is within the range, and if there is a unit area outside the default range, at least one of the LED chips mounted in the outside the default range is set so that the average brightness falls within the default range. By changing, the LED arrangement setting unit includes an arrangement adjustment unit that finally determines the LED chip to be mounted on each of the plurality of mounting points provided in the grid pattern, and the LED arrangement setting unit is supplied from the same reel. The LED chips to be mounted are set at each of the plurality of mounting points provided in the grid pattern so that the LED chips are not adjacent to each of the row direction, the column direction, and the diagonal direction, and the arrangement adjusting unit is used. At least one of the plurality of LED chips mounted in the out-of-predetermined range is changed to an LED chip supplied by a reel different from the reel that supplies the LED chip.

The component mounting system according to the present invention produces the NC data generator and an LED mounting board on which a plurality of LED chips of the same type are mounted in a grid pattern based on the NC data generated by the NC data generator. It includes a component mounting device to be used.

It is an overall block diagram which shows the component mounting system which concerns on 1st Embodiment of this invention (the NC data generation method of this invention and the component mounting system to which NC data generation apparatus is applied). It is a block diagram which shows the control system of a component mounting system. It is a flowchart which shows the NC data creation process (NC data generation method). It is a schematic diagram which shows an example of the board before mounting an LED chip. It is a figure which shows an example of a reel information. It is a schematic diagram of the substrate which shows an example of the initial arrangement of the LED chip. It is a schematic diagram of the substrate P which shows an example of the relationship between the initial arrangement of the LED chip and a unit area. It is a schematic diagram of the main part of the board which shows the modification example of the LED chip set in the area out of a predetermined range. It is a schematic diagram of the main part of the board which shows the modification example of the LED chip set in the area out of a predetermined range. It is a schematic diagram of the main part of the board which shows the modification example of the LED chip set in the area out of a predetermined range. It is a schematic diagram of the substrate which shows an example of the final arrangement of the LED chip. It is a schematic diagram of a substrate which shows an example of the combination of 5 LED chips arranged in succession. It is a schematic diagram of the parts supply part explaining the arrangement of a reel (tape feeder). It is a schematic diagram of the substrate for demonstrating the combination of the arrangement of LED chips. It is a schematic diagram of the parts supply part for demonstrating the arrangement of a reel (tape feeder). It is a plan schematic diagram which shows the component mounting apparatus applied to the component mounting system of the 2nd Embodiment. It is a schematic diagram which shows the substrate in which the 1st mounting area and the 2nd mounting area are set. It is a table which shows an example of reel information. It is a schematic diagram of the substrate which shows the arrangement of the LED chip. It is a schematic diagram of the board which shows the other example of the arrangement of the LED chip when the 1st mounting area and the 2nd mounting area are set. It is a table diagram which shows an example of resistance value information.

[Overall configuration of component mounting system]
FIG. 1 is an overall configuration diagram showing a component mounting system according to the first embodiment of the present invention (a component mounting system to which the NC data generation method and the NC data generation device of the present invention are applied).

The component mounting system 1 is a system that manufactures a component mounting board (Printed Circuit Board) on which a component (SMD) is mounted (mounted) on the board P while transporting the board P (Printed Wild Board). The components include large package components such as LSIs and small chip components such as ICs, transistors, capacitors, LEDs and resistors.

The component mounting system 1 includes a plurality of component mounting devices 2 and a management device 4 arranged along the production line. In this example, two component mounting devices 2 (2A, 2B) are continuously provided, and FIG. 1 illustrates the configuration of only one component mounting device 2A. The component mounting device is a device for mounting components on the substrate P.

The management device 4 is a device that comprehensively manages the operation of the component mounting device 2, such as the operating status of the component mounting device 2 and the production status of the substrate P, and is installed at a place away from the production line, for example. The management device 4 and the component mounting device 2 are connected to each other via a communication line 6, whereby various information can be transmitted and received between the management device 4 and the component mounting device 2.

The management device 4 includes a database 4a (shown in FIG. 2) including information on the board P and information on components mounted on the board P. The management device 4 includes a function of generating and distributing NC data for executing component mounting work in the component mounting device 2, such as the arrangement of the tape feeder 15 and the mounting order of components described later, based on the information in the database 4a. .. The component mounting device 2 executes a component mounting operation on the board P based on the NC data. That is, in this example, the management device 4 corresponds to the "NC data generation device" of the present invention.

[Configuration of component mounting device 2]
The configuration of the component mounting device 2 (2A, 2B) will be described with reference to FIG. The basic configurations of the two

component mounting devices

2A and 2B are the same. Therefore, the individual

component mounting devices

2A and 2B are not distinguished, and the configuration thereof will be described with reference to "component mounting device 2". In the figure, the XY index is shown to clarify the directional relationship. The X direction is a direction along the production line parallel to the horizontal plane, and the Y direction is a direction orthogonal to the X direction on the horizontal plane.

The component mounting device 2 includes a base 10 having a rectangular shape in a plan view, a board transfer mechanism 12 for transporting the substrate P on the base 10, and a component supply unit 14.

The substrate transfer mechanism 12 has a pair of conveyors 12a, each of which is a belt conveyor. The board transfer mechanism 12 receives the board P from the right side (-X side) of FIG. 1 and conveys it to the work position (the position of the board P shown in the figure), and after the mounting work is completed, the board P is moved from the work position to the same figure. Carry out to the left side (+ X side) of.

The component supply unit 14 is provided on both sides (-Y side and + Y side) of the board transfer mechanism 12, respectively. In each component supply unit 14, a plurality of tape feeders 15 for supplying chip components are arranged in parallel along the substrate transfer mechanism 12.

As shown by a balloon in FIG. 1, the tape feeder 15 includes a reel 15a on which a tape that stores and holds chip parts is wound at regular intervals, and while feeding out the tape 15b from the reel 15a, the mounting head 18 described later Chip parts are supplied to the parts removal position by.

The head unit 16 takes out parts from the parts supply unit 14 (tape feeder 15) and mounts them at a defined mounting point on the board P. The head unit 16 is provided so as to be movable in the X direction and the Y direction by the head unit drive mechanism 20.

The head unit drive mechanism 20 is composed of a so-called XY robot whose drive source is a motor. That is, the head unit drive mechanism 20 includes a beam 22 that moves in the Y direction along a pair of rails 21 fixed to the elevated frame, and moves the head unit 16 in the X direction along the beam 22. It is configured.

The head unit 16 is provided with a plurality of axially-shaped mounting heads 18 extending in the vertical direction and a mounting head drive mechanism for driving these mounting heads 18. In this example, the head unit 16 is provided with five mounting heads 18 arranged at regular intervals in the X direction. The mounting head drive mechanism is configured to move up and down and rotate each mounting head 18 using a motor as a drive source. Each mounting head 18 communicates with a negative pressure generator via a switching valve, and is configured to be able to suck and hold a component by receiving a negative pressure supply from the negative pressure generator.

The spacing between the five mounting heads 18 and the spacing between the tape feeders 15 arranged in the component supply unit 14 are set to be the same. As a result, each mounting head 18 can simultaneously suck and take out parts from the five tape feeders 15 of the parts supply unit 14.

FIG. 2 is a block diagram showing a control system of the component mounting system 1 (component mounting device 2 and inspection device 4). The component mounting device 2 includes a control device 30 as shown in the figure. The control device 30 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), peripheral circuits, and the like, and has a main control unit 34 and a drive control unit as functional configurations thereof. 36, including a data storage unit 38, a communication control unit 32, and the like. The main control unit 34 controls the drive of the board transfer mechanism 12, the head unit 16, the mounting head 18, etc. via the drive control unit 36 based on the mounting program (including NC data) and various data stored in the data storage unit 38. This comprehensively controls a series of component mounting operations in the component mounting device 2. The communication control unit 32 is a communication interface connected to the communication line 6, and transmits / receives various information to / from the management device 4 and the other component mounting device 2.

Under the control of the main control unit 34, the head unit 16 reciprocates between the board P arranged at the working position and the component supply unit 14, and the mounting head 18 transfers components from the component supply unit 14 (tape feeder 15). An operation (component mounting operation) of taking out and mounting the board P at a predetermined mounting point is executed.

[Configuration of management device 4]
The management device 4 is based on, for example, a personal computer equipped with an input device such as a keyboard and a display device such as a liquid crystal display, and includes a control device 40 as shown in FIG. The control device 40 is configured to include a CPU, ROM, RAM, peripheral circuits, and the like, and includes an NC data generation unit 44, a data storage unit 46, and a communication control unit 42 as its functional configuration.

As described above, the management device 4 has a function of creating NC data for the component mounting device 2 to execute the component mounting work based on the information of the database 4a, and the NC data generation unit 44 performs the function. I am in charge. In this example, the "NC data" refers to the order in which the components are mounted on the board P (steps), the mounting position coordinates for each step in the mounting order (each data of X, Y, Z, and θ), and the components to be mounted. It is the data that defines the part number and so on.

The NC data generation unit 44 has, as one of the NC data creation functions, a function of creating NC data for producing an LED mounting board on which a plurality of LED chips of the same type are mounted in a grid pattern. The NC data generation unit 44 creates the NC data based on a predetermined data creation program. In the following description, when the term "NC data" is used, it refers to NC data for producing an LED mounting board, unless otherwise specified.

More specifically, the NC data generation unit 44 includes an LED arrangement setting unit 44a, an arrangement adjustment unit 44b, and a feeder arrangement setting unit 44c.

Based on the information in the database 4a, the LED arrangement setting unit 44a sets the LED chips to be mounted on each of the plurality of mounting points provided in a grid pattern on the substrate P in association with the reel 15a for supplying the LED chips. That is, the LED arrangement setting unit 44a sets the arrangement of the LED chips mounted on the substrate P. As described above, the reel 15a is a part for supplying parts around which the tape 15b containing the parts (here, the LED chip) is wound, and is loaded on the tape feeder 15.

FIG. 4 schematically shows an example of the substrate P before mounting the LED chip. Note that FIG. 4 is a diagram assuming a state in which the substrate P is arranged at the working position of the component mounting device 2 (same for FIGS. 6 to 12, 14, 17, 17, 19 and 20).

In the example of FIG. 4, the substrate P is provided with mounting points Mp arranged in a grid pattern of 10 rows (coordinates X1 to X10) in the X direction and 4 columns (coordinates Y1 to Y4) in the Y direction. There is. The LED arrangement setting unit 44a sets which mounting point Mp the LED chip of which reel 15a is mounted on such a substrate P.

The arrangement adjusting unit 44b adjusts the arrangement of the LED chips set by the LED arrangement setting unit 44a as necessary. Specifically, the arrangement adjusting unit 44b mounts one or more as necessary for each of the plurality of preset unit areas so that the average brightness of the LED chip in the unit area falls within the predetermined range. The LED chip set at the point Mp is changed to determine the final placement of the LED chip. In this example, the arrangement adjustment unit 44b has a configuration having the "arrangement adjustment unit", the "area setting unit", and the "luminance calculation unit" of the present invention.

The feeder arrangement setting unit 44c arranges the reels 15a in the component supply unit 14, that is, the reels 15a, based on the final arrangement of the LED chips determined by the arrangement adjustment unit 44b (corresponding to the “final information” of the present invention). The specific arrangement of the tape feeder 15 loaded with the reels is set.

The data storage unit 46 stores various data including NC data created by the NC data generation unit 44. The communication control unit 42 is a communication interface connected to the communication line 6 and transmits / receives various information to / from the component mounting device 2. For example, at the time of production of the LED mounting board, NC data stored in the data storage unit 46 is transmitted to the component mounting device 2 in response to a request from the component mounting device 2. The component mounting device 2 executes a component mounting operation based on this NC data.

[NC data generation method]
The process of creating NC data by the management device 4 (NC data generation unit 44) will be specifically described by taking the substrate P shown in FIG. 4 as an example.

Prior to explaining the creation process, first, the relationship between the tape feeder 15 and the LED chip will be explained. The tape feeder 15 is loaded with a reel 15a on which the tape 15b containing the LED chip is wound. The LED chip is supplied to the mounting head 18 by feeding out the tape 15b from the reel 15a.

When producing an LED mounting board in which a plurality of LED chips of the same type are mounted in a grid pattern, from the viewpoint of production efficiency, a plurality of tape feeders each loaded with reels 15a containing the same type of LED chips. 15 is installed in the component supply unit 14. As described above, the tape 15b wound around the reel 15a contains the LED chips of the same production lot, and one reel 15a (one tape 15b) contains the brightness (luminance rank). ) Means that the same LED chip is housed. In other words, even if the LED chips are of the same type, if the reels 15a are different, it can be said that the brightness (luminance rank) is strictly different (there is a variation). That is, when the same type of LED chip is supplied by a plurality of tape feeders 15, the brightness (luminance rank) of the LED chips varies among the tape feeders 15.

The NC data creation process described below is based on the above findings, and assuming that the brightness (luminance rank) of the LED chips of each reel 15a is different from each other, the arrangement of the LED chips with respect to each mounting point Mp, And NC data in which the arrangement of the tape feeder 15 in the component supply unit 14 is set is created.

FIG. 3 is a flowchart showing an NC data creation process (NC data generation method).

First, the LED arrangement setting unit 44a sets the LED chip to be mounted on each mounting point Mp of the board P in association with the reel 15a based on the information in the database 4a. Thereby, the initial arrangement of the LED chips is set (step S1).

The database 4a stores, for example, reel information J1 (corresponding to "known information regarding the brightness of the LED chip" of the present invention) as shown in FIG. The reel information J1 is information in which the ID (identification information) of the reel 15a is associated with detailed data such as the characteristic value, the production lot, and the number of stored LED chips stored in the reel 15a of each ID. In the example of FIG. 5, the information of the five reels 15a is shown, and in the figure, only the correspondence between the ID of the reels 15a and the luminance (luminance information) which is one of the detailed data is shown. .. The reel information J1 is stored in the database 4a when an operator reads a two-dimensional code such as a bar code attached to the reel 15a with a reader at the time of delivery. In the following description, the reels 15a having IDs "R1" to "R5" may be referred to as reels Re1 to reels Re5.

The LED arrangement setting unit 44a determines the initial arrangement of the LED chips with reference to the above reel information J1. Specifically, a plurality of mounting points provided in a grid pattern so that the LED chips of the same reel 15a are not adjacent to each other in the vertical direction (row direction), the horizontal direction (column direction), and the diagonal direction. The LED chip to be mounted for each of the Mp is selected from the LED chips of the reels Re1 to Re5.

FIG. 6 is a schematic diagram of the substrate P showing an example of the initial arrangement of the LED chips. The number of each mounting point Mp in FIG. 6 indicates the number of the ID of the reel 15a. That is, the number "1" of the mounting point Mp of the coordinates (X1, Y1) indicates that the LED chip of the reel Re1 is mounted, and the number "4" of the mounting point Mp of the coordinates (X5, Y3). Indicates that the LED chip of the reel Re4 is mounted.

As shown in FIG. 6, in the LED arrangement setting unit 44a, the LED chips of the reels Re1 to Re5 are repeatedly arranged twice in ascending order from X1 to X10 for each row, and the LED chips of the reels Re1 to Re5 between the rows are repeatedly arranged. The LED chips to be mounted at each mounting point Mp are set so that the positions of the LED chips are regularly offset in the column direction by two mounting points. As a result, the initial arrangement of the LED chips is set so that the LED chips of the same reel 15a are not adjacent to each other in any of the vertical, horizontal, and diagonal directions.

Next, the arrangement adjusting unit 44b sets a plurality of unit regions Ar including a plurality of mounting points Mp for the initial arrangement of the LED chips, and the LED chips belonging to each unit region Ar based on the reel information J1. The average brightness of is calculated (step S3). In this case, the arrangement adjusting unit 44b sets a default unit area Ar according to the size of the substrate P, the number of mounting points Mp, and the like.

FIG. 7 is a schematic diagram of the substrate P showing an example of the relationship between the initial arrangement of the LED chips and the unit region Ar. In this example, as shown in FIG. 7, the arrangement adjusting unit 44b sets a total of five unit areas Ar1 to Ar5 including eight adjacent mounting points Mp, and based on the reel information J1, the unit areas Ar1 to Ar5 are set. The average brightness _LA of the LED chips belonging to each is calculated. For example, the average luminance LA of the unit region Ar1 including the eight mounting points Mp of the coordinates (X1 to X4, Y1 to Y2) is _LA = (2 × _L1 + L2 + 2 × L3 + 2 × L4 + L5) / 8. Further, the average luminance LA of the unit region Ar2 including the eight mounting points Mp of the coordinates (X5 to X8, Y1 to Y2) is _LA = ( _L1 + 2 × L2 + 2 × L3 + L4 + 2 × L5) / 8. The arrangement adjusting unit 44b calculates the average luminance LA of the other unit regions Ar3 to _Ar5 in the same manner.

Next, the arrangement adjusting unit 44b determines whether or not there is a region (referred to as a region outside the default range) in which the average luminance LA is not within the default range among the unit regions Ar1 to _Ar5 (step S5). .. Here, in the case of Yes, the arrangement adjusting unit 44b has the average brightness LA of the outside _- defined range area within the predetermined range for at least one of the eight LED chips set in the out-of-default range area. (Appropriately referred to as "first change requirement") (step S7).

In this case, in the arrangement adjusting unit 44b, the LED chip after the change and the LED chips adjacent to the LED chip in the vertical, horizontal, and diagonal directions are LED chips of reels 15a that are different from each other. (As appropriate, referred to as "second change requirement"), change at least one of the LED chips in the out-of-predetermined area.

In FIG. 7, when it is assumed that the unit area Ar1 is an area outside the predetermined range, the arrangement adjusting unit 44b uses, for example, the LED chip (LED chip of the reel Re1) set in the coordinates (X1, Y1). As shown in 8, the LED chip of the reel Re5 is changed. In this case, the changed LED chip (LED chip of reel Re5) and the LED chip adjacent to the LED chip in the vertical direction, the horizontal direction, and the diagonal direction are LED chips of reels 15a that are different from each other. Therefore, the above second change requirement is satisfied.

Here, when it is impossible to satisfy both the first and second change requirements, the arrangement adjustment unit 44b is set in the out-of-default range area so that only the first change requirement is satisfied. Change at least one of the LED chips. Specifically, in FIG. 7, the LED chip (LED chip of the reel Re3) whose unit area Ar1 is outside the predetermined range and is set to the coordinates (X3, Y1) is shown in FIG. 9, for example. If the first change requirement is satisfied only by changing to the LED chip of the reel Re2, the arrangement adjusting unit 44b changes the LED chip set in the unit area Ar1 in that way. In this case, the changed LED chip (LED chip of reel Re2) and the LED chip adjacent to the LED chip in the left lateral direction become the same LED chip of the reel 15a.

When the reel information J1 includes information on reels Re (for example, reel ReX) other than reels Re1 to Re5, the LED arrangement setting unit 44a is at least one of the LED chips set in the out-of-default range area. One may be changed to the LED chip of the reel ReX. That is, when the unit area Ar1 is outside the predetermined range in FIG. 7, for example, the LED chip (LED chip of the reel Re1) set in the coordinates (X4, Y2) is used in the reel ReX as shown in FIG. You may change to an LED chip. In this case, the first and second change requirements are satisfied.

When the arrangement adjusting unit 44b determines that the average brightness LA of all the unit areas Ar1 to _Ar5 is within the predetermined range for the initial arrangement of the LED chips set by the LED arrangement setting unit 44a in step S3 (in step S5). In No), the initial arrangement is determined as the final arrangement of the LED chips mounted on each mounting point Mp of the substrate P (step S9). On the other hand, when any of the LED chips set in the region outside the predetermined range is changed in step S7, the arrangement adjusting unit 44b mounts the changed arrangement of the LED chips on each mounting point Mp of the substrate P. It is determined as the final arrangement of the LED chips to be formed (step S9).

Next, based on the final arrangement of the LED chips, the feeder arrangement setting unit 44c sets the arrangement of the tape feeder 15 in association with the reel 15a (step S11). That is, when the reels Re1 to Re5 are loaded into the tape feeder 15 and arranged in the component supply unit 14, the arrangement of the reels Re1 to Re5 in the component supply unit 14 is set.

As described above, the distance between the tape feeders 15 arranged in the component supply unit 14 and the distance between the mounting heads 18 in the head unit 16 are equivalent. Therefore, the feeder arrangement setting unit 44c sets the arrangement of the reels Re1 to Re5 so that the LED chips of the reels Re1 to Re5 can be simultaneously attracted to each other, specifically, the reels Re1 to Re5 are arranged continuously in the X direction. Appropriately referred to as "first placement requirement").

Further, the feeder arrangement setting unit 44c refers to the arrangement of the LED chips for each column (each column of coordinates Y1 to Y4) in the final arrangement, and is the most among the combinations of the five LED chips arranged continuously in the column direction. The arrangement of each reel Re1 to Re5 is set in a combination that frequently appears (referred to as "second arrangement requirement" as appropriate). Specifically, it is as follows.

FIG. 11 is a schematic diagram of the substrate P showing an example of the final arrangement of the LED chips. The final arrangement shown in FIG. 11 is the LED chip (LED chip of reel Re3) having coordinates (X3, Y1) and the LED chip (LED chip of reel Re2) having coordinates (X10, Y2) in the initial arrangement shown in FIG. ) And have been changed.

In the case of the final arrangement as shown in FIG. 11, the combinations of the five LED chips arranged consecutively in the column direction are "1,2,3,4,5", "2,3,4,5,1", "3,4,5,1,2", "4,5,1,2,3", "5,1,2,3,4", "1,2,2,4,5" and "3" , 4, 5, 1, 3 ". Of these, "5, 1, 2, 3, 4" appears most frequently at 5 times (shown by hatching in FIG. 11), "1, 2, 2, 4, 5" and "3, 4, 5". The frequency of ", 1, 3" is the lowest once each. The frequency of "3, 4, 5, 1, 2" is 3 times as shown in FIG. 12, and the frequency of appearance of other combinations is 4 times each.

Therefore, as shown in FIG. 13, the feeder arrangement setting unit 44c arranges the reels Re1 to Re5 in such an arrangement that the reels Re1 to Re5 are continuously arranged in the order of "5, 1, 2, 3, 4". That is, it is determined as the arrangement of the tape feeder 15 on which the reels Re1 to Re5 are loaded (the circled numbers in FIG. 13 indicate the numbers of the IDs of the reels 15a). The arrangement of the group of tape feeders 15 in which the reels Re1 to Re5 are loaded in the component supply unit 14 is set in consideration of the number and position of components other than the LED chip mounted on the substrate P, for example, and the takt time. Is set to the optimum position where is shortened as much as possible.

According to the creation process as described above, the NC data generation unit 44 sets the arrangement of the LED chips to be mounted on each mounting point Mp of the board P and the arrangement of the tape feeders 15 loaded with the reels Re1 to Re5, respectively. Will be created. As described above, the NC data created by the NC data generation unit 44 is stored in the data storage unit 46, and is transmitted to the component mounting device 2 in response to a read request from the component mounting device 2, for example. Based on this NC data, the so-called setup work for assembling the tape feeder 15 to the component supply unit 14 is executed by the operator. Then, by controlling the mounting head 18 and the like by the control device 30 based on the NC data, the component (LED chip) mounting operation is executed in the component mounting device 2.

In this example, the process of step S1 in FIG. 3 corresponds to the "LED arrangement setting step" of the present invention, and the process of step S3 corresponds to the "region setting step" and the "brightness calculation step" of the present invention. The process of steps S5 to S9 corresponds to the "arrangement adjustment step" of the present invention, and the process of step S11 corresponds to the "feeder arrangement setting step" of the present invention.

[Action effect, etc.]
According to the above-mentioned component mounting system 1, when producing an LED mounting board in which a plurality of LED chips are arranged in a grid pattern, the management device 4 (NC data generation unit 44) mounts the LED chips on each mounting point Mp of the board P. NC data is created in which the arrangement of the LED chips and the arrangement of the reels Re1 to Re5 (tape feeder 15) are set, and the mounting operation of the component mounting device 2 is controlled based on this NC data.

In this case, the initial arrangement of the LED chips is set so that the LED chips of the same reel 15a are not adjacent to each other in any of the vertical, horizontal, and diagonal directions, and further, in each unit area Ar1 to Ar5. If necessary, some of the LED chips in the initial arrangement are changed so that the average brightness _LA of the LED chips is within the predetermined range. As a result, the final arrangement of the LED chips mounted on the substrate P is set.

According to the LED mounting board produced based on such NC data, even if the brightness of the LED chips of some of the plurality of reels 15a is close to each other, the average brightness _LA of the LED chips for each unit area is high. Since the final arrangement of the LED chips is set so as to be within the predetermined range, uneven brightness is less likely to occur on the LED mounting board. Therefore, as compared with the conventional LED mounting board in which the LED chips supplied from the same reel are simply arranged so as not to be adjacent to each other in the vertical direction, the horizontal direction, and the diagonal direction, the LED mounting board has uneven brightness. It is possible to suppress this to a higher degree.

Further, since the arrangement of the reels Re1 to Re5 (tape feeder 15) in the component supply unit 14 is set so as to satisfy the first and second setting requirements, the brightness unevenness as described above occurs. It is possible to efficiently produce a difficult LED mounting board. That is, according to the NC data, the number of times the LED chips are simultaneously adsorbed (taken out) by the five mounting heads 18 is as large as possible, and the LED chips adsorbed by each mounting head 18 are mounted on the substrate P. The amount of movement of the head unit 16 on the substrate is also relatively small. Therefore, it contributes to shortening the tact time. Therefore, it is possible to efficiently produce an LED mounting board that is less likely to cause uneven brightness.

In the above embodiment, the arrangement of the LED chips for each row (each row of coordinates Y1 to Y4) in the final arrangement of the LED chips is referred to, and among the combinations of the five LED chips arranged continuously in the row direction, The arrangement of the reels Re1 to Re5 is set in the combination that appears most frequently. However, the arrangement of the reels Re1 to Re5 may be set as follows in consideration of the distance between the mounting heads 18 and the adjacent mounting points Mp on the substrate P.

For example, as shown in FIG. 14, when the distance Inh between the mounting heads 18 and the distance InM between the mounting points Mp are different (InM <Inh), the LED chip adsorbed by each mounting head 18 is attached to the substrate P. It is a combination in which the amount of movement of the head unit 16 on the board at the time of mounting is as small as possible (appropriately referred to as "third placement requirement"), and the frequency of appearance most in the four rows of coordinates Y1 to Y4. Arrangement of each reel Re1 to Re5 is set with a high combination (appropriately referred to as "fourth arrangement requirement"). That is, the feeder arrangement setting unit 44c may set the arrangement of the reels Re1 to Re5 so as to satisfy the above-mentioned first arrangement requirement and the third and fourth arrangement requirements.

Specifically, for example, as shown in FIG. 14, when the spacing Inh of the mounting heads 18 is close to approximately twice the spacing InM of the mounting point Mp, among the LED chips set in one row, among the LED chips set in one row. According to the combination of LED chips lined up every other, it can be said that the third arrangement requirement is satisfied. Here, in the four rows Y1 to Y4, the combinations of the LED chips arranged every other are "1,3,5,2,4", "2,4,1,3,5", "3,5". There are five types, "2,4,1", "4,1,3,5,2" and "5,2,4,1,3". Of these, "1,3,5,2,4", "2,4,1,3,5" and "3,5,2,4,1" appear twice each, and the rest once each. Therefore, there are three ways to satisfy the fourth placement requirement: "1,3,5,2,4", "2,4,1,3,5" and "3,5,2,4,1". Is.

Therefore, the reels Re1 to Re5 are consecutive in the order of "1,3,5,2,4", "2,4,1,3,5" and "3,5,2,4,1". The arrangement arranged side by side is set as the arrangement of the reels Re1 to Re5, that is, the arrangement of the tape feeders 15 on which the reels Re1 to Re5 are loaded. For example, as shown in FIG. 15, the arrangements arranged consecutively in the order of "1,3,5,2,4" may be set as the arrangements of Re1 to Re5 (circled numbers in the figure). Indicates the number of the ID of the reel 15a).

According to such NC data, it is possible to secure an opportunity for simultaneous adsorption (removal) of LED chips by the five mounting heads 18, and on the substrate when the LED chips adsorbed by each mounting head 18 are mounted on the substrate P. The amount of movement of the head unit 16 in the above is also kept relatively small. Therefore, it can be said that this also contributes to shortening the tact time.

[Second Embodiment of Component Mounting System 1]
Next, a second embodiment of the component mounting system 1 will be described. The basic configuration of the component mounting system 1 of the second embodiment is the same as that of the first embodiment. Therefore, in the following description, the same reference numerals will be given to the configurations common to the first embodiment, and the description thereof will be omitted or simplified, and the differences from the first embodiment will be mainly described in detail.

FIG. 16 schematically shows a component mounting device 2 included in the component mounting system 1 according to the second embodiment. The component mounting device 2 is provided with two first and

second head units

16A and 16B, and the head unit drive mechanism 20 has these first and

second head units

16A and 16B in the X direction and Y. It is configured to be able to move individually in the direction. That is, the head unit drive mechanism 20 includes first and

second beams

22A and 22B that move in the Y direction along the pair of rails 21, and causes the first head unit 16A in the X direction along the first beam 22A. The second head unit 16B is configured to move in the X direction along the second beam 22B. Each of the first and

second head units

16A and 16B is provided with five mounting heads 18 arranged at regular intervals in the X direction.

In this component mounting device 2, the first head unit 16A is controlled by the main control unit 34 so that the first head unit 16A is connected to the board P at the working position and the component supply unit 14 (referred to as the first component supply unit 14A) on one side (+ Y side). While reciprocating between them, the mounting head 18 takes out the components from the first component supply unit 14A and mounts them on the board P, and the second head unit 16B is on the other side (-) of the board P at the working position. While reciprocating between the component supply section 14 (second component supply section 14B) on the Y side), the mounting head 18 takes out the component from the second component supply section 14B and mounts the component on the board P. .. That is, the first and

second head units

16A and 16B cooperate with each other to mount the components on one substrate P.

The NC data creation process by the management device 4 (NC data generation unit 44) is basically the same as the creation process (steps S1 to S11) of the first embodiment shown in FIG. However, the process for creating the second embodiment differs from the first embodiment in the following points.

In step S1, the NC data generation unit 44 (LED arrangement setting unit 44a) first performs work on the substrate P by the first mounting area Mr1 on which the first head unit 16A works and the second head unit 16B. The second mounting area Mr2 to be performed is set. The first mounting area Mr1 and the second mounting area Mr2 are independent regions, and are default regions determined according to the size of the substrate P and the number of mounting points Mp.

FIG. 17 shows an example in which the first mounting area Mr1 and the second mounting area Mr2 are set on the substrate P shown in FIG. In FIG. 17, the left half (+ X side) of the substrate P is the first mounting area Mr1, and the right half (−X side) is the second mounting area Mr2.

Then, the LED arrangement setting unit 44a and the arrangement adjustment unit 44b execute the processes of steps S2 to S9 for the first mounting area Mr1 and the processes of steps S2 to S9 for the second mounting area Mr2. As a result, the LED arrangement setting unit 44a and the arrangement adjustment unit 44b have the final arrangement of the LED chips mounted on each mounting point Mp of the first mounting area Mr1 and the LED chips mounted on each mounting point Mp of the second mounting area Mr2. Set the final placement of each.

In this case, the LED arrangement setting unit 44a sets the arrangement of the LED chips for the first mounting area Mr1 based on, for example, the reel information J1 (reels Re1 to Re5) shown in FIG. 5, and the LED arrangement setting unit 44a sets the arrangement of the LED chips for the second mounting area Mr2. For example, the arrangement of the LED chips is set based on the reel information J2 (reels Re6 to Re10) as shown in FIG. That is, as shown in FIGS. 5 and 18, the reels Re1 to Re5 of the reel information J1 and the reels Re6 to Re10 of the reel information J2 are different reels from each other.

FIG. 19 is a schematic diagram of the substrate P showing the final arrangement of the LED chips set by the arrangement adjustment unit 44b in the process of step S9. Note that FIG. 19 shows an example in which the left half (+ X side) of the substrate P is the first mounting area Mr1 and the right half (-X side) is the second mounting area Mr2. For example, as shown in FIG. The lower half (+ Y side) of the substrate P may be used as the first mounting area Mr1 and the upper half (−Y side) may be used as the second mounting area Mr2.

In the process of step S11, in the feeder arrangement setting unit 44c, the reels Re1 to Re5 in which the LED chips to be mounted in the first mounting area Mr1 are housed are mounted in the first component supply unit 14A and the LED chips in the second mounting area Mr2. The arrangement of the reels Re1 to Re10 is set so that the reels Re6 to Re10 in which the reels are housed are arranged in the second component supply unit 14B. Further, the feeder arrangement setting unit 44c sets the arrangement of the reels Re1 to Re5 in the first component supply unit 14A so as to satisfy the first arrangement condition and the second arrangement condition, and also sets the arrangement of the reels Re1 to Re5 and the second component supply unit. The arrangement of the reels Re6 to Re10 in 14B is set.

In the component mounting system 1 of the second embodiment, as described above, the component mounting device 2 includes the first and

second head units

16A and 16B that operate independently, and the first and

second head units

16A, 16B cooperates to mount the LED chip on the substrate P.

Then, by the management device 4 (NC data generation unit 44), as described above, for each of the first mounting area Mr1 in charge of the first head unit 16A and the second mounting area Mr2 in charge of the second head unit 16B. , The NC program is created based on the same creation process as in the first embodiment. That is, the arrangement of the LED chips mounted on each mounting point Mp of the first mounting area Mr1, the arrangement of the reels Re1 to Re5, the arrangement of the LED chips mounted on each mounting point Mp of the second mounting area Mr2, and the reel Re6. NC data is created with the arrangement of Re10.

Therefore, according to the component mounting system 1 of the second embodiment, it is possible to efficiently produce an LED mounting board that is less likely to cause uneven brightness in the component mounting device 2 provided with the two

head units

16A and 16B.

As the LED chip mounting board, for example, each of the first mounting region Mr1 and the second mounting region Mr2 is provided with a resistor for brightness adjustment, and the resistor limits the current flowing through the LED chip. It is conceivable that the mounting area Mr1 and the second mounting area Mr2 are configured to balance the brightness. In this case, the NC data generation unit 44 is provided with a resistance value setting function (resistance value setting unit), and the resistance values of the resistors to be mounted in the first mounting area Mr1 and the second mounting area Mr2 are set in the above-mentioned creation process. It may be set at the same time. That is, the NC data may include the resistance value of the resistor corresponding to the first mounting area Mr1 and the second mounting area Mr2.

Specifically, the resistance value setting unit calculates the average brightness LB of the LED chip mounted in the first mounting area Mr1 based on the reel information J1, and also calculates the average brightness of the LED chip mounted in the second mounting area _Mr2 . _LB is calculated based on the reel information J2. Then, the resistance value setting unit of the resistor to be mounted in the first mounting region Mr1 is based on the default resistance value information J3 in which the average brightness _LB and the resistance value of the resistor are linked as shown in FIG. Along with setting the resistance value, the resistance value of the resistor to be mounted in the second mounting region Mr2 is set. The resistance value information J3 is information that defines the relationship between the average brightness _LB of the LED chip and the resistance value required to make the average brightness _LB a predetermined target brightness.

When the production of the LED mounting substrate as shown in FIG. 19 or FIG. 20 is executed based on such NC data, the brightness balance between the first mounting region Mr1 and the second mounting region Mr2 should be highly ensured. Is possible. Therefore, it is possible to produce an LED mounting board that is less likely to cause uneven brightness.

The resistance value setting process by the resistance value setting unit as described above is executed after the process of step S9 of the NC data creation process shown in FIG. In this example, the resistance value setting process by the resistance value setting unit corresponds to the “resistance value setting step” of the present invention.

[Variations, etc.]
The component mounting system 1 of the first and second embodiments is an example of a preferred embodiment of the component mounting system according to the present invention (a component mounting system to which the NC data generation method and the NC data generation device of the present invention are applied). Therefore, the specific configuration and the specific NC data generation method can be appropriately changed without departing from the gist of the present invention. For example, the following configurations and methods can be adopted.

(1) In the example shown in FIG. 6, in the LED arrangement setting unit 44a, the LED chips of reels Re1 to Re5 are repeatedly arranged twice in ascending order from X1 to X10 for each row, and each reel Re1 between rows is repeated. The LED chips to be mounted at each mounting point Mp are set so that the positions of the LED chips of Re5 are regularly offset in the column direction by two mounting points. However, this is an example of the initial placement of the LED chips. The initial arrangement method may be a method other than the embodiment as long as the LED chips of the same reel 15a can be arranged so as not to be adjacent to each other in any of the vertical direction, the horizontal direction, and the diagonal direction. An appropriate method can be selected according to the number of mounting points Mp and the number of types of LED chips distinguished by brightness.

(2) In the second embodiment, the LED chip mounted on the first mounting area Mr1 and the LED chip mounted on each mounting point Mp of the second mounting area Mr2 are different from each other, but are the same LED chip. You may. That is, the LED chips mounted in both the first mounting area Mr1 and the second mounting area Mr2 may be set based on the reel information J1 (or reel information J2). In this case, even between the LED chip mounted in the first mounting area Mr1 and the LED chip mounted in the second mounting area Mr2, the LED chips of the same reel 15a are in the vertical direction, the horizontal direction, and the diagonal direction. Set the arrangement of the LED chips so that they are not adjacent to each other in either direction.

(3) In the second embodiment, NC data is created when producing an LED chip mounting substrate in which a resistor for brightness adjustment is provided in each of the first mounting region Mr1 and the second mounting region Mr2, that is, the resistance. The resistance value setting process by the value setting unit was mentioned. Such a resistance value setting process by the resistance value setting unit can also be applied to the first embodiment. That is, for example, in the substrate P shown in FIG. 7, when a resistor for brightness adjustment is provided corresponding to each of the unit regions Ar1 to Ar5, the resistance value setting unit is used as in the second embodiment. By executing the resistance value setting process, the resistance value of the resistor belonging to each of the unit regions Ar1 to Ar5 may be set.

The present invention described above can be summarized as follows.

The NC data generation method according to one aspect of the present invention includes a plurality of tape feeders that each supply the same type of LED chip, and at least one mounting head that takes out the LED chips from the plurality of tape feeders and mounts them on a substrate. It is a method of generating NC data for manufacturing an LED mounting board in which a plurality of the same type of LED chips are mounted in a grid pattern by a component mounting device provided with the above, and a plurality of LEDs provided on the board in a grid pattern. An LED arrangement setting step in which the LED chips to be mounted on each of the mounting points are associated with the reel loaded in the tape feeder, and an area setting step in which a plurality of unit areas including a plurality of mounting points are set on the board. , A brightness calculation step for obtaining the average brightness of the LED chips mounted in the unit region for each of the plurality of unit regions based on the known information regarding the brightness of the LED chip, and the average brightness of the LED chips in each unit region are defaulted. It is determined whether or not it is within the range, and if there is a unit area outside the default range, at least one of the LED chips mounted in the outside the default range is set so that the average brightness falls within the default range. By changing, the LED arrangement adjusting step of finally determining the LED chip to be mounted on each of the plurality of mounting points provided in the grid pattern is included, and the LED arrangement setting step is supplied from the same reel. In the arrangement adjustment step, the LED chips are set to be mounted at each of the plurality of mounting points provided in the grid pattern so that the LED chips are not adjacent to each of the row direction, the column direction, and the diagonal direction. At least one of the plurality of LED chips mounted in the out-of-predetermined range is changed to an LED chip supplied by a reel different from the reel that supplies the LED chip.

According to this method, it is possible to generate NC data capable of producing an LED mounting board capable of suppressing the occurrence of uneven brightness to a higher degree. That is, in the above method, the arrangement of the LED chips is set so that the LED chips supplied from the same reel are not adjacent to each other in the row direction, the column direction, and the diagonal direction. Then, for each unit area, it is determined whether or not the average brightness of the LED chip is within the predetermined range, and if there is an area outside the default range, the average brightness is within the default range. At least one of the LED chips mounted in the out-of-predetermined area is changed to an LED chip supplied by a reel different from the reel that supplies the LED chip. As a result, the LED chip to be mounted on each of the plurality of mounting points provided in the grid pattern is finally determined. That is, even if the brightness of the LED chips of some of the plurality of reels is close to each other, the final arrangement of the LED chips is set so that the average brightness of the LED chips for each unit area falls within the predetermined range. Therefore, uneven brightness is less likely to occur due to the LED mounting substrate.

Therefore, according to the LED mounting board produced based on the NC data generated by this method, the LED chips supplied by the same reel are adjacent to each other in the row direction (vertical direction), the column direction (horizontal direction), and the diagonal direction. The occurrence of uneven brightness is suppressed to a higher degree than that of the LED mounting substrate which is simply arranged so as not to be arranged.

In this case, in the arrangement adjustment step, the changed LED chip and the LED chips adjacent to the LED chip in the row direction, the column direction, and the diagonal direction are LED chips supplied by different reels. As such, it is preferable to modify at least one of the plurality of LED chips mounted in the out-of-predetermined area.

According to the NC data created by this method, it is difficult for the changed LED chip and the LED chip adjacent to it to have the same brightness. Therefore, it is possible to suppress the occurrence of uneven brightness of the LED mounting board to a higher degree.

In each of the above methods, the component mounting apparatus includes a first head unit and a second head unit that each include the mounting head and moves individually, and the first head is provided with respect to a predetermined first mounting area of the board. When the component is mounted by the unit and the component is mounted by the second head unit in the second mounting area that does not overlap with the first mounting area, the first mounting area and the second mounting area are used. By executing each of the LED arrangement setting step, the area setting step, the brightness calculation step, and the arrangement adjustment step, the LEDs to be mounted on each of the plurality of mounting points provided in the grid pattern are mounted. It is preferable to set the chip.

According to this method, NC data of a component mounting device of a type in which two head units cooperate to mount components on a board, and an LED mounting board capable of suppressing the occurrence of uneven brightness to a higher degree is produced. It becomes possible to generate possible NC data.

In this case, the LED chip mounted at the mounting point belonging to the first mounting area and the LED chip mounted at the mounting point belonging to the second mounting area are LED chips supplied by different reels. The LED chips to be mounted may be set at each of the plurality of mounting points provided in the grid pattern.

According to this method, it is possible to generate NC data capable of producing an LED mounting board that can effectively suppress the occurrence of uneven brightness.

In this case, when the LED mounting board is provided with a resistor for brightness adjustment in each of the first mounting area and the second mounting area, the NC data generation method is the brightness of the LED chip. Based on the known information regarding the above and the final information finally set through the arrangement adjustment step, which is the information set for the LED chips to be mounted on each of the plurality of mounting points provided in the grid pattern. It is preferable that the resistance value setting step of setting the resistance value of the resistor corresponding to each of the first mounting region and the second mounting region is further included.

According to this method, it is possible to generate NC data capable of producing an LED mounting board with little variation in brightness between the first mounting area and the second mounting area.

In each of the above methods, the component mounting apparatus is arranged with a movable head unit having a plurality of mounting heads arranged in a row at regular intervals, and at regular intervals along the arrangement direction of the plurality of mounting heads. The NC data generation method includes information on setting LED chips to be mounted on each of the plurality of mounting points provided in a grid pattern, and performs the arrangement adjustment step. Further, a feeder arrangement setting step of setting the arrangement of the plurality of tape feeders in association with the reel is included based on the final information finally determined through the process, and in the feeder arrangement setting step, in the final information, in the column direction. The arrangement of the plurality of tape feeders may be set in a combination of a plurality of LED chips arranged side by side in an arrangement corresponding to a combination that can be simultaneously taken out by the plurality of mounting heads.

According to this method, it is possible to generate NC data that can be efficiently mounted on a board while simultaneously taking out LED chips supplied from a plurality of tape feeders (reels) by a plurality of mounting heads.

In this case, the combination that can be taken out simultaneously by the plurality of mounting heads may be a combination of LED chips that are continuously arranged in the column direction and may be the combination that appears most frequently in the final information. Further, in the combination that can be taken out simultaneously by the plurality of mounting heads, the amount of movement of the head unit in the column direction with respect to the board when the LED chips taken out by the plurality of mounting heads at the same time is mounted on the board is as small as possible. May be a combination of

According to these methods, it is possible to generate NC data that can efficiently mount LED chips taken out by a plurality of mounting heads at the mounting points of the board.

On the other hand, in the NC data generation device according to one aspect of the present invention, a plurality of tape feeders for supplying the same type of LED chips, and at least one mounting in which the LED chips are taken out from the plurality of tape feeders and mounted on a substrate. It is a device for generating NC data for manufacturing an LED mounting board in which a plurality of the same type of LED chips are mounted in a grid pattern by a component mounting device provided with a head, and is provided on the board in a grid pattern. An LED arrangement setting unit for setting LED chips to be mounted on each of the plurality of mounting points in association with a reel loaded in the tape feeder, and an area for setting a plurality of unit areas including a plurality of mounting points on the board. A brightness calculation unit for obtaining the average brightness of the LED chips mounted in the unit region for each of the plurality of unit regions based on the setting unit and known information regarding the brightness of the LED chip, and an average of the LED chips in each unit region. It is determined whether or not the brightness is within the default range, and if there is a unit area outside the default range, at least one of the LED chips mounted in the outside the default range has the average brightness within the default range. The LED arrangement setting unit includes an arrangement adjustment unit that finally determines the LED chip to be mounted on each of the plurality of mounting points provided in the grid pattern by changing the LED arrangement setting unit from the same reel. The LED chips to be mounted are set at each of the plurality of mounting points provided in the grid pattern so that the supplied LED chips are not adjacent to each of the row direction, the column direction, and the diagonal direction, and the arrangement is performed. The adjusting unit changes at least one of the plurality of LED chips mounted in the out-of-predetermined range to an LED chip supplied by a reel different from the reel that supplies the LED chip.

According to this configuration, according to the process of the NC data generation method described above, it is possible to generate NC data capable of producing an LED mounting board capable of suppressing the occurrence of luminance unevenness to a higher degree.

Further, in the component mounting system according to one aspect of the present invention, the NC data generation device generates the NC data generation device and the LED mounting board on which a plurality of LED chips of the same type are mounted in a grid pattern. It includes a component mounting device that is produced based on data.

According to this configuration, one component mounting system can generate NC data as described above and produce an LED mounting board using the NC data, that is, an LED capable of suppressing the occurrence of uneven brightness to a higher degree. It will be possible to produce mounting boards.

Claims

A plurality of the same type are provided by a component mounting device including a plurality of tape feeders for supplying the same type of LED chips, and at least one mounting head for taking out the LED chips from the plurality of tape feeders and mounting them on a substrate. It is a method of generating NC data for manufacturing an LED mounting board in which the LED chips of the above are mounted in a grid pattern.
An LED arrangement setting step of setting LED chips to be mounted on each of a plurality of mounting points provided in a grid pattern on a substrate in association with a reel loaded in the tape feeder.
An area setting process for setting multiple unit areas, each including multiple mounting points, on the board,
A brightness calculation step for obtaining the average brightness of the LED chips mounted in the unit region for each of the plurality of unit regions based on the known information regarding the brightness of the LED chip.
It is determined whether or not the average brightness of the LED chips in each unit area is within the predetermined range, and if there is a unit area outside the predetermined range, at least one of the LED chips to be mounted in the outside the predetermined range is used. The arrangement-adjusting step of finally determining the LED chip to be mounted on each of the plurality of mounting points provided in the grid pattern by changing the average brightness so as to be within the predetermined range is included.
In the LED arrangement setting step, the LED chips supplied from the same reel are attached to each of the plurality of mounting points provided in the grid pattern so as not to be adjacent to each of the row direction, the column direction, and the diagonal direction. Set the LED chip to be mounted and
In the arrangement adjustment step, an NC data generation method in which at least one of a plurality of LED chips mounted in an area outside the predetermined range is changed to an LED chip supplied by a reel different from the reel that supplies the LED chip.
In the NC data generation method according to claim 1,
In the arrangement adjustment step, the changed LED chip and the LED chip adjacent to the LED chip in the row direction, the column direction, and the diagonal direction are LED chips supplied by different reels. An NC data generation method that modifies at least one of a plurality of LED chips mounted in the out-of-predetermined area.
In the NC data generation method according to claim 1 or 2.
The component mounting device includes a first head unit and a second head unit that each include the mounting head and moves individually, and mounts components on a predetermined first mounting area of the board by the first head unit. At the same time, the component is mounted by the second head unit in the second mounting area that does not overlap with the first mounting area.
Each of the first mounting area and the second mounting area is provided in a grid pattern by executing each process of the LED arrangement setting step, the area setting step, the brightness calculation step, and the arrangement adjustment step. An NC data generation method for setting an LED chip to be mounted on each of a plurality of mounting points.
In the NC data generation method according to claim 3,
The LED chip mounted at the mounting point belonging to the first mounting region and the LED chip mounted at the mounting point belonging to the second mounting region are arranged in a grid pattern so as to be an LED chip supplied by different reels. NC data generation method for setting LED chips to be mounted on each of a plurality of mounting points provided in.
In the NC data generation method according to claim 3 or 4.
The LED mounting board is provided with resistors for brightness adjustment in each of the first mounting area and the second mounting area.
The NC data generation method is information on the known information regarding the brightness of the LED chip and information on setting the LED chip to be mounted on each of the plurality of mounting points provided in the grid pattern, and is finally finalized through the arrangement adjustment step. An NC data generation method further comprising a resistance value setting step of setting a resistance value of a resistor corresponding to each of the first mounting area and the second mounting area based on the final information set in.
In the NC data generation method according to any one of claims 1 to 5.
The component mounting device includes a movable head unit having a plurality of mounting heads arranged in a row at regular intervals, and a plurality of tape feeders arranged at regular intervals along the arrangement direction of the plurality of mounting heads. To be equipped with
The NC data generation method is information on setting LED chips to be mounted on each of the plurality of mounting points provided in a grid pattern, and is based on the final information finally determined through the arrangement adjustment step. Further includes a feeder arrangement setting step of setting the arrangement of the tape feeder in association with the reel.
In the feeder arrangement setting step, in the final information, the arrangement of the plurality of tape feeders is set in an arrangement corresponding to a combination of a plurality of LED chips arranged in a row direction and which can be simultaneously taken out by the plurality of mounting heads. NC data generation method.
In the NC data generation method according to claim 6,
The combination that can be taken out simultaneously by the plurality of mounting heads is a combination of LED chips that are continuously arranged in the column direction and is the most frequently appearing combination in the final information. NC data generation method.
In the NC data generation method according to claim 6,
The combination that can be taken out simultaneously by the plurality of mounting heads is a combination in which the amount of movement of the head unit in the column direction with respect to the board when the LED chips taken out by the plurality of mounting heads at the same time is mounted on the board is as small as possible. NC data generation method.
A plurality of the same type are provided by a component mounting device including a plurality of tape feeders for supplying the same type of LED chips, and at least one mounting head for taking out the LED chips from the plurality of tape feeders and mounting them on a substrate. This is a device that generates NC data for manufacturing an LED mounting board on which the LED chips of the above are mounted in a grid pattern.
An LED arrangement setting unit that sets LED chips to be mounted on each of a plurality of mounting points provided in a grid pattern on a board in association with a reel loaded in the tape feeder.
An area setting unit that sets multiple unit areas, each containing multiple mounting points, on the board,
A brightness calculation unit for obtaining the average brightness of the LED chips mounted in the unit region for each of the plurality of unit regions based on the known information regarding the brightness of the LED chip.
It is determined whether or not the average brightness of the LED chips in each unit area is within the predetermined range, and if there is a unit area outside the predetermined range, at least one of the LED chips to be mounted in the outside the predetermined range is used. It includes an arrangement adjusting unit that finally determines the LED chip to be mounted on each of the plurality of mounting points provided in the grid pattern by changing the average brightness so as to be within the predetermined range.
The LED arrangement setting unit is provided at each of the plurality of mounting points provided in a grid pattern so that the LED chips supplied from the same reel are not adjacent to each other in any of the row direction, the column direction, and the diagonal direction. Set the LED chip to be mounted and
The arrangement adjustment unit is an NC data generation device that changes at least one of a plurality of LED chips mounted in the out-of-predetermined range to an LED chip supplied by a reel different from the reel that supplies the LED chip.
The NC data generator according to claim 9 and
A component mounting system including a component mounting device that produces an LED mounting board on which a plurality of LED chips of the same type are mounted in a grid pattern based on NC data generated by the NC data generating device.