JPH0131697B2 - - Google Patents

Info

Publication number
JPH0131697B2
JPH0131697B2 JP57197765A JP19776582A JPH0131697B2 JP H0131697 B2 JPH0131697 B2 JP H0131697B2 JP 57197765 A JP57197765 A JP 57197765A JP 19776582 A JP19776582 A JP 19776582A JP H0131697 B2 JPH0131697 B2 JP H0131697B2
Authority
JP
Japan
Prior art keywords
thin plate
silicon carbide
ceramic
layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57197765A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5988851A (ja
Inventor
Akira Enomoto
Hidetoshi Yamauchi
Shoji Tanigawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP57197765A priority Critical patent/JPS5988851A/ja
Publication of JPS5988851A publication Critical patent/JPS5988851A/ja
Publication of JPH0131697B2 publication Critical patent/JPH0131697B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
JP57197765A 1982-11-12 1982-11-12 電子回路用炭化珪素質基板の製造方法 Granted JPS5988851A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57197765A JPS5988851A (ja) 1982-11-12 1982-11-12 電子回路用炭化珪素質基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57197765A JPS5988851A (ja) 1982-11-12 1982-11-12 電子回路用炭化珪素質基板の製造方法

Publications (2)

Publication Number Publication Date
JPS5988851A JPS5988851A (ja) 1984-05-22
JPH0131697B2 true JPH0131697B2 (enrdf_load_stackoverflow) 1989-06-27

Family

ID=16379975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57197765A Granted JPS5988851A (ja) 1982-11-12 1982-11-12 電子回路用炭化珪素質基板の製造方法

Country Status (1)

Country Link
JP (1) JPS5988851A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4080030B2 (ja) 1996-06-14 2008-04-23 住友電気工業株式会社 半導体基板材料、半導体基板、半導体装置、及びその製造方法
JP3920555B2 (ja) 2000-10-27 2007-05-30 株式会社山武 接合剤および接合方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5594975A (en) * 1979-01-16 1980-07-18 Asahi Glass Co Ltd Low expansion powder composition for bonding use
JPS5742580A (en) * 1980-08-27 1982-03-10 Asahi Glass Co Ltd Ceramic bonding composition and bonding method therefor
JPS57117261A (en) * 1981-01-14 1982-07-21 Kyocera Corp Package for semicondutor device

Also Published As

Publication number Publication date
JPS5988851A (ja) 1984-05-22

Similar Documents

Publication Publication Date Title
JP2952303B2 (ja) 複合型回路装置
US4821151A (en) Hermetically sealed package
US4664946A (en) Silicon carbide substrates and a method of producing the same
JPH08180731A (ja) 導電性厚膜組成物、厚膜電極、セラミック電子部品、および積層セラミックコンデンサ
JPH1075060A (ja) 多層ガラス・セラミック基板の製造方法
JP3754748B2 (ja) スルーホール充填用導体ペースト、セラミック回路基板及びパッケージ基板
JPH01252548A (ja) ガラスセラミックス組成物
JPH0131697B2 (enrdf_load_stackoverflow)
JPH0131698B2 (enrdf_load_stackoverflow)
JPS6410100B2 (enrdf_load_stackoverflow)
JP2019123637A (ja) 接合材
JP2764990B2 (ja) 複合型回路装置及び接合用ペースト
JPH07326835A (ja) 低温焼成セラミック回路基板
JPS6312371B2 (enrdf_load_stackoverflow)
JP2001284754A (ja) ガラスセラミック回路基板
JPH0753625B2 (ja) セラミック用メタライズ組成物
JPH0221668B2 (enrdf_load_stackoverflow)
JP2591206B2 (ja) サーミスタ
JP2000044332A (ja) 配線基板用ガラスセラミック組成物および半導体素子収納用パッケージ
JPH0316220Y2 (enrdf_load_stackoverflow)
JPH0219988B2 (enrdf_load_stackoverflow)
JPS58176187A (ja) 炭化珪素質基板およびその製造方法
JP2590558B2 (ja) 放熱性のすぐれた半導体装置用基板
JPH11135899A (ja) セラミック回路基板
JP3652184B2 (ja) 導体ペースト、ガラスセラミック配線基板並びにその製法