JPH01316674A - Connector - Google Patents
ConnectorInfo
- Publication number
- JPH01316674A JPH01316674A JP63148099A JP14809988A JPH01316674A JP H01316674 A JPH01316674 A JP H01316674A JP 63148099 A JP63148099 A JP 63148099A JP 14809988 A JP14809988 A JP 14809988A JP H01316674 A JPH01316674 A JP H01316674A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- substrate
- semiconductor device
- magnetic
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 13
- 229910052742 iron Inorganic materials 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract 7
- 235000014676 Phragmites communis Nutrition 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000000696 magnetic material Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、面付実装された状態の半導体装置のリードビ
ンに対して外部より直接信号の入出力を可能とするに関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to making it possible to directly input and output signals from the outside to a lead bin of a surface-mounted semiconductor device.
従来のこの種の技術について開示されている例としては
、実開昭６０−７６０４１号公報がある。A conventional example of this type of technology disclosed is Japanese Utility Model Application Publication No. 60-76041.
上記公報においては、半導体装置のソケット構造につい
て明かにされていた。The above publication discloses the socket structure of a semiconductor device.
一般に、実装状態の半導体装置に対して外部より別系統
で信号の入出力を行なう場合、信号線自体を実装状態の
半導体装置に対して直接半田付けすることによって行な
っていた。Generally, when inputting and outputting signals from the outside to a mounted semiconductor device using a separate system, the signal line itself is directly soldered to the mounted semiconductor device.
ところが、上記技術においては、外部信号系統の接続・
開放が容易ではなく、たとえば実装状態の複数の半導体
装置に対して選択的に別系統のシステムより作動を制御
すること等は困難であった。However, with the above technology, it is difficult to connect the external signal system.
It is not easy to open the system, and it is difficult, for example, to selectively control the operation of a plurality of mounted semiconductor devices from a separate system.
この点から、信号線の一端に特殊仕様のソケットを形成
し、このソケットを介して別系統からの信号の入出力を
実現することも考えられる。From this point of view, it is also conceivable to form a specially designed socket at one end of the signal line and realize input/output of signals from another system via this socket.
しかし、かかる技術によっても、ソケットを半導体装置
に対して半田等で固定するため、汎用性に乏しかった。However, even with this technique, the socket is fixed to the semiconductor device with solder or the like, so it lacks versatility.
本発明は、上記課題に着目してなされたものであり、そ
の目的は、実装状態の半導体装置に対して、外部信号系
統の接続・開放が極めて容易な汎用性の高い接続技術を
提供することにある。The present invention has been made in view of the above-mentioned problems, and its purpose is to provide a highly versatile connection technology that makes it extremely easy to connect and disconnect an external signal system to a semiconductor device in a mounted state. It is in.
本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述および添付図面から明らかになるであろう
。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.
本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、概ね次の通りである。A brief overview of typical inventions disclosed in this application is as follows.
すなわち、実装基板上に設けられた磁性体部に対応して
、これと相互に吸引される磁性体部を備えたコネクタ構
造とするものである。That is, the connector structure is provided with a magnetic body part that is attracted to a magnetic body part provided on the mounting board and is mutually attracted to the magnetic body part.
上記した手段によれば、両磁性体部の磁力による吸引作
用によりコネクタが装着・保持されるため、実装状態の
半導体装置に対して信号系統の接続・開放が極めて容易
となる。According to the above-described means, since the connector is attached and held by the attraction effect of the magnetic force of both magnetic body parts, it becomes extremely easy to connect and disconnect the signal system to the mounted semiconductor device.
第１図は本発明の一実施例であるコネクタの吸着面を示
す説明図、第２図はこれに対応する実装基板を示す説明
図、第３図は実装基板上にコネクタを装着した状態を示
す断面図である。Fig. 1 is an explanatory diagram showing a suction surface of a connector which is an embodiment of the present invention, Fig. 2 is an explanatory diagram showing a corresponding mounting board, and Fig. 3 is an explanatory diagram showing a state in which the connector is mounted on a mounting board. FIG.
本実施例において、第３図に示す半導体装置１は、たと
えばエミュレータとして機能するマイクロプロセッサで
あり、実装基板２上に面付状態で装着されるものである
。In this embodiment, the semiconductor device 1 shown in FIG. 3 is, for example, a microprocessor that functions as an emulator, and is mounted on a mounting board 2 in a surface-mounted state.
上記実装基板２は、たとえばガラスエポキシ樹脂等から
なるシート状の単層基板を多数枚積層して得られる積層
プリント配線基板であり、その主面には銅箔を所定形状
にエツチングして得られる電極４ａが形成されており、
該電極４ａ上にはこれに対応したフラットパッケージ形
状の半導体装置１のリードピン５が半田によって固定さ
れている。The mounting board 2 is a laminated printed wiring board obtained by laminating a large number of sheet-like single-layer boards made of, for example, glass epoxy resin, and the main surface thereof is obtained by etching copper foil into a predetermined shape. An electrode 4a is formed,
Lead pins 5 of a corresponding flat package-shaped semiconductor device 1 are fixed onto the electrodes 4a by solder.
上記実装基板２上において、半導体装置１のパッケージ
本体６に対応する範囲には、四角湿状の凹ｔｉ７ａが設
けられており、該凹部７ａには磁性体としての鉄片８が
はめ込まれている。On the mounting board 2, a rectangular recess ti7a is provided in an area corresponding to the package body 6 of the semiconductor device 1, and an iron piece 8 as a magnetic material is fitted into the recess 7a.
一方、コネクタ３は、プラスチック等の合成樹脂をモー
ルドして形成されたコネクタ本体１０を有しており、該
コネクタ本体１０には複数の信号線束からなるケーブル
１１の一端が装着されている。On the other hand, the connector 3 has a connector main body 10 formed by molding synthetic resin such as plastic, and one end of a cable 11 consisting of a plurality of signal wire bundles is attached to the connector main body 10.
コネクタ３の吸着面は、第１図に示されるように、実装
基板２に対応した構成となっており、四方向に延設され
た電極４ｂ群と、この電極４ｂ群の中央に設けられた凹
部７ｂにはめ込まれた磁石片１２とで構成されている。As shown in FIG. 1, the suction surface of the connector 3 has a structure corresponding to the mounting board 2, and includes a group of electrodes 4b extending in four directions, and a group of electrodes 4b provided at the center of the group of electrodes 4b. The magnet piece 12 is fitted into the recess 7b.
実装基板２上に装着された半導体装置１に対してコネク
タ３を装着した状態を示したのが第３図であり、半導体
装置ｌのパッケージ本体６を介して、コネクタ３の磁石
片１２と実装基板２の鉄片８とが磁力吸引作用によって
吸引され、コネクタ３の各電極４ｂとこれに対応する実
装基板２の電極４ａとがリードビン５を介して接触・導
通状態を保持されている。FIG. 3 shows a state in which the connector 3 is attached to the semiconductor device 1 attached to the mounting board 2, and the connector 3 is connected to the magnet piece 12 of the connector 3 via the package body 6 of the semiconductor device 1. The iron piece 8 of the board 2 is attracted by magnetic attraction, and each electrode 4b of the connector 3 and the corresponding electrode 4a of the mounting board 2 are kept in contact and conduction via the lead pin 5.
このように、本実施例によれば実装状態の半導体装置１
を実装基板２から取り外すことなく実装基板２面上にコ
ネクタ３を装着でき、半導体装置１に対して直接、外部
よりケーブル１１を通じて信号の入出力が可能となる。In this way, according to this embodiment, the semiconductor device 1 in the mounted state
The connector 3 can be mounted on the surface of the mounting board 2 without removing the semiconductor device 1 from the mounting board 2, and signals can be directly input and output from the outside through the cable 11 to the semiconductor device 1.
特に、実装基板２上のコネクタ３の保持が磁石片１２と
鉄片８との磁力吸引作用により実現されているため、コ
ネクタ３の着脱が極めて容易となり、信号系統の接続・
開放を極めて容易に実現できる。In particular, since the connector 3 on the mounting board 2 is held by the magnetic attraction between the magnet piece 12 and the iron piece 8, it is extremely easy to attach and detach the connector 3, and to connect and disconnect the signal system.
Opening can be achieved extremely easily.
以上本発明者によってなされた発明を実施例に基づき具
体的に説明したが、本発明は前記実施例に限定されるも
のではなく、その要旨を逸脱しない範囲で種々変更可能
であることはいうまでもない。Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.
たとえば、磁性体としては、磁石片１２と鉄片８との組
合せを用いた場合について説明したが、これに限らずコ
ネクタ３内に電磁石を内蔵し、電気的に磁力の吸着力を
制御するようにしてもよい。For example, although we have described the case where a combination of the magnet piece 12 and the iron piece 8 is used as the magnetic material, the present invention is not limited to this, and it is also possible to incorporate an electromagnet into the connector 3 and electrically control the attraction force of the magnetic force. You can.
以上の説明では主として本発明者によってなされた発明
をその利用分野である、いわゆるフラットパッケージ形
状の半導体装置に適用した場合について説明したが、こ
れに限定されるものではなく、たとえばＰＬＣＣ（プラ
スチック・リーデツド・チップ・キャリア）形状等のよ
うに他の面付実装形の半導体装置にも適用可能である。In the above explanation, the invention made by the present inventor was mainly applied to the field of application, which is a so-called flat package type semiconductor device, but the invention is not limited to this.・It is also applicable to other surface-mounted semiconductor devices such as chip carrier) shapes, etc.
本願において開示される発明のうち代表的なものによっ
て得られる効果を簡単に説明すれば、下記の通りである
。A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.
すなわち、実装基板上に設けられた磁性体部に対応して
、これと相互に吸引される磁性体部を備えたコネクタ構
造とすることによって、両磁性体部の磁力による吸引作
用によりコネクタが装着・保持されるため、実装状態の
半導体装置に対して信号系統の接続・開放が極めて容易
となる。In other words, by creating a connector structure that has a magnetic material part that is attracted to the magnetic material part provided on the mounting board, the connector is attached by the attraction effect of the magnetic force of both magnetic material parts. - Since it is held, it is extremely easy to connect and disconnect the signal system to the mounted semiconductor device.
第１図は本発明の一実施例であるコネクタの吸着面を示
す説明図、
第２図は上記コネクタに対応する実装基板を示す説明図
、
第３図は実施例における実装基板上にコネクタを装着し
た状態を示す断面図である。
１・・・半導体装置、２・・・実装基板、３・・・コネ
クタ、４ａ、４ｂ・・・電極、５・・・リードビン、６
・・・パッケージ本体、７ａ、７ｂ・・・凹部、８・・
・鉄片、１０・・・コネクタ本体、１１・・・ケーブル
、１２・・・磁石片。
メール
−へ
：２Ｉ
代理人 弁理士 小 川 勝 男・、−２′第１図
第２図
第３図Fig. 1 is an explanatory diagram showing a suction surface of a connector according to an embodiment of the present invention, Fig. 2 is an explanatory diagram showing a mounting board corresponding to the above-mentioned connector, and Fig. 3 is an explanatory diagram showing a mounting board corresponding to the connector in the embodiment. FIG. 3 is a cross-sectional view showing the installed state. DESCRIPTION OF SYMBOLS 1... Semiconductor device, 2... Mounting board, 3... Connector, 4a, 4b... Electrode, 5... Lead bin, 6
...Package body, 7a, 7b...Concavity, 8...
- Iron piece, 10... Connector body, 11... Cable, 12... Magnet piece. Email: 2I Agent Patent Attorney Katsuo Ogawa, -2' Figure 1 Figure 2 Figure 3
Claims (2)
または信号の入出力を外部より独立して行なうためのコ
ネクタであって、実装基板上に設けられた磁性体部に対
応して、これと相互に吸引される磁性体部を備え電子部
品の装着された実装基板上に対して磁力吸引作用により
保持されるコネクタ。1. A connector for independently inputting and outputting power supply voltage or signals from the outside to electronic components mounted on a mounting board. A connector that has magnetic parts that attract each other and is held by magnetic attraction on a mounting board on which electronic components are mounted.
実装形の半導体装置であることを特徴とする請求項１記
載のコネクタ。2. 2. The connector according to claim 1, wherein said electronic component is a surface-mounted semiconductor device mounted on a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63148099A JPH01316674A (en) | 1988-06-17 | 1988-06-17 | Connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63148099A JPH01316674A (en) | 1988-06-17 | 1988-06-17 | Connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01316674A true JPH01316674A (en) | 1989-12-21 |
Family
ID=15445225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63148099A Pending JPH01316674A (en) | 1988-06-17 | 1988-06-17 | Connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01316674A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0501358A2 (en) * | 1991-02-25 | 1992-09-02 | Canon Kabushiki Kaisha | Connecting method and apparatus for electric circuit components |
| JPH04263450A (en) * | 1991-02-18 | 1992-09-18 | Sharp Corp | Burn-in device and burn-in method using same |
| JPH04317899A (en) * | 1991-04-16 | 1992-11-09 | Nec Corp | Space umbilical connector |
| EP2317330A1 (en) | 2009-09-11 | 2011-05-04 | Giga-Byte Technology Co., Ltd. | Pin connector and chip test fixture having the same |
| US8187006B2 (en) | 2009-02-02 | 2012-05-29 | Apex Technologies, Inc | Flexible magnetic interconnects |
-
1988
- 1988-06-17 JP JP63148099A patent/JPH01316674A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04263450A (en) * | 1991-02-18 | 1992-09-18 | Sharp Corp | Burn-in device and burn-in method using same |
| EP0501358A2 (en) * | 1991-02-25 | 1992-09-02 | Canon Kabushiki Kaisha | Connecting method and apparatus for electric circuit components |
| US6015081A (en) * | 1991-02-25 | 2000-01-18 | Canon Kabushiki Kaisha | Electrical connections using deforming compression |
| JPH04317899A (en) * | 1991-04-16 | 1992-11-09 | Nec Corp | Space umbilical connector |
| US8187006B2 (en) | 2009-02-02 | 2012-05-29 | Apex Technologies, Inc | Flexible magnetic interconnects |
| EP2317330A1 (en) | 2009-09-11 | 2011-05-04 | Giga-Byte Technology Co., Ltd. | Pin connector and chip test fixture having the same |
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