JPH09219573A - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase exchange work efficiency of a semiconductor device and reduce the manufacturing cost of electronic devices by a method wherein conductive rubber capable of pulling into or out of an external lead of the semiconductor device is provided on the face of an electrode pad. SOLUTION: A plurality of electrode pads 2 are disposed on the mount face of a mounting board 1, and a conductive rubber 3 capable of pulling into or out of an external lead 10 of a semiconductor device 20 is provided on each face of the plurality of electrode pads 2. By inserting the external lead 10 of the semiconductor device 20 into the conductive rubber 3, the semiconductor device 20 can readily be mounted on the mount face of a mounted board 1, and further by removing the external lead 10 of the semiconductor device 20 inserted into the conductive rubber 3, the semiconductor device 20 can readily be removed from the mounted board 1. Therefore, when a fail is generated in the semiconductor device 20 after mounted, or when an attempt is made to carry out version up of the system, it is possible to increase the exchange work efficiency of the semiconductor device 20.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an electronic device,
In particular, the semiconductor device is mounted on the mounting surface of the mounting board by electrically and mechanically connecting the electrode pads arranged on the mounting surface of the mounting board and the external leads arranged outside the semiconductor device. The present invention relates to a technique effectively applied to an electronic device.

[0002]

2. Description of the Related Art As electronic devices, for example, there is an electronic device implementing the semiconductor device of the PGA (P in G rid A rray ) structure on the mounting surface of the mounting board. This electronic device is, for example,
Microelectronics Packaging Handbook published by Nikkei BP [Published March 21, 1991, No. 7
57 to 810], the semiconductor device having the PGA structure is mounted on the mounting surface of the mounting board via the mounting socket, and the electrode pad and the semiconductor arranged on the mounting surface of the mounting board. Electrically and mechanically connected to external leads arranged outside the device.

[0003]

In the electronic device, the semiconductor device is mounted on the mounting surface of the mounting board by the mounting method using the mounting socket. This mounting method allows the semiconductor device to be easily removed from the mounting board when a defect occurs in the semiconductor device after mounting or when the system version is to be upgraded. As compared with the mounting method in which the leads are fixed to each other with solder and the both are electrically and mechanically connected, the efficiency of the semiconductor device replacement work can be improved. However,
In the mounting method using the mounting socket, it is necessary to prepare various kinds of mounting sockets according to the type and outer size of the semiconductor device, and the manufacturing cost of the electronic device increases correspondingly.

An object of the present invention is to electrically and mechanically connect the electrode pads arranged on the mounting surface of the mounting substrate and the external leads arranged outside the semiconductor device, and Another object of the present invention is to provide a technique capable of increasing the efficiency of semiconductor device replacement work and reducing the manufacturing cost of the electronic device in the electronic device mounting the semiconductor device.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0006]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

Electrode pads arranged on the mounting surface of the mounting board are electrically and mechanically connected to external leads arranged outside the semiconductor device, and the semiconductor device is mounted on the mounting surface of the mounting board. In the electronic device, the conductive rubber is provided on the surface of the electrode pad so that external leads of the semiconductor device can be inserted and removed.

According to the above-mentioned means, the semiconductor device can be easily mounted on the mounting surface of the mounting board by inserting the external leads of the semiconductor device into the conductive rubber.
Furthermore, by pulling out the external leads of the semiconductor device inserted in the conductive rubber, the semiconductor device can be easily removed from the mounting board, so that the efficiency of semiconductor device replacement work can be improved. Further, since the semiconductor device can be mounted on the mounting surface of the mounting board without using the mounting socket, it is not necessary to prepare many kinds of mounting sockets according to the type and outer size of the semiconductor device. Therefore, the manufacturing cost of the electronic device can be reduced.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

In all the drawings for explaining the embodiments of the invention, components having the same function are designated by the same reference numeral, and the repeated description thereof will be omitted.

FIG. 1 is a sectional view of an essential part of an electronic device according to an embodiment of the present invention.

As shown in FIG. 1, the electronic device of the present embodiment mounts the semiconductor device 20 and another semiconductor device (not shown) on the mounting surface of the mounting substrate 1 to form one circuit system. ing.

The semiconductor device 20 has a PGA structure, for example. The semiconductor device 20 having this PGA structure is
The semiconductor chip 8 is mounted on the chip mounting surface of the base substrate 5, and a plurality of external leads 10 are arranged outside the back surface of the base substrate 5 facing the chip mounting surface of the base substrate 5.

The base substrate 5 is composed of, for example, a ceramic substrate having a multilayer wiring structure. A plurality of wirings 5A are arranged on the pellet tower mounting surface side of the base substrate 5, and a plurality of electrodes 5B are arranged on the back surface of the base substrate 5.
A plurality of external leads 10 arranged outside the back surface of the base substrate 5 are electrically and mechanically connected to the plurality of electrodes 5B, respectively.

The semiconductor chip 8 is composed of, for example, a single crystal silicon substrate. On the element formation surface of the semiconductor chip 8, for example, a logic circuit system, a mixed circuit system in which a logic circuit and a memory circuit are mixed, and the like are mounted.
Further, a plurality of external terminals (bonding pads) 8A are arranged on the element formation surface side of the semiconductor chip 8. Each of the plurality of external terminals 8A is electrically connected via a bonding wire 9 to each of the plurality of wirings 5A arranged on the chip tower mounting surface side of the base substrate 5.

The semiconductor chip 8 is hermetically sealed in a cavity formed by the base substrate 1, the frame 6 and the lid member 7. The frame 6 is made of, for example, ceramics and is fixed to the base substrate 5 via an adhesive layer. The lid member 7 is made of, for example, ceramics and is fixed to the frame body 6 via an adhesive layer.

The mounting board 1 is composed of, for example, a resin board having a multilayer wiring structure. A plurality of electrode pads 2 are arranged on the mounting surface of the mounting substrate 1, and the plurality of electrode pads 2 are arranged.
The external leads 10 of the semiconductor device 20 are provided on the respective surfaces of the
A conductive rubber 3 is provided to allow the insertion and removal of the rubber. The conductive rubber 3 is made of an elastic rubber material such as Al,
It is composed of a conductive elastic body in which metal powder such as Cu or Fe or metal fiber is mixed. The conductive rubber 3 is formed, for example, by punching a rubber plate made of a conductive elastic body into a predetermined shape. In this case, the conductive rubber 3 is attached to the surface of the electrode pad 2 via a conductive adhesive layer.

The tips of the external leads 10 of the semiconductor device 20 are inserted into the conductive rubber 3 and are electrically and mechanically connected to the electrode pads 2. That is, the electronic device includes the electrode pads 2 arranged on the mounting surface of the mounting substrate 1 and the external leads 10 arranged outside the semiconductor device 20.
Are electrically and mechanically connected by the conductive rubber 3, and the semiconductor device 20 is mounted on the mounting surface of the mounting substrate 1.

Since the conductive rubber 3 allows the external leads 10 of the semiconductor device 20 to be inserted and removed, by inserting the external lead 10 of the semiconductor device 20 into the conductive rubber 3, the mounting surface of the mounting substrate 1 is mounted. The semiconductor device 20 can be easily mounted on the semiconductor device 20. Further, as shown in FIG. 2 (a cross-sectional view of an essential part showing a state in which the semiconductor device is removed from the mounting substrate), the semiconductor device 20 inserted in the conductive rubber 3 The semiconductor device 20 can be easily removed from the mounting substrate 1 by pulling out the external lead 10 of the above.

In this way, the electrode pads 2 arranged on the mounting surface of the mounting substrate 1 and the external leads 10 arranged outside the semiconductor device 20 are electrically and mechanically connected to each other, and the mounting substrate 1 is mounted. In the electronic device for mounting the semiconductor device 20 on the mounting surface of, the conductive rubber 3 is provided on the surface of the electrode pad 2 so that the external lead 10 of the semiconductor device 20 can be inserted and removed. By inserting the external lead 10 of the semiconductor device 20 into the elastic rubber 3,
The semiconductor device 20 can be easily mounted on the mounting surface of the mounting substrate 1, and the external lead 10 of the semiconductor device 20 inserted into the conductive rubber 3 is pulled out.
Since the semiconductor device 20 can be easily removed from the mounting board 1, it is possible to improve the efficiency of the replacement work of the semiconductor device 20 when a defect occurs in the mounted semiconductor device 20 or when the system is upgraded. it can. Further, since the semiconductor device 20 can be mounted on the mounting surface of the mounting substrate 1 without using the mounting socket,
It is not necessary to prepare many types of mounting sockets according to the type and external size of the semiconductor device 20, and the manufacturing cost of the electronic device can be reduced correspondingly.

The conductive rubber 3 may be formed on the surface of the electrode pad 2 by the potting method. In this case, a thermosetting material is used as the rubber material having elasticity.

Further, as shown in FIG. 3 (a cross-sectional view of an essential part), the conductive rubber 3 is provided by the frame body 4 provided on the mounting surface of the mounting substrate 1.
You may make it the structure surrounding the circumference | surroundings. In this case, since the thickness of the conductive rubber 3 can be increased, the semiconductor device 20
The holding force of the external lead 10 can be increased.

As described above, the invention made by the present inventor is
Although specifically described based on the embodiment, the present invention
It is needless to say that the present invention is not limited to the above embodiment, and various changes can be made without departing from the scope of the invention.

For example, according to the present invention, on the mounting surface of the mounting board.
, DIP (DualIn-linePackage) structure, SIP
(SingleIn-linePackage) structure, ZIP (Zigzag
In-linePackage) structure and so-called pin insertion type
It can be applied to electronic devices mounting semiconductor devices
You.

[0025]

The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.

Electrode pads arranged on the mounting surface of the mounting board are electrically and mechanically connected to external leads arranged outside the semiconductor device, and the semiconductor device is mounted on the mounting surface of the mounting board. In the electronic device, the efficiency of replacing the semiconductor device can be improved, and the manufacturing cost of the electronic device can be reduced.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of essential parts of an electronic device according to an embodiment of the present invention.

FIG. 2 is a main-portion cross-sectional view showing a state where a semiconductor device is removed from a mounting substrate.

FIG. 3 is a cross-sectional view of an essential part of an electronic device showing another example which is an embodiment of the present invention.

[Explanation of symbols]

1 ... Mounting substrate, 2 ... Electrode pad, 3 ... Conductive rubber, 4 ...
Frame, 5 ... Base substrate, 5A ... Wiring, 5B ... Electrode, 6 ...
Frame, 7 ... Lid member, 8 ... Semiconductor chip, 8A ... External terminal
(Bonding pad), 9 ... bonding wire, 10
... external leads, 20 ... semiconductor device.

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Tomohiro Shiraishi 2326 Imai, Ome-shi, Tokyo Inside the Hitachi, Ltd.Device Development Center (72) Inventor Minoru Kubozono 2326, Imai, Ome-shi, Tokyo Hitachi, Ltd. (72) Inventor Hiroshi Kuroda 2326 Imai, Ome-shi, Tokyo Inside the Device Development Center, Hitachi, Ltd. (72) Inventor Yoshiyuki Shirai 2326 Imai, Imai-shi, Tokyo Inside the Device Development Center, Hitachi, Ltd.

Claims (3)

[Claims] 1. An electrode pad arranged on the mounting surface of a mounting board is electrically and mechanically connected to an external lead arranged outside the semiconductor device, and the semiconductor device is mounted on the mounting surface of the mounting board. In the electronic device for mounting the electronic device, a conductive rubber is provided on the surface of the electrode pad, the conductive rubber being capable of inserting and removing external leads of the semiconductor device. 2. The electronic device according to claim 1, wherein the conductive rubber is surrounded by a frame body provided on a mounting surface of a mounting substrate. 3. The conductive rubber is composed of a conductive elastic body in which metal powder or metal fibers are mixed in a rubber material having elasticity.
The electronic device according to.