JPH01302728A - 樹脂封止型半導体装置の製造方法 - Google Patents
樹脂封止型半導体装置の製造方法Info
- Publication number
- JPH01302728A JPH01302728A JP8942189A JP8942189A JPH01302728A JP H01302728 A JPH01302728 A JP H01302728A JP 8942189 A JP8942189 A JP 8942189A JP 8942189 A JP8942189 A JP 8942189A JP H01302728 A JPH01302728 A JP H01302728A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- support plate
- coating
- resin coating
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims abstract description 88
- 239000011347 resin Substances 0.000 claims abstract description 88
- 239000011248 coating agent Substances 0.000 claims abstract description 46
- 238000000576 coating method Methods 0.000 claims abstract description 46
- 238000007789 sealing Methods 0.000 claims abstract description 27
- 238000002347 injection Methods 0.000 claims abstract description 20
- 239000007924 injection Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8942189A JPH01302728A (ja) | 1989-04-07 | 1989-04-07 | 樹脂封止型半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8942189A JPH01302728A (ja) | 1989-04-07 | 1989-04-07 | 樹脂封止型半導体装置の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59114018A Division JPS60257529A (ja) | 1984-06-04 | 1984-06-04 | 樹脂封止型半導体装置の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3124888A Division JPH065687B2 (ja) | 1991-04-26 | 1991-04-26 | 樹脂封止型半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01302728A true JPH01302728A (ja) | 1989-12-06 |
| JPH0432538B2 JPH0432538B2 (enrdf_load_stackoverflow) | 1992-05-29 |
Family
ID=13970195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8942189A Granted JPH01302728A (ja) | 1989-04-07 | 1989-04-07 | 樹脂封止型半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01302728A (enrdf_load_stackoverflow) |
-
1989
- 1989-04-07 JP JP8942189A patent/JPH01302728A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0432538B2 (enrdf_load_stackoverflow) | 1992-05-29 |
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