JPH0128945Y2 - - Google Patents
Info
- Publication number
- JPH0128945Y2 JPH0128945Y2 JP15361383U JP15361383U JPH0128945Y2 JP H0128945 Y2 JPH0128945 Y2 JP H0128945Y2 JP 15361383 U JP15361383 U JP 15361383U JP 15361383 U JP15361383 U JP 15361383U JP H0128945 Y2 JPH0128945 Y2 JP H0128945Y2
- Authority
- JP
- Japan
- Prior art keywords
- jet
- solder
- soldering
- spout
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 43
- 238000005476 soldering Methods 0.000 claims description 29
- 230000007246 mechanism Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 238000009736 wetting Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15361383U JPS6060153U (ja) | 1983-10-03 | 1983-10-03 | 噴流式ハンダ付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15361383U JPS6060153U (ja) | 1983-10-03 | 1983-10-03 | 噴流式ハンダ付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6060153U JPS6060153U (ja) | 1985-04-26 |
| JPH0128945Y2 true JPH0128945Y2 (cs) | 1989-09-04 |
Family
ID=30339808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15361383U Granted JPS6060153U (ja) | 1983-10-03 | 1983-10-03 | 噴流式ハンダ付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6060153U (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2549618B2 (ja) * | 1985-05-18 | 1996-10-30 | 株式会社東芝 | 噴流式半田付け装置 |
-
1983
- 1983-10-03 JP JP15361383U patent/JPS6060153U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6060153U (ja) | 1985-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0083680B1 (en) | Wavesoldering of chips | |
| JP5416290B2 (ja) | 噴流式ハンダノズルのためのハンダ戻し装置およびその使用方法 | |
| JP4253374B2 (ja) | プリント基板のはんだ付け方法および噴流はんだ槽 | |
| EP0278166B1 (en) | Soldering apparatus | |
| JPH0128945Y2 (cs) | ||
| JP4473566B2 (ja) | 噴流式はんだ付け装置 | |
| DE3713075C2 (cs) | ||
| JP2965470B2 (ja) | 噴流式はんだ付け装置 | |
| JP2021053703A (ja) | 局所はんだ付けノズル及び局所はんだ付け装置 | |
| JPS6222295Y2 (cs) | ||
| JPS6113156Y2 (cs) | ||
| JPS621238Y2 (cs) | ||
| JP2549618B2 (ja) | 噴流式半田付け装置 | |
| JPS63281768A (ja) | 噴流式はんだ付け装置 | |
| JPH0451022Y2 (cs) | ||
| JPS6039158Y2 (ja) | はんだノズル | |
| JPH0227971Y2 (cs) | ||
| JP3017533U (ja) | 噴流はんだ槽 | |
| JP2000246431A (ja) | 局所はんだ付け装置 | |
| JPS591500B2 (ja) | 噴流はんだ装置 | |
| JPS6051941B2 (ja) | 噴流式はんだ槽 | |
| JPS6261774A (ja) | 半田付け装置 | |
| JPS61205661U (cs) | ||
| JPS595390B2 (ja) | 半田槽 | |
| JPH021564U (cs) |