JPH01288782A - Probe card - Google Patents

Abstract

PURPOSE:To measure the electric characteristic of an integrated circuit in a stable state, by inserting a resistor into a bypass circuit element constructed of a capacitor. CONSTITUTION:This card is constructed of a probe 1 for measurement, a probe board 2 for fixing and supporting the probe, and a bypass circuit 10. The circuit 10 is constructed of a capacitor 11 and a resistor 12, which are connected in series with each other. One of two electric terminals of the circuit 10 is connected to the probe 1 and the other of them is grounded. The insertion of the resistor 12 lowers a value of sharpness of the resonance of a resonance circuit formed by the capacitor 11 and the inductance of the probe 1.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a measuring jig for measuring electrical characteristics of semiconductor devices, etc.
Regarding the probe card.

[Prior art]

The electrical characteristics of semiconductor devices such as integrated circuits are first measured in a wafer state. The electrical characteristics are measured by bringing a measuring probe fixed to a probe card into contact with a bonding pad, which is an external terminal of an integrated circuit formed on a semiconductor chip.

In the conventional probe card, a bypass capacitor is connected to the base of the measurement probe, that is, the end opposite to the end in contact with the bonding pad, and the other end of this capacitor is grounded. With this configuration, it is possible to reduce the impedance of a power supply line or the like of a power supply that is supplied to an integrated circuit or the like for measuring electrical characteristics, thereby stabilizing the measurement of electrical characteristics.

Furthermore, when measuring the direct current characteristics of integrated circuits and the like, capacitors are connected not only to the power supply line but also to the measurement probes that come into contact with the bonding pads of the signal lines, as described above.

Such a conventional configuration is shown in FIG. In Figure 6,
One end 1a of the measurement probe 1 is fixed to a probe card 2, and the other end 1b is brought into contact with a bonding pad 3a formed on a semiconductor substrate 3 during measurement. A conductor 2a is formed on the fixed portion of the measurement probe 1 of the probe card 2, and an end 5 of the conductor 2a is connected to an output terminal of an external power source (not shown). On the other hand, this conductor 2a
is connected to one end 4a of a capacitor 4, and the other end 4b of this capacitor 4 is grounded.

By grounding through the capacitor 4 in this way, the impedance of the power supply line etc. is reduced.

[Problem to be solved by the invention]

However, with the conventional method described above, when measuring the electrical characteristics of high-gain, high-bandwidth semiconductor devices, a resonant circuit is formed by the inductance of the measurement probe and the capacitance of the inserted capacitor, causing an oscillation phenomenon. Sometimes. As a result, accurate electrical characteristic measurements may not be possible.

In other words, the insertion of a bypass capacitor may have an adverse effect on the measurement of electrical characteristics. .

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and provide a probe card that can prevent such adverse effects and measure the electrical characteristics of integrated circuits and the like in a stable state.

[Means to solve the problem]

The probe card of the present invention includes an n1 regular probe and a bypass circuit, and the bypass circuit has a first terminal portion connected to the other end of the measurement probe, and a second terminal portion that is grounded. , a capacitor, and a resistor, and the capacitor and the resistor are connected in series.

[Effect]

In the blow card of the present invention, by inserting a resistor in series with a bypass circuit element consisting of a capacitor,
The value of the resonance sharpness Q of the resonant circuit formed by the capacitor connected to the measurement probe and the inductance of the measurement probe is reduced.

〔Example〕

Embodiments according to the present invention will be described below with reference to the drawings.

Elements with the same reference numerals have the same functions, so duplicate explanations will be omitted.

FIG. 1 shows a schematic configuration of a probe card according to the present invention. This probe card includes a measurement probe 1, a probe board 2 that fixedly supports the measurement probe 1, and a bypass circuit 10. The bypass circuit 10 is composed of a capacitor 11 and a resistor 12, and the capacitor 11 and the resistor 12 are connected in series with each other. Moreover, the bypass circuit 10 has two electrical terminals,
One of them is configured to be connected to the measurement probe 1, and the other is configured to be grounded. Here, this bypass circuit 10 is 1
For handling purposes, it is preferable to integrally configure the circuit element as one circuit element.

FIG. 2 shows an example in which the bypass circuit shown in FIG. 1 is integrally configured as a circuit element.

In FIG. 2, a resistor 7 and a capacitor 8 are connected in series, and the resistor 7 and capacitor 8 are integrally molded. And connection terminals 6a, 6b
extend outward from both ends of this integrated mold. By integrating in this way, there is no need to connect the resistor and the capacitor to each other, and a bypass circuit can be easily provided.

FIG. 3 shows another example of the bypass circuit element.

In the example shown in FIG. 3, the resistor 7 and the capacitor 8
are formed into a die cap type, and these are stacked on top of each other. Electrodes 9a and 9b are provided on the upper and lower surfaces of the laminate, and the entire structure is formed into a die cap type. With this configuration, a bypass circuit that is compact and easy to implement can be realized.

An example of a method for manufacturing the bypass circuit element shown in FIG. 3 will be described below.

First, a conductive layer is formed on the surface of an insulating substrate, such as a silicon substrate, by sputtering or the like. The type and thickness of this insulating substrate and the type and thickness of the conductive layer are selected depending on the required capacitance and resistance value.

Next, metal that will become electrodes is vapor-deposited on the top and bottom surfaces of this substrate. A photoresist is applied onto the deposited electrode, a rectangular electrode pattern is formed by photolithography, and the electrode is divided along this pattern. By forming in this manner, a large number of bypass circuits as shown in FIG. 3 can be manufactured at one time.

Next, FIG. 4 shows a specific example in which the bypass circuit element shown in FIG. 3 is provided in a measurement probe. FIG. 4(a) is a perspective view of the measurement probe configuration, and FIG. 4(b) is a perspective view of the measurement probe configuration.
4(c) shows the sectional shape along the line BB, and FIG. 4(d) shows the sectional shape along the line CC in FIG. 4(c).

In FIG. 4, the measuring probe 1 has elasticity.

One end thereof is fixed to a support member IC made of an insulating material, and the support member IC is connected to a probe board (not shown).
Fixed. The support member IC has a substantially rectangular cross-sectional shape, and a ground electrode 13 configured to be grounded is provided on the negative side thereof. This earth electrode 1
A measuring probe 1 is placed on the surface opposite to the surface provided with the measuring probe 3.
A signal electrode 14 electrically connected to is provided as shown. Furthermore, the grounding electrode 13 wraps around to the signal electrode 14 side at its - portion (BB--B cross section in FIG. 4(a)) as shown in FIG. 4(c). A bypass circuit element 10 is inserted between the grounding electrode 13 and the signal electrode 14 in this portion. Upper and lower electrodes 9a'=9b of this bypass circuit element 10 are connected to a grounding electrode 13 and a signal electrode 14, respectively.

The grounding electrode 13 and the signal electrode 14 are connected to the supporting member 1c at the opposite end of the measuring probe 1.
As shown in FIG. 4(d), it is in the form of a coaxial cable. These grounding electrodes 13 and signal electrodes 14 can be created using metal plating and photoetching methods.

In the above example, since the grounding electrode is provided along the signal electrode, it takes the form of a microstrip line and improves the high frequency characteristics of the signal electrode 14. Also, the support member IC
At the opposite end of the measurement probe 1, the ground electrode 13 surrounds the signal electrode 14 in the form of a coaxial cable, so that the influence of noise can be reduced.

Furthermore, by downsizing the bypass circuit element and incorporating it into the measurement probe, a probe card that can perform stable measurements and is easy to handle can be realized.

Furthermore, since the measurement probe can be connected to the bypass circuit element near the bonding contact portion, more stable measurement is possible.

When the input voltage and output voltage of the integrated circuit constituting the inverter circuit were measured using such a probe card, the results shown in FIG. 5(b) were obtained. On the other hand, when only the conventional bypass capacitor was connected to the measurement probe and its input and output voltages were measured, the results shown in FIG. 5(a) were obtained. From this experimental result, it was confirmed that the use of the probe card of the present invention is more preferable.

The present invention is not limited to the above embodiments, and various modifications may be made.

Specifically, in the manufacturing method of the die-cap type bypass circuit described above, a conductive layer is formed on an insulating substrate and then an electrode is formed, but instead of an insulating substrate, an insulating layer is formed on an electrode plate. may be formed by a sputtering method or the like, and then a conductive layer may be further formed thereon by a sputtering method or the like.

Further, in the above embodiment, an example has been described in which the bypass circuit element is incorporated into the n1 regular probe, but it may be embedded in the probe board or may be attached externally.

〔effect〕

With the above configuration, when the electrical characteristics of an integrated circuit or the like are measured using the probe card of the present invention, the electrical characteristics of the integrated circuit can be measured in a stable state.

Furthermore, by forming the bypass circuit provided in the probe card of the present invention into a goose-cap structure, handling becomes easy. Particularly, when such a bypass circuit is attached to a probe card or a measurement probe, electrical connections can be made easily.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of the circuit configuration of the probe card of the present invention;
2 is a diagram showing an example of a bypass circuit provided in the probe card of the present invention, FIG. 3 is a diagram showing another example of a bypass circuit provided in the probe card of the present invention, and FIG. 4 is a diagram showing an example of a bypass circuit provided in the probe card of the present invention.
Figure 3 shows an example of a mounting structure in which the bypass circuit shown in the measurement probe is mounted, and Figure 5 shows a case where the input/output characteristics of an inverter circuit are measured using the probe card of the present invention and a case where the input/output characteristics of an inverter circuit are measured using the probe card of the present invention. FIG. 6 is a diagram illustrating an example of the circuit configuration of a conventional probe card. 1...Measurement probe, IC...support member, 2...
・Probe card, 3...Semiconductor board, 3a...Bonde ink bad, 4.11...Capacitor, 5.
・・External measurement device connection end, 6.・Bypass circuit, 7.
12...Resistor, 6a, 6b...Connection terminal, 9a...
- Upper electrode, 9b... Lower electrode, 10... Bypass circuit, 13... Earth electrode, 14... Signal electrode. Patent author: Sumitomo Electric Industries Co., Ltd. Patent attorney Yoshiki Hase
Fumiaki Terasaki Vin (a) Comparison of effects Figure 5

Claims (1)

[Claims] 1. A measurement probe, a bypass circuit, a first terminal portion to which the bypass circuit is connected to the other end of the measurement probe, and a second terminal portion that is grounded. , a probe card including a capacitor and a resistor, the capacitor and the resistor being connected in series with each other. 2. Claim 1, wherein the capacitor is a ceramic capacitor and is integrally molded with the resistor.
Probe card listed. 3. The probe card according to claim 1, wherein the capacitor and the resistor have a die-cap type laminated structure, and electrodes are provided on the upper and lower surfaces of the laminated structure.