JPH01273687A - Decomposition/removing apparatus - Google Patents
Decomposition/removing apparatusInfo
- Publication number
- JPH01273687A JPH01273687A JP63101671A JP10167188A JPH01273687A JP H01273687 A JPH01273687 A JP H01273687A JP 63101671 A JP63101671 A JP 63101671A JP 10167188 A JP10167188 A JP 10167188A JP H01273687 A JPH01273687 A JP H01273687A
- Authority
- JP
- Japan
- Prior art keywords
- decomposition
- target material
- decomposition reaction
- laser beam
- oxygen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000354 decomposition reaction Methods 0.000 title claims abstract description 37
- 239000013077 target material Substances 0.000 claims abstract description 23
- 239000007789 gas Substances 0.000 claims abstract description 20
- 239000001301 oxygen Substances 0.000 claims abstract description 19
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 19
- 239000001257 hydrogen Substances 0.000 claims abstract description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 11
- 229920000620 organic polymer Polymers 0.000 claims description 7
- 239000002861 polymer material Substances 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 5
- 239000004642 Polyimide Substances 0.000 abstract description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052753 mercury Inorganic materials 0.000 abstract description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 abstract description 3
- 229920001721 polyimide Polymers 0.000 abstract description 3
- 239000004926 polymethyl methacrylate Substances 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- -1 hydrogen radicals Chemical class 0.000 description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 239000007795 chemical reaction product Substances 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910003481 amorphous carbon Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002831 nitrogen free-radicals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は分解除去装置に関し、特にレーザを利用した
分解除去装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a decomposition and removal device, and particularly to a decomposition and removal device that uses a laser.
材料、特に有機高分子材料の局所除去加工には。 For local removal processing of materials, especially organic polymer materials.
高速かつ微細加工が可能であることから、従来よりレー
ザを利用した加工法が採用されている。Processing methods using lasers have traditionally been used because they enable high-speed and fine processing.
第２図は例えば刊行物（Ｊ、Ａｐｐｌ、Ｐｈｙｓ。FIG. 2 is illustrated, for example, in a publication (J, Appl, Phys.
Ｖｏｌ、５８．Ｎｏ、５．１９８５．Ｐ、２０３６〜Ｐ
。Vol, 58. No. 5.1985. P, 2036~P
.
２０４３ ）に示されたレーザを利用した従来の分解除
去装置を示す構成図である。2043) is a configuration diagram showing a conventional decomposition and removal apparatus using a laser.
図において（１）は光源で１例えば紫外レーザ発振器、
（２）は紫外レーザ光、（３）は有機高分子材料１例え
ばポリイミド、ポリメチルメタクリレート等からなるタ
ーゲット材、（４）は紫外レーザ光（２）全ターゲット
材（３）の分解に必要なエネルギー密度に集光するため
のレンズ、（５）はターゲット材（３）に所望のパター
ンの紫外レーザ光を照射するためのマスクである。In the figure, (1) is a light source, such as an ultraviolet laser oscillator,
(2) is an ultraviolet laser beam, (3) is a target material made of organic polymer material 1 such as polyimide, polymethyl methacrylate, etc., and (4) is an ultraviolet laser beam (2) necessary for decomposing the entire target material (3). A lens (5) is a mask for irradiating the target material (3) with a desired pattern of ultraviolet laser light.
紫外レーザ発振器ｆｉｌから出射された紫外レーザ光（
２）は、レンズ（４）によりターゲット材（３）の分解
除去に適正なエネルギー密度に集光され、マスク（５）
を通してターゲット材（３）に所望のパターン形状で照
射される。この光のエネルギーでターゲット材（３）の
分解反応が起こシ、蒸発除去が達成される。Ultraviolet laser light emitted from the ultraviolet laser oscillator fil (
2) is focused by the lens (4) to an appropriate energy density for decomposing and removing the target material (3), and then the mask (5)
The target material (3) is irradiated with a desired pattern shape through the rays. The energy of this light causes a decomposition reaction of the target material (3) and evaporation removal is achieved.
従来の分解除去装置は以上のように構成されておシ２分
解反応で生じた分解反応生成物は、一部再結合により安
定炭素化合物やアモルファスヵ−ボン、グラファイトな
どの安定構造をと９．再びターゲット材（３）上に堆積
するという問題があった。The conventional decomposition and removal equipment is constructed as described above, and the decomposition reaction products generated in the decomposition reaction are partially recombined to form stable structures such as stable carbon compounds, amorphous carbon, graphite, etc.9. There was a problem that the target material (3) was deposited again.
この堆遺物は著しく外観をとり損ない０例えば電子部品
として用いられた場合には、電気特性等に支障をきたす
こともあった。These deposits significantly deteriorated in appearance and, for example, when used as electronic parts, could impede electrical properties and the like.
このように従来の分解除去装置は、上記の点から分解反
応生成物を効率よく取り除き９．ターゲット材（３）上
に残らないようにすることは難しかった。In this way, the conventional decomposition and removal device efficiently removes decomposition reaction products from the points mentioned above.9. It was difficult to prevent it from remaining on the target material (3).
この発明は上記のような問題点を解決するためになされ
たもので９分解反応生成物の除去を促進して高速にかつ
低損傷にクリーンな除去を行なうことのできる分解除去
装置を提供することを目的としている。This invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a decomposition and removal device that can accelerate the removal of decomposition reaction products and perform clean removal at high speed and with little damage. It is an object.
この発明に係る分解除去装置は、有機高分子材料からな
るターゲット材表面を励起して分解反応奮起させる光源
、及び分解反応による分解生成物と反応しうる。水素ラ
ジカルと酸素ラジカルのうちの少なくとも一方の補助ガ
スをターゲット材の表面に導入する補助ガス導入手段を
備えたものである。The decomposition and removal device according to the present invention can react with a light source that excites the surface of a target material made of an organic polymer material to stimulate a decomposition reaction, and with decomposition products resulting from the decomposition reaction. The apparatus is equipped with an auxiliary gas introduction means for introducing at least one of hydrogen radicals and oxygen radicals into the surface of the target material.
この発明に訃いて鉱、レーザ光などの光を照射すること
によってターゲット材表面を励起し１分解反応を起こさ
せる。この分解反応で生じた分解反応生成物が再び安定
構造分とジターゲット材上に残る前に１分解反応生成物
と酸素ラジカル又は水素ラジカルを反応させ、別の揮発
しやすい物質に即座に変化させることが可能である。こ
れにょシ安定炭化水素などの堆積を防止し、高速でクリ
ーンな除去を行うことができる、
〔実施例〕
以下、この発明の一実施例を有機高分子材料のスルーホ
ール形成を対象として図に従って説明する。第１図は、
この発明の一実施例による分解除去装置を示す構成図で
ちる。図において、（１）は光源で１例えばＹＡＧ第４
高調波（２６５ｎｍ）などの紫外レーザ発損器、（２１
ｉは紫外レーザ光、（３）に例えばポリイミドやポリメ
チルメタクリレート等の有機高分子材料からなるターゲ
ット材、（４）は集光レンズ、（６）はターゲット材（
３）を保持するサセプタ。According to this invention, the surface of the target material is excited by irradiating it with light such as a laser beam or the like to cause a decomposition reaction. Before the decomposition reaction products generated in this decomposition reaction remain on the stable structural component and the ditargeting material again, the decomposition reaction products are reacted with oxygen radicals or hydrogen radicals, and immediately changed into another easily volatile substance. Is possible. This prevents the accumulation of stable hydrocarbons and allows for fast and clean removal. explain. Figure 1 shows
1 is a block diagram showing a decomposition and removal device according to an embodiment of the present invention. In the figure, (1) is a light source, for example, YAG 4
Ultraviolet laser generator such as harmonic (265 nm), (21
i is an ultraviolet laser beam, (3) is a target material made of an organic polymer material such as polyimide or polymethyl methacrylate, (4) is a condenser lens, and (6) is a target material (
3) A susceptor that holds.
（力は反応チャンバ、（８）は紫外レーザ光（２）を透
過させるため反応チャンバ＋７） Ｋ設けられたウィン
ド。(The force is the reaction chamber, (8) is the reaction chamber +7 to transmit the ultraviolet laser light (2)) K provided window.
（９）は例えば酸素などの補助ガスをターゲット材（３
）上に導入するための補助ガス導入口、αＧはこの補助
ガスを分解して酸素ラジカルを形成するための低圧水銀
ランプ（１６５ｎｍ）に代渦される紫外線ランプ、 Ｏ
ｌｌは分解反応ガスを排出するため排気系（図示せず）
へ通じるガス排出口である。(9) For example, auxiliary gas such as oxygen is added to the target material (3
), αG is an ultraviolet lamp vortexed by a low-pressure mercury lamp (165 nm) to decompose this auxiliary gas and form oxygen radicals, O
ll is an exhaust system (not shown) for discharging decomposition reaction gas.
This is the gas outlet leading to the
サセプタｆ１３１上におかれたターゲット材（３）ｆｄ
集光レンズ（４）により適正なエネルギー密度に調整さ
れた紫外レーザ光（２）の光子エネルギーによって光解
離される。例えば、有機高分子材料が光解離された場合
、主に主鎖の炭素−炭素結合が切断され。Target material (3) fd placed on susceptor f131
It is photodissociated by the photon energy of the ultraviolet laser beam (2) adjusted to an appropriate energy density by the condenser lens (4). For example, when an organic polymer material is photodissociated, mainly carbon-carbon bonds in the main chain are severed.
結合手を保持したままカーボン成分が固体表面から脱離
し、別の結合手と再び結合して比較的低分子となって揮
発していく。ところがこの時、一部は固体表面でアモル
ファスカーボンやグラファイトなどの安定構造をとった
り、気相中で安定構造をとり再び堆積したりする。これ
を防止するために補助ガス導入口（９）から酸素あるい
は一酸化窒素を導入し、紫外線ランプ（低圧水銀ランプ
）Ｈの光で効率よく分解することによシ歳素ラジカルを
供給する。この酸素ラジカルはレーザで分解脱離する炭
素成分と反応してＣＯやＣＯ２などの揮発しやすいガス
を生成する。従って、炭素成分がアモルファスカーボン
やグラファイトなどとなって固体表面に残るよシ早（Ｃ
ＯガスやＣＯ２ガスなどになって揮発していくことが可
能となる。The carbon component detaches from the solid surface while retaining the bond, recombines with another bond, becomes a relatively low molecular weight, and evaporates. However, at this time, some of it takes a stable structure such as amorphous carbon or graphite on the solid surface, or takes a stable structure in the gas phase and deposits again. To prevent this, oxygen or nitrogen monoxide is introduced through the auxiliary gas inlet (9) and efficiently decomposed by the light of an ultraviolet lamp (low-pressure mercury lamp) H, thereby supplying nitrogen radicals. These oxygen radicals react with the carbon component decomposed and desorbed by the laser to generate easily volatile gases such as CO and CO2. Therefore, the carbon component becomes amorphous carbon, graphite, etc. and remains on the solid surface.
It becomes possible to volatilize into O gas, CO2 gas, etc.
なお、レーザで分解脱離する炭素成分を上記のように揮
発性のガスとしてとりのぞく場合、水素ガスでもよく、
−！た酸素ガスと水素ガスを混合して加えてもいい。水
素ガスは、紫外線ランプα１の光により水素ラジカルと
なり、炭素成分と反応してＣｍ Ｈｎ のガスとして
とりのぞくことができる。In addition, when removing the carbon component decomposed and desorbed by laser as a volatile gas as described above, hydrogen gas may be used.
-! You may also add a mixture of oxygen gas and hydrogen gas. The hydrogen gas becomes hydrogen radicals by the light of the ultraviolet lamp α1, reacts with the carbon component, and can be removed as Cm Hn gas.
酸素ガスと水素ガスを混合した場合、水素ラジカルは酸
素ラジカルの効果をさらに助長するよう働く。When oxygen gas and hydrogen gas are mixed, hydrogen radicals act to further enhance the effect of oxygen radicals.
また、酸素ラジカルや水素ラジカルを供給する方法とし
ては酸素ガスまたは水素ガスを導入してマイクロ波プラ
ズマによシ酸素ラジカルや水素ラジカルを生成してもよ
い。Further, as a method of supplying oxygen radicals or hydrogen radicals, oxygen or hydrogen gas may be introduced and oxygen radicals or hydrogen radicals may be generated by microwave plasma.
また、酸素カスや水素ガスを導入して紫外線ランプによ
って酸素ラジカルや水素ラジカルを生成するかわりに、
酸素ラジカルや水素ラジカルをあらかじめマイクロ波放
電や光プラズマなどによって生成後１反応チャンバに導
入するようにしてもよい。Also, instead of introducing oxygen scum or hydrogen gas and generating oxygen radicals or hydrogen radicals using an ultraviolet lamp,
Oxygen radicals and hydrogen radicals may be generated in advance by microwave discharge, optical plasma, etc. and then introduced into one reaction chamber.
また、光源は上記実施例に限るものではなく。Further, the light source is not limited to the above embodiment.
他の紫外線レーザ全角いてもよいし、さらに光源として
赤外レーザを用いて熱分解反応を生じさせる系において
も適用できる。Other full-width ultraviolet lasers may be used, and a system in which a thermal decomposition reaction is caused using an infrared laser as a light source can also be applied.
以上のように、この発明によれば、有機高分子材料から
なるターゲット材表面を励起して分解反応を起させる光
源、及び分解反応例よる分解生成物を反応しうる。水素
ラジカルと酸素ラジカルのうちの少なくとも一方の補助
ガスをターゲット材の表面に導入する補助ガス導入手段
を備えることにより１分解反応生成物の除去全促進して
、好ましくない堆積物を生成することなく、低損傷でか
つ高速にスルーホール形成などの材料加工が可能となる
分解除去装置が得られる効果がある。As described above, according to the present invention, a light source that excites the surface of a target material made of an organic polymer material to cause a decomposition reaction, and a decomposition product from the decomposition reaction example can be reacted. By providing an auxiliary gas introducing means for introducing an auxiliary gas of at least one of hydrogen radicals and oxygen radicals onto the surface of the target material, the removal of the 1-decomposition reaction products can be completely promoted without producing undesirable deposits. This has the effect of providing a decomposition and removal device that enables material processing such as through-hole formation at high speed with low damage.
第１図はこの発明の一実施例による分解除去装置を示す
構成図、第２図は従来の分解除去装置全示す構成図であ
る、
図において、（１）は光源、（３）はターゲット材、（
９）は補助ガス導入口、（１１は紫外線ランプ、＋Ｉυ
はガス排出口である。
なお１図中、同一符号は同一、又は相当部分を示す。FIG. 1 is a block diagram showing a decomposition and removal device according to an embodiment of the present invention, and FIG. 2 is a block diagram showing the entire conventional decomposition and removal device. In the figure, (1) is a light source, and (3) is a target material. ,(
9) is the auxiliary gas inlet, (11 is the ultraviolet lamp, +Iυ
is the gas outlet. In addition, in FIG. 1, the same reference numerals indicate the same or equivalent parts.
Claims (1)
解反応を起させる光源、及び上記分解反応による分解生
成物と反応しうる、水素ラジカルと酸素ラジカルのうち
の少なくとも一方の補助ガスを上記ターゲット材の表面
に導入する補助ガス導入手段を備えた分解除去装置。A light source that excites the surface of the target material made of an organic polymer material to cause a decomposition reaction, and an auxiliary gas of at least one of hydrogen radicals and oxygen radicals that can react with the decomposition products of the decomposition reaction to the target material. A decomposition and removal device equipped with an auxiliary gas introduction means to be introduced onto the surface of the
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63101671A JP2536588B2 (en) | 1988-04-25 | 1988-04-25 | Disassembly and removal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63101671A JP2536588B2 (en) | 1988-04-25 | 1988-04-25 | Disassembly and removal device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01273687A true JPH01273687A (en) | 1989-11-01 |
| JP2536588B2 JP2536588B2 (en) | 1996-09-18 |
Family
ID=14306831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63101671A Expired - Lifetime JP2536588B2 (en) | 1988-04-25 | 1988-04-25 | Disassembly and removal device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2536588B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6958094B2 (en) | 2000-07-11 | 2005-10-25 | Shin-Etsu Handotai Co., Ltd. | Single crystal cutting method |
| JP2013065874A (en) * | 2004-01-29 | 2013-04-11 | Atotech Deutsche Gmbh | Method of manufacturing circuit carrier and use of the same |
| JP2015107817A (en) * | 2013-12-05 | 2015-06-11 | 長良製紙株式会社 | Interleaving paper for glass and production method of the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5582780A (en) * | 1978-12-16 | 1980-06-21 | Toshiba Corp | Surface processing method for metal or the like article |
| JPS60213393A (en) * | 1984-04-06 | 1985-10-25 | Mitsubishi Electric Corp | Cutting method of plastic material by using laser light |
| JPS6247482A (en) * | 1985-08-23 | 1987-03-02 | Nec Corp | Gas introducing and discharging device for laser cvd |
-
1988
- 1988-04-25 JP JP63101671A patent/JP2536588B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5582780A (en) * | 1978-12-16 | 1980-06-21 | Toshiba Corp | Surface processing method for metal or the like article |
| JPS60213393A (en) * | 1984-04-06 | 1985-10-25 | Mitsubishi Electric Corp | Cutting method of plastic material by using laser light |
| JPS6247482A (en) * | 1985-08-23 | 1987-03-02 | Nec Corp | Gas introducing and discharging device for laser cvd |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6958094B2 (en) | 2000-07-11 | 2005-10-25 | Shin-Etsu Handotai Co., Ltd. | Single crystal cutting method |
| JP2013065874A (en) * | 2004-01-29 | 2013-04-11 | Atotech Deutsche Gmbh | Method of manufacturing circuit carrier and use of the same |
| US8927899B2 (en) | 2004-01-29 | 2015-01-06 | Atotech Deutschland Gmbh | Method of manufacturing a circuit carrier and the use of the method |
| JP2015107817A (en) * | 2013-12-05 | 2015-06-11 | 長良製紙株式会社 | Interleaving paper for glass and production method of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2536588B2 (en) | 1996-09-18 |
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