JPS60213393A - Cutting method of plastic material by using laser light - Google Patents
Cutting method of plastic material by using laser lightInfo
- Publication number
- JPS60213393A JPS60213393A JP59068885A JP6888584A JPS60213393A JP S60213393 A JPS60213393 A JP S60213393A JP 59068885 A JP59068885 A JP 59068885A JP 6888584 A JP6888584 A JP 6888584A JP S60213393 A JPS60213393 A JP S60213393A
- Authority
- JP
- Japan
- Prior art keywords
- plastic material
- cut
- laser light
- cut surface
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は、レーザ光を用いたプラスチック材の切W+
方法に関し、脣にエポキシ基板やフェノール板などの芳
香族系の7ラスチツク狗を切断する方法に関するもので
ある。[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to cutting of plastic materials using a laser beam.
Regarding the method, the present invention relates to a method for cutting aromatic materials such as epoxy boards and phenol boards.
従来のこの棟の方法として0例えば第1図に示すレーザ
加工装置を用いる場合について述べる。As a conventional method for this purpose, a case will be described in which, for example, a laser processing apparatus shown in FIG. 1 is used.
図において、(1)は例えば塩化ビニル樹脂(以下。In the figure, (1) is, for example, vinyl chloride resin (hereinafter referred to as vinyl chloride resin).
pvc )で構成されたプラスチック材、(2)はレー
ザ発振器(図示せず)からのレーザ光(3)を集光する
集光レンズ、14+FiArガス、(5)はノズルで、
プラスチック材+11へArガス(4)を吹付けるよう
に構成されている。PVC), (2) is a condensing lens that condenses the laser beam (3) from a laser oscillator (not shown), 14+FiAr gas, (5) is a nozzle,
It is configured to spray Ar gas (4) onto the plastic material +11.
この装置では、集光レンズ121 Kより小さなスポッ
ト径に集束されたレーザ光(3)をプラスチック材+1
1の切断部に照射する。これと同時にAr ガス(4)
をノズル(5)からプラスチック材(tlの切断部及び
その周辺に9射し、レーザ光13)の熱に加えて、Ar
ガス(4)とプラスチック材(1)との反応熱などによ
ってプラスチック材+11を切断する、
しかしながら、この方法によって芳香族系のエポキシ基
板やフェノール板で構成されたプラスチック材filを
切断すると、プラスチック材(])の切断都Vi第2図
に示すようKなる、図はプラスチック材Txlの断面を
示し、全体的に切断面(6)には炭化物による黒いすす
(7)の生成が激しく、切断向(6)の周辺に熱影特層
(8)が大きく生じたり、しばしば切断面(6)の燃大
上りが発生していた、このため、後処理としてすす(7
)を増9除く工程が必要となり、工数が増加するうえ切
断費用が高く、レーザ光による切断の実用性が著しく損
われていた。In this device, the laser beam (3) focused to a spot diameter smaller than the condenser lens 121K is
Irradiate the cut part of 1. At the same time, Ar gas (4)
is irradiated from the nozzle (5) to the cut part of the plastic material (tl) and its surroundings, and in addition to the heat of the laser beam 13, Ar
The plastic material +11 is cut by the heat of reaction between the gas (4) and the plastic material (1). However, when cutting the plastic material fil made of aromatic epoxy substrate or phenol plate using this method, the plastic material As shown in Fig. 2, the cutting point Vi in (]) is K. The figure shows a cross section of the plastic material Txl. Overall, black soot (7) due to carbide is heavily formed on the cut surface (6), and the cutting direction is A large heat shadow layer (8) was formed around the cut surface (6), and a large amount of burnt gas was often generated on the cut surface (6).
) is required, which increases the number of man-hours and increases cutting costs, significantly impairing the practicality of laser beam cutting.
PVCを上記の装5を用いて切断しても、切断面(6)
は平滑で黒い寸す(7)の生成#−を認められ々い、こ
の坤由は以下のように考えられる。pvcは脂肪族系で
あり、熱可蝦性を有する。燃焼による炭素−炭素間の主
知Fi400℃程度の比較的低温で切Iされ、002や
H2Oなどとなって溶融揮発する。従って、エポキシ基
板の中でも脂肪族系のものであれはすす(7)は残らな
い、これに対して、芳香族系のエポキシ基板やフェノー
ル板で禍成されたプラスチック材+I+においては、燃
焼によるベンゼン填−炭素間の主知は脂肪族系と同様1
c400’c付近で切断されるが、ベンゼン環がこのま
ま残ってしまう。Even if PVC is cut using the above device 5, the cut surface (6)
The formation of a smooth black surface (7) was not observed, and the reason for this is thought to be as follows. PVC is aliphatic and has thermoplastic properties. The main bond between carbon and carbon due to combustion is cut off at a relatively low temperature of about 400°C, and it melts and volatilizes as 002, H2O, etc. Therefore, even among epoxy substrates, if they are aliphatic, no soot (7) will remain.On the other hand, in plastic materials +I+ made of aromatic epoxy substrates or phenol plates, benzene (7) will remain due to combustion. The main knowledge between filler and carbon is the same as in aliphatic systems.1
It is cleaved near c400'c, but the benzene ring remains as it is.
このベンゼン環の結合#′jaoo℃付近で々いと切断
−゛されず、しかも多量体化さtているため、さらに切
断されにくくなっている。プラスチック材toの温度(
1)に対する切断面(61の炭化物の重量り)8′第3
図に示す。切断面161 Kはレーザ光(3)の熱によ
って温度分布が生じ、シ3図に示す特性から切断面+6
1 K Hベンゼン環の多量体化したものと考えられる
炭化物による黒いすす状の残渣が残ることになる、
以上述べたように、従来の方法では、エポキシ基板やフ
ェノール板などの芳香族系のプラスチック材(1)を切
断すると切断面(6)に黒いすす(71の生成が激しく
、切障1面+61の周辺に熱影曽漸出1が太きく出たり
、たまに切断面(6)の燃え上りが発生するなどの欠点
があった。This bond of the benzene ring is not easily cleaved near the bond #'jaoo°C, and moreover, it is polymerized, making it even more difficult to cleave. Temperature of plastic material to (
1) Cut plane (61 carbide weight) 8' 3rd
As shown in the figure. A temperature distribution occurs at the cut surface 161 K due to the heat of the laser beam (3), and from the characteristics shown in Figure 3, the cut surface +6
A black soot-like residue is left behind due to carbide, which is thought to be a polymerized form of 1 K H benzene rings. When cutting the material (1), black soot (71) is generated intensely on the cut surface (6), and a thick heat shadow 1 appears around the cut surface + 61, and sometimes the cut surface (6) is burnt. There were drawbacks such as the occurrence of uphill climbs.
この発明は上記のような従来の方法の欠点を除去するた
めになさねたもので、レーザ光の照射と共にオゾンをプ
ラスチック材の切断部に吹付けることにより、エポキシ
基板やフェノール板などの芳香族系のプラスチック材を
切断する際にも、すすの生成を低減し、熱形l#層を低
下させ、さらに切断面の燃え上シを防止して、平滑で美
抛な切断面が得られるレーザ光を用いたプラスチック材
の切断方法を提供することを目的としている。This invention was made to eliminate the drawbacks of the conventional methods as described above, and by spraying ozone onto the cut parts of plastic materials together with laser light irradiation, aromatic materials such as epoxy boards and phenol boards can be removed. Even when cutting plastic materials, this laser reduces soot production, lowers the heat forming l# layer, and prevents burning of the cut surface, resulting in a smooth and beautiful cut surface. The purpose is to provide a method for cutting plastic materials using light.
以下、この発明の一実施例を図について説明する。第4
図に示すように、従来の方法と同様な過程によりレーザ
光(3)が例えばベンゼン環を含む芳香族系のプラスチ
ック材f11の切断部に照射される。An embodiment of the present invention will be described below with reference to the drawings. Fourth
As shown in the figure, a laser beam (3) is irradiated onto a cut portion of an aromatic plastic material f11 containing, for example, a benzene ring, in a process similar to the conventional method.
図中、(9)はオゾン(03)であり、レーザ光(3)
と共にプラスチックllt+の切断部及びその周辺に吹
付けられる。In the figure, (9) is ozone (03), and laser light (3)
It is also sprayed on the cut part of the plastic llt+ and its surroundings.
プラスチック材fllK:レーザ光(3)が照射される
と。Plastic material fllK: When irradiated with laser light (3).
レーザ光の持つ高エネルギーによって主鎖か切断される
。さらに高温に加熱されているプラスチック材+11の
領域に極めて活性な03(9)をノメル(5)から吹付
けると、ベンゼン環の結合まで切断さねてしまう。従っ
てベンゼン環の多量体化を低減することができ、無いす
すの発生、熱影舎層の出現を低下することができる。さ
らに切断面+6)の燃え上りを防止し、第5図に切断後
のプラスチック材(1)の断(2)を示すように、平滑
で美脆な切断面(6)が得られる。The main chain is severed by the high energy of the laser beam. Furthermore, when extremely active 03(9) is sprayed from Nomel (5) onto the region of plastic material +11 which is heated to a high temperature, even the bond of the benzene ring is not cut. Therefore, the multimerization of benzene rings can be reduced, and the generation of soot and the appearance of a heat sink layer can be reduced. Furthermore, the cut surface +6) is prevented from burning up, and as shown in FIG. 5, which shows the cross section (2) of the plastic material (1) after cutting, a smooth and brittle cut surface (6) can be obtained.
なお、上記実施例でけo3のみを吹付けているが、03
VCAr、 N2. He なとの不活性ガスを所定量
混合した混合ガスを吹付けても、すすの生成は減少し、
上記実施例と同様の効果が得られる。In addition, although only Keo3 was sprayed in the above example, 03
VCAr, N2. Even when spraying a mixture of a predetermined amount of He and other inert gases, soot production is reduced.
The same effects as in the above embodiment can be obtained.
〔発明の効果〕
以上のように、この発明によれば、レーザ光をプラスチ
ック材に照射して切断するものにおいて。[Effects of the Invention] As described above, according to the present invention, a plastic material is cut by irradiating it with a laser beam.
レーザ光の照射と共にオゾンをプラスチック材の切断部
に吹付けることにより、芳香族系のプラスチック材を切
断する際にも、すすの生成を低減し。By spraying ozone onto the cutting section of plastic material along with laser light irradiation, soot production can be reduced even when cutting aromatic plastic material.
燃え上りを防止して、平滑で美腕な切断面を得ることの
できるレーザ光を用いた切断方法を提供できる効果があ
る。This has the effect of providing a cutting method using a laser beam that can prevent flare-ups and obtain a smooth and beautiful cut surface.
第1図は従来のレーザ光を用いたプラスチック材の切断
方法に↓るレーザ加工装置を示す911+面図。
第2図はこの装置によって切断したプラスチック材を示
す断面図、第3図は切断時の7ラヌチツク劇の温度(′
C)に対する炭化物のIL宜Q)を示す特性図、第4図
はこの発明の一実施例による切断方法を用いた装置を示
す仙1面図、腑5図はこの装wVCよ−て切断したプラ
スチック材を示す断面回である。
(1)・・・プラスチック材、(31・・・レーザ光、
(9)・・オゾン
なお1図中、同一符号は同一、又は相当部分を示+O
代理人大岩増坩
第1図 第2図
第 4 図 第 5 図
手続補正IF(自発)
2、発明の名称
レーザ光を用いたプラスチック材の切断方法3、補正を
する者
事件との関係 特許出願人
住 所 東京都千代田区丸の内二丁目2番3号名 称
(601)三菱電機株式会社
代表者片山仁八部
4、代理人
6、補正の内容
(1) 明細書第2頁第10行の「同時に」の次K[−
ラスチック材11+の切断部からの飛散物が集光し′ズ
(2)表面に付着するのを防ぐためと、プラスチーク材
(11の切断部の酸化、燃焼を防ぐために」全挿入する
。
(21同第2頁第12行〜第14行の[、レーザ光(3
1の熱に加えて、 Arガス(41とプラスチック材(
1)との反応熱などによって」を削除する。
以上FIG. 1 is a 911+ side view showing a laser processing device for a conventional method of cutting plastic materials using a laser beam. Figure 2 is a cross-sectional view showing the plastic material cut by this device, and Figure 3 is the temperature ('
Figure 4 is a side view showing a device using the cutting method according to an embodiment of the present invention; This is a cross section showing a plastic material. (1)...Plastic material, (31...Laser light,
(9)...Ozone In Figure 1, the same reference numerals indicate the same or corresponding parts +O Agent Masataka Oiwa Figure 1 Figure 2 Figure 4 Figure 5 Procedure amendment IF (spontaneous) 2. Title of the invention Method for Cutting Plastic Materials Using Laser Light 3, Relationship with the Amendment Case Patent Applicant Address 2-2-3 Marunouchi, Chiyoda-ku, Tokyo Name
(601) Mitsubishi Electric Corporation Representative Hitoshi Katayama 4, Agent 6 Contents of amendment (1) Next to “at the same time” on page 2, line 10 of the specification K [-
Fully insert the plastic material (11+) in order to prevent the scattered matter from the cut part from concentrating on the surface of the glass (2) and to prevent the cut part of the plastic material (11+ from oxidizing and burning.) 21 Same page 2, lines 12 to 14 [, laser beam (3
In addition to the heat of 1, Ar gas (41) and plastic material (
1) by the heat of reaction with, etc." is deleted. that's all
Claims (1)
ものにおいて、レーザ光の照射と共にオゾンを上記プラ
スチック材の切断部に吹付けることを特徴とするレーザ
光を用いたプラスチック材の切断方法、 (2)オゾンに所定対の不活性ガスを混合することを特
徴とする特許請求の範囲第1項記戦のレーザ光を用いた
プラスチック狗の切断方法。[Claims] +11 A method for cutting a plastic material by irradiating it with a laser beam, characterized in that ozone is sprayed onto the cut portion of the plastic material at the same time as the irradiation of the laser beam. (2) A method for cutting a plastic dog using a laser beam according to claim 1, characterized in that: (2) a predetermined pair of inert gases are mixed with ozone.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59068885A JPS60213393A (en) | 1984-04-06 | 1984-04-06 | Cutting method of plastic material by using laser light |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59068885A JPS60213393A (en) | 1984-04-06 | 1984-04-06 | Cutting method of plastic material by using laser light |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60213393A true JPS60213393A (en) | 1985-10-25 |
Family
ID=13386551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59068885A Pending JPS60213393A (en) | 1984-04-06 | 1984-04-06 | Cutting method of plastic material by using laser light |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60213393A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01273687A (en) * | 1988-04-25 | 1989-11-01 | Mitsubishi Electric Corp | Decomposition/removing apparatus |
DE102022129257A1 (en) | 2022-11-06 | 2024-05-08 | Mr Beam Lasers GmbH | Method and processing device for processing a workpiece made of plastic, rubber or an organic material |
-
1984
- 1984-04-06 JP JP59068885A patent/JPS60213393A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01273687A (en) * | 1988-04-25 | 1989-11-01 | Mitsubishi Electric Corp | Decomposition/removing apparatus |
DE102022129257A1 (en) | 2022-11-06 | 2024-05-08 | Mr Beam Lasers GmbH | Method and processing device for processing a workpiece made of plastic, rubber or an organic material |
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