JPH01261885A - Hybrid ic element - Google Patents

Hybrid ic element

Info

Publication number
JPH01261885A
JPH01261885A JP8997988A JP8997988A JPH01261885A JP H01261885 A JPH01261885 A JP H01261885A JP 8997988 A JP8997988 A JP 8997988A JP 8997988 A JP8997988 A JP 8997988A JP H01261885 A JPH01261885 A JP H01261885A
Authority
JP
Japan
Prior art keywords
variable
hybrid
case
board
variable element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8997988A
Other languages
Japanese (ja)
Inventor
Masao Takahashi
正雄 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8997988A priority Critical patent/JPH01261885A/en
Publication of JPH01261885A publication Critical patent/JPH01261885A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To enable the adjustment of a variable element, in the high density mounting state of IC elements, by using a vertical type IC substrate, and arranging the variable element on the upper part. CONSTITUTION:On the lower part of an IC substrate 1, a connection terminal part 5 is arranged, and, on the upper part, a recessed part 6 is formed. A variable element 7 such as a variable inductance, a variable resistor, and a variable capacitor is almost vertically arranged. Connection terminals 8 are soldered with wiring of the substrate 1. A hybrid IC element formed in this manner is arranged on a printed board 9, together with other IC elements, and the connection terminal part 5 is soldered with the printed board 9. In this state, the adjustment of variable parts of the variable elements 7 is enabled from the direction vertical to the printed board 9.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は高密度実装の電子機器に用いるハイブリッドＩ
Ｃ素子に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applicable to hybrid I for use in high-density packaging electronic equipment.
This relates to the C element.

従来の技術 従来、ＩＣ素子を用いるｉＩ′Ｓ密度実装装置の電子別
器では、第５図に示すように、ＩＣ素子４１の端子を一
方に寄ゼて竪形としているが、可変抵抗、可変容吊、可
変インダクタンスなどの可変素子４２はＩＣ素子４１と
分離してプリント基板４３に設けられている。2. Description of the Related Art Conventionally, in an electronic separate device of an iI'S density mounting apparatus using an IC element, the terminals of the IC element 41 are placed on one side to form a vertical shape, as shown in FIG. A variable element 42 such as a variable suspension or variable inductance is provided on a printed circuit board 43 separately from the IC element 41.

発明が解決しようとする課題 上述のようにこの種の高密度実装装置の電子Ｒ器では、
可変素子４２とＩＣ素子４１とを分離して設けていたた
め、配線パターンや可変素子４２のために高密度化が疎
外されるという問題があった。Problems to be Solved by the Invention As mentioned above, in this type of high-density packaging device electronic R,
Since the variable element 42 and the IC element 41 are provided separately, there is a problem in that high density is not achieved due to the wiring pattern and the variable element 42.

本発明はこのような問題を解決するものであり、ＩＣ素
子を高密度実装した状態で、上面から可変素子の調整が
可能なハイブリッドＩＣ素子を提供することを目的とす
るものである。The present invention is intended to solve such problems, and aims to provide a hybrid IC element in which variable elements can be adjusted from the top surface while IC elements are mounted at high density.

課題を解決するための手段 本発明は上記課題を解決するために、ＩＣ基板またはＩ
Ｃケースを接続端子部を片側に集めた竪形とし、その上
部に可変容吊、可変インダクタンス、可変抵抗などの可
変素子を付加し、高密度実装状態で可変素子の可変部の
調整ができるようにしたものである。Means for Solving the Problems In order to solve the above problems, the present invention provides an IC substrate or an I
The C case has a vertical shape with the connection terminals gathered on one side, and variable elements such as variable capacitance, variable inductance, and variable resistance are added to the top of the case, so that the variable parts of the variable elements can be adjusted in a high-density mounting state. This is what I did.

作用 上記構成により、ＩＣ素子と可変素子を分離しなくて済
み、ハイブリッドＩＣ素子の平面積を縮少することがで
き、より高度の高密度実装を実現することができる。Effect: With the above configuration, it is not necessary to separate the IC element and the variable element, the planar area of the hybrid IC element can be reduced, and higher density packaging can be realized.

実施例 以下、本発明の一実施例を図面に基づき説明する。Example Hereinafter, one embodiment of the present invention will be described based on the drawings.

第１図（ａ）および（ｂ）は本発明の一実施例を示すハ
イブリッドＩＣ素子の斜視図および側面図である。第１
図（ａ）および（ｂ）において、１はセラミックまたは
ガラス製の竪形のＩＣ基板で、このＩＣ基板１にはあら
かじめ定められた配線がされており、これに所定数のコ
ンデンサ２、抵抗３、トランジスタ４などのチップ部品
が半田付けされているとともに、これらにより形成され
た回銘パターンはプラスチックで被服され、外部からの
影響が防止されている。このＩＣＩ板１は下部に外部へ
の接続端子部５が設けられ、上部に第１図（Ｃ）に示す
ように凹部６が形成され、この凹部６に可変インダクタ
ンス、可変抵抗、可変容量などの可変素子７がほぼ直角
に配設されて、その接続端子８はＩＣ基板１の配線に半
田付けされている。FIGS. 1(a) and 1(b) are a perspective view and a side view of a hybrid IC element showing one embodiment of the present invention. 1st
In Figures (a) and (b), reference numeral 1 denotes a vertical IC board made of ceramic or glass, and this IC board 1 has predetermined wiring, and a predetermined number of capacitors 2 and resistors 3. , transistor 4, and other chip components are soldered, and the marking pattern formed by these components is covered with plastic to prevent external influences. This ICI board 1 is provided with a connecting terminal part 5 to the outside at the lower part, and a recessed part 6 is formed in the upper part as shown in FIG. 1(C). The variable element 7 is arranged at a substantially right angle, and its connection terminal 8 is soldered to the wiring of the IC board 1.

このようにして形成されたハイブリッドＩＣ素子は、他
のＩＣ素子とともにマザーボードのプリント基板９にす
き間なく配置され、ＩＣ基板１の接続端子部５がプリン
ト基板９に半田付けされる。The hybrid IC element thus formed is placed on the printed circuit board 9 of the motherboard without gaps together with other IC elements, and the connection terminal portions 5 of the IC board 1 are soldered to the printed circuit board 9.

この状態で、プリント基板９に対して直交する方向から
可変素子７の可変部の調整を行うことができる。In this state, the variable portion of the variable element 7 can be adjusted from a direction perpendicular to the printed circuit board 9.

上記構成により、ハイブリッドＩＣ素子の最大幅は可変
素子７の幅ａであり、また凹部６を設けてここに可変素
子７を配設したので、その高さは可変素子７を設けても
元のままであり、この狭い幅と高さの空間に可変素子お
よびチップ部品を芸者でき、これにより高密度実装を行
うことができる。With the above configuration, the maximum width of the hybrid IC element is the width a of the variable element 7, and since the recess 6 is provided and the variable element 7 is disposed there, its height remains the same as the original height even if the variable element 7 is provided. Variable elements and chip components can be placed in this narrow width and height space, allowing for high-density packaging.

第２図は本発明の他の実施例を示すハイブリッドＩＣ素
子の部分切欠き斜視図である。第２図において、１１は
ＩＣチップ１２が内蔵されたＩＣケースで、このＩＣケ
ース１１の上部に形成された凹部１３に可変素子１４が
ＩＣケース１１に対して直角に設けられている。１５は
この可変素子１４の接続端子、１６はＩＣケース１１の
接続端子部である。このようにして構成されたハイブリ
ッドＩＣ素子によっても上記実施例と同様に高密度実装
が行える。FIG. 2 is a partially cutaway perspective view of a hybrid IC element showing another embodiment of the present invention. In FIG. 2, reference numeral 11 denotes an IC case with an IC chip 12 built therein, and a variable element 14 is provided in a recess 13 formed in the upper part of the IC case 11 at right angles to the IC case 11. 15 is a connection terminal of this variable element 14, and 16 is a connection terminal portion of the IC case 11. The hybrid IC element configured in this manner also enables high-density packaging as in the above embodiment.

第３図は本発明のさらに他の実施例を示すハイブリッド
ＩＣ素子の斜視図である。このハイブリッドＩＣ素子は
、ＩＣ基板またはＩＣケース２１の上部に凹部を形成せ
ず、そのまま可変素子２２を上面に設けたものである。FIG. 3 is a perspective view of a hybrid IC element showing still another embodiment of the present invention. In this hybrid IC element, a recess is not formed in the upper part of the IC board or the IC case 21, and the variable element 22 is directly provided on the upper surface.

この場合、可変素子２２の厚さがＩＣ基板またはＩＣケ
ース２１の高さに加えられるが、ＩＣ基板またはＩＣケ
ース２１の高さが低いものの場合に適している。In this case, the thickness of the variable element 22 is added to the height of the IC board or IC case 21, but this is suitable when the height of the IC board or IC case 21 is low.

さらに、第４図（ａ）および（ｂ）は本発明のその他の
実施例を示すハイブリッドＩＣ素子の斜視図および側面
図である。第４図（ａ）および（ｂ）において、３１は
コンデンサ３２．抵抗３３．トランジスタ３４などのチ
ップ部品が半田付けされているＩｃ基板で、このＩＣ基
板３１の上部−側面に可変素子３５が取付けられ、同様
にマザーボードのプリント基板３６に対して直交する方
向からの調整を可能にしている。この場合、可変素子３
５が一方の面に片寄ることになり、ぞのハイブリッドＩ
Ｃ素子の厚さは可変素子３５の幅すと、ＩＣ基板３１の
厚さＣと、他側面側のチップ部品の厚さｄとの和となる
が、従来のように可変素子を個別にプリント基板に設け
たものに比べると平面積当りの利用効率は向上する。こ
の場合、可変素子３５と同じ側にチップ部品を配設した
り、ＩＣケース内にチップ部品を内蔵させたりすること
により、ハイブリッドＩＣ素子の厚さを可変素子３５と
ＩＣ基板３１もしくはＩＣケースの厚さとの和にするこ
とができる。Furthermore, FIGS. 4(a) and 4(b) are a perspective view and a side view of a hybrid IC element showing another embodiment of the present invention. In FIGS. 4(a) and 4(b), 31 is a capacitor 32. Resistance 33. This is an IC board to which chip components such as a transistor 34 are soldered.A variable element 35 is attached to the top and side surfaces of this IC board 31, and adjustment can be similarly made from the direction orthogonal to the printed circuit board 36 of the motherboard. I have to. In this case, variable element 3
5 will be biased to one side, and the hybrid I
The thickness of the C element is the sum of the width of the variable element 35, the thickness C of the IC board 31, and the thickness d of the chip component on the other side. The utilization efficiency per flat area is improved compared to that provided on the substrate. In this case, by arranging the chip component on the same side as the variable element 35 or by incorporating the chip component in the IC case, the thickness of the hybrid IC element can be adjusted between the variable element 35 and the IC board 31 or the IC case. It can be the sum of the thickness.

このようにいずれの場合でも可変素子をＩＣ素子と分離
設置する従来のものに比べて平面の有効利用が行われる
。In this way, in any case, more effective use of the plane surface is achieved than in the conventional arrangement in which the variable element is installed separately from the IC element.

発明の効果 本発明は上記実施例より明らかなように以下に示す効果
を有する。Effects of the Invention As is clear from the above embodiments, the present invention has the following effects.

（１）ＩＣ基板またはＩＣケースに可変素子を直接設け
たので、高密度実装とすることができる。(1) Since the variable element is directly provided on the IC board or IC case, high-density mounting is possible.

（２）ＩＣ基板またはＩＣケース上に可変素子を取付け
たので、配線を短縮することができ、高周波のＩＣ素子
に好適である。(2) Since the variable element is mounted on the IC board or IC case, the wiring can be shortened, and it is suitable for high-frequency IC elements.

（３）１０塁板またはＩＣケースとほぼ直角に可変素子
を設けているので高密度実装の状態で可変素子の調整を
行うことができる。(3) Since the variable element is provided almost perpendicularly to the base plate or IC case, the variable element can be adjusted in a state of high-density mounting.

（４）ＩＣ基板またはＩＣケースと可変素子とを一体に
形成しているので、マザーボードに組立てる前にあらか
じめ定められた所定位置で可変素子を予調整しておくこ
とができる。(4) Since the IC board or IC case and the variable element are integrally formed, the variable element can be preadjusted at a predetermined position before being assembled to the motherboard.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図（ａ）および（ｂ）は本光明の一実施例を示すハ
イブリッドＩＣ素子の斜視図および側面図、第１図（Ｃ
）は同ハイブリッドＩＣ素子のＩＣ基板の斜視図、第２
図は本発明の他の実施例を示すハイブリッドＩＣ素子の
部分切欠き斜視図、第３図は本発明のその他の実施例を
示すハイブリッドＩＣ素子の斜視図、第４図（ａ）およ
び（ｂ）は本発明のさらに他の実施例を示すハイブリッ
ドＩＣ素子の斜視図および側面図、第５図（ａ）および
（ｂ）は従来の高密度実装８置の平面図および側面図で
ある。 １．３１・・・ＩＣ基板、５．１６・・・接続端子部、
６゜１３・・・凹部、７　、１４．２２．３５・・・可
変素子、９・・・プリント基板、１１・・・ＩＣケース
、２１・・・ＩＣｌ板またはＩＣケース。 代理人　　　森　　本　　鶴　　弘 第１図 ｄ之ン　　　　　　　　　　　　　　　　　　　　　　
　（ｂ）第２図 １１・−ＩＣケース 第Ｊ図 第４図 ６も　　　　　ｉノ ３／−ＩＣ縁　　　　　゛ 副摺麦寺Ｓ 第５図FIGS. 1(a) and (b) are a perspective view and a side view of a hybrid IC element showing one embodiment of the present invention, and FIG.
) is a perspective view of the IC board of the same hybrid IC element.
The figure is a partially cutaway perspective view of a hybrid IC device showing another embodiment of the invention, FIG. 3 is a perspective view of a hybrid IC device showing another embodiment of the invention, and FIGS. 4(a) and (b) ) is a perspective view and a side view of a hybrid IC element showing still another embodiment of the present invention, and FIGS. 5(a) and 5(b) are a plan view and a side view of a conventional high-density mounting 8-position. 1.31...IC board, 5.16...Connection terminal section,
6゜13...Concavity, 7, 14.22.35...Variable element, 9...Printed circuit board, 11...IC case, 21...ICl board or IC case. Agent Hiroshi Tsuru Morimoto Figure 1 d.
(b) Fig. 2 11 - IC case Fig. J Fig. 4 Fig. 6 as well

Claims (1)

【特許請求の範囲】[Claims] １．接続端子部を片側のみに有する竪形ＩＣ基板または
ＩＣケースの上部に可変素子をほぼ直角に取付けて上方
より調整可能としたハイブリッドＩＣ素子。1. A hybrid IC element that can be adjusted from above by attaching a variable element at a nearly right angle to the top of a vertical IC board or IC case that has connection terminals on only one side.
JP8997988A 1988-04-12 1988-04-12 Hybrid ic element Pending JPH01261885A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8997988A JPH01261885A (en) 1988-04-12 1988-04-12 Hybrid ic element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8997988A JPH01261885A (en) 1988-04-12 1988-04-12 Hybrid ic element

Publications (1)

Publication Number Publication Date
JPH01261885A true JPH01261885A (en) 1989-10-18

Family

ID=13985786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8997988A Pending JPH01261885A (en) 1988-04-12 1988-04-12 Hybrid ic element

Country Status (1)

Country Link
JP (1) JPH01261885A (en)

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