JPH01257019A - ホットランナーチップ装置 - Google Patents
ホットランナーチップ装置Info
- Publication number
- JPH01257019A JPH01257019A JP8412888A JP8412888A JPH01257019A JP H01257019 A JPH01257019 A JP H01257019A JP 8412888 A JP8412888 A JP 8412888A JP 8412888 A JP8412888 A JP 8412888A JP H01257019 A JPH01257019 A JP H01257019A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- gate
- hot
- hot wire
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- 239000011347 resin Substances 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 230000003647 oxidation Effects 0.000 claims abstract description 9
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract description 20
- 238000004804 winding Methods 0.000 abstract description 8
- 239000011810 insulating material Substances 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract description 2
- 239000012212 insulator Substances 0.000 abstract description 2
- 230000009467 reduction Effects 0.000 abstract description 2
- 230000001154 acute effect Effects 0.000 abstract 1
- 238000001746 injection moulding Methods 0.000 description 7
- 229910001120 nichrome Inorganic materials 0.000 description 7
- 239000002826 coolant Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/30—Flow control means disposed within the sprue channel, e.g. "torpedo" construction
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Resistance Heating (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8412888A JPH01257019A (ja) | 1988-04-07 | 1988-04-07 | ホットランナーチップ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8412888A JPH01257019A (ja) | 1988-04-07 | 1988-04-07 | ホットランナーチップ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01257019A true JPH01257019A (ja) | 1989-10-13 |
| JPH0419007B2 JPH0419007B2 (enrdf_load_stackoverflow) | 1992-03-30 |
Family
ID=13821873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8412888A Granted JPH01257019A (ja) | 1988-04-07 | 1988-04-07 | ホットランナーチップ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01257019A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7671304B2 (en) | 2004-10-18 | 2010-03-02 | Mold-Masters (2007) Limited | Multiple zone temperature controller for injection molding system |
-
1988
- 1988-04-07 JP JP8412888A patent/JPH01257019A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7671304B2 (en) | 2004-10-18 | 2010-03-02 | Mold-Masters (2007) Limited | Multiple zone temperature controller for injection molding system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0419007B2 (enrdf_load_stackoverflow) | 1992-03-30 |
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