JPH01256138A - キャリアテープおよびその使用方法 - Google Patents

キャリアテープおよびその使用方法

Info

Publication number
JPH01256138A
JPH01256138A JP63082887A JP8288788A JPH01256138A JP H01256138 A JPH01256138 A JP H01256138A JP 63082887 A JP63082887 A JP 63082887A JP 8288788 A JP8288788 A JP 8288788A JP H01256138 A JPH01256138 A JP H01256138A
Authority
JP
Japan
Prior art keywords
carrier tape
holes
tape
sprocket
rows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63082887A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0513538B2 (enrdf_load_html_response
Inventor
Takashi Hiraide
平出　隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP63082887A priority Critical patent/JPH01256138A/ja
Priority to US07/332,608 priority patent/US4980219A/en
Priority to KR1019890004474A priority patent/KR920005451B1/ko
Publication of JPH01256138A publication Critical patent/JPH01256138A/ja
Priority to US07/580,262 priority patent/US5019209A/en
Publication of JPH0513538B2 publication Critical patent/JPH0513538B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP63082887A 1988-04-06 1988-04-06 キャリアテープおよびその使用方法 Granted JPH01256138A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP63082887A JPH01256138A (ja) 1988-04-06 1988-04-06 キャリアテープおよびその使用方法
US07/332,608 US4980219A (en) 1988-04-06 1989-03-31 Carrier tape for bonding IC devices and method of using the same
KR1019890004474A KR920005451B1 (ko) 1988-04-06 1989-04-04 Ic 데바이스를 본딩하기 위한 캐리어 테이프 및 그 사용 방법
US07/580,262 US5019209A (en) 1988-04-06 1990-09-10 Method of manufacturing and using a carrier tape for bonding IC devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63082887A JPH01256138A (ja) 1988-04-06 1988-04-06 キャリアテープおよびその使用方法

Publications (2)

Publication Number Publication Date
JPH01256138A true JPH01256138A (ja) 1989-10-12
JPH0513538B2 JPH0513538B2 (enrdf_load_html_response) 1993-02-22

Family

ID=13786781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63082887A Granted JPH01256138A (ja) 1988-04-06 1988-04-06 キャリアテープおよびその使用方法

Country Status (1)

Country Link
JP (1) JPH01256138A (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282649A (ja) * 2002-03-27 2003-10-03 Shindo Denshi Kogyo Kk テープキャリアおよびその製造方法、テープキャリアへの電子部品の実装方法、ならびにテープキャリアパッケージの製造方法
US7045392B2 (en) 1998-07-28 2006-05-16 Seiko Epson Corporation Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment
US8037597B2 (en) 2007-04-09 2011-10-18 Nitto Denko Corporation Manufacturing method of tape carrier for TAB

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7045392B2 (en) 1998-07-28 2006-05-16 Seiko Epson Corporation Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment
JP2003282649A (ja) * 2002-03-27 2003-10-03 Shindo Denshi Kogyo Kk テープキャリアおよびその製造方法、テープキャリアへの電子部品の実装方法、ならびにテープキャリアパッケージの製造方法
US8037597B2 (en) 2007-04-09 2011-10-18 Nitto Denko Corporation Manufacturing method of tape carrier for TAB

Also Published As

Publication number Publication date
JPH0513538B2 (enrdf_load_html_response) 1993-02-22

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