JPH0125452Y2 - - Google Patents
Info
- Publication number
- JPH0125452Y2 JPH0125452Y2 JP15418883U JP15418883U JPH0125452Y2 JP H0125452 Y2 JPH0125452 Y2 JP H0125452Y2 JP 15418883 U JP15418883 U JP 15418883U JP 15418883 U JP15418883 U JP 15418883U JP H0125452 Y2 JPH0125452 Y2 JP H0125452Y2
- Authority
- JP
- Japan
- Prior art keywords
- gold
- silver
- alloy
- contact
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910001020 Au alloy Inorganic materials 0.000 claims description 26
- 239000003353 gold alloy Substances 0.000 claims description 26
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 25
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 24
- 229910052737 gold Inorganic materials 0.000 claims description 24
- 239000010931 gold Substances 0.000 claims description 24
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 23
- 239000004332 silver Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 22
- 229910052709 silver Inorganic materials 0.000 claims description 22
- 239000002131 composite material Substances 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 10
- 238000007747 plating Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005486 sulfidation Methods 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
Landscapes
- Contacts (AREA)
- Manufacture Of Switches (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15418883U JPS6060828U (ja) | 1983-10-04 | 1983-10-04 | 銀合金等の接点面を金合金等で完全に被覆した複合電気接点材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15418883U JPS6060828U (ja) | 1983-10-04 | 1983-10-04 | 銀合金等の接点面を金合金等で完全に被覆した複合電気接点材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6060828U JPS6060828U (ja) | 1985-04-27 |
| JPH0125452Y2 true JPH0125452Y2 (enrdf_load_stackoverflow) | 1989-07-31 |
Family
ID=30340913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15418883U Granted JPS6060828U (ja) | 1983-10-04 | 1983-10-04 | 銀合金等の接点面を金合金等で完全に被覆した複合電気接点材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6060828U (enrdf_load_stackoverflow) |
-
1983
- 1983-10-04 JP JP15418883U patent/JPS6060828U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6060828U (ja) | 1985-04-27 |
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