JPH01238148A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH01238148A
JPH01238148A JP63065431A JP6543188A JPH01238148A JP H01238148 A JPH01238148 A JP H01238148A JP 63065431 A JP63065431 A JP 63065431A JP 6543188 A JP6543188 A JP 6543188A JP H01238148 A JPH01238148 A JP H01238148A
Authority
JP
Japan
Prior art keywords
chip
electrodes
bump
equal
parallelism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63065431A
Other languages
Japanese (ja)
Inventor
Masato Nishizawa
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP63065431A priority Critical patent/JPH01238148A/en
Publication of JPH01238148A publication Critical patent/JPH01238148A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components

Abstract

PURPOSE: To hold the parallelism of a chip with respect to a semiconductor substrate and to improve the connecting strength against a twist or the like by surrounding the periphery of a bump electrode disposed substantially at an equal interval at the center of the chip with a dummy bump wholly in contact with the chip and the substrate.
CONSTITUTION: Bump electrodes 2 are so provided at the center of a chip 1 as to connect circuit elements in the chip to wiring conductors of a supporting board at positions occupying the vertexes of regular triangular shapes. Accordingly, the intervals between the adjacent electrodes 2 are substantially equal. Dummy bumps 3 are provided substantially at equal intervals at the peripheral edges of the chip 1 around the electrodes 2, and further surrounded by resin 4. Accordingly, the parallelism between the chip 1 by the bumps 3 and a circuit board 9 is reinforced to improve its strength against a distortion such as a twist, a thermal stress or the like.
COPYRIGHT: (C)1989,JPO&Japio
JP63065431A 1988-03-18 1988-03-18 Semiconductor device Pending JPH01238148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63065431A JPH01238148A (en) 1988-03-18 1988-03-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63065431A JPH01238148A (en) 1988-03-18 1988-03-18 Semiconductor device

Publications (1)

Publication Number Publication Date
JPH01238148A true JPH01238148A (en) 1989-09-22

Family

ID=13286906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63065431A Pending JPH01238148A (en) 1988-03-18 1988-03-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH01238148A (en)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU653610B2 (en) * 1991-07-10 1994-10-06 Sumitomo Electric Industries, Ltd. Semiconductor device
WO1996003020A1 (en) * 1994-07-19 1996-02-01 Olin Corporation Integrally bumped electronic package components
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
US5700715A (en) * 1994-06-14 1997-12-23 Lsi Logic Corporation Process for mounting a semiconductor device to a circuit substrate
US6097097A (en) * 1996-08-20 2000-08-01 Fujitsu Limited Semiconductor device face-down bonded with pillars
EP1029346A1 (en) * 1997-08-22 2000-08-23 Vertical Circuits, Inc. Vertical interconnect process for silicon segments with thermally conductive epoxy preform
EP1167068A1 (en) * 1999-10-08 2002-01-02 Dai Nippon Printing Co., Ltd. Non-contact data carrier and ic chip
US6462420B2 (en) * 1999-02-12 2002-10-08 Rohm Co., Ltd. Semiconductor chip and semiconductor device having a chip-on-chip structure
KR20030026206A (en) * 2001-09-25 2003-03-31 미쓰비시덴키 가부시키가이샤 Semiconductor device
KR20030058703A (en) * 2001-12-31 2003-07-07 엘지전자 주식회사 structure of bear chip connection with printed circuit board
JP2004104102A (en) * 2002-08-21 2004-04-02 Seiko Epson Corp Semiconductor device and its manufacturing method, circuit substrate and electronic apparatus
WO2003079439A3 (en) * 2002-03-19 2004-05-21 Koninkl Philips Electronics Nv Chip stack with intermediate cavity
US6750552B1 (en) * 2002-12-18 2004-06-15 Netlogic Microsystems, Inc. Integrated circuit package with solder bumps
US6946732B2 (en) * 2000-06-08 2005-09-20 Micron Technology, Inc. Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the same
US6960830B2 (en) * 2002-10-31 2005-11-01 Rohm Co., Ltd. Semiconductor integrated circuit device with dummy bumps
JP2006165209A (en) * 2004-12-07 2006-06-22 Matsushita Electric Ind Co Ltd Semiconductor device and its manufacturing process
US7242093B2 (en) 2002-07-29 2007-07-10 Nec Electronics Corporation Semiconductor device
JP2007251053A (en) * 2006-03-17 2007-09-27 Fujitsu Ltd Mounting structure of semiconductor device and method of manufacturing mounting structure
US7360874B2 (en) 2003-06-30 2008-04-22 Brother Kogyo Kabushiki Kaisha Ink-jet printer, ink-jet head and method of manufacturing the ink-jet head
JP2008258380A (en) * 2007-04-04 2008-10-23 Shinko Electric Ind Co Ltd Semiconductor device and wiring substrate used therein
JP2009016557A (en) * 2007-07-04 2009-01-22 Fujikura Ltd Semiconductor device
WO2011104779A1 (en) * 2010-02-23 2011-09-01 パナソニック株式会社 Semiconductor integrated circuit device
US8101459B2 (en) 2001-08-24 2012-01-24 Micron Technology, Inc. Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetween
CN102956590A (en) * 2011-08-17 2013-03-06 台湾积体电路制造股份有限公司 Dummy flip chip bumps for reducing stress
JP2013214557A (en) * 2012-03-30 2013-10-17 Olympus Corp Electrode forming body, wiring board, and semiconductor device
JP2014132635A (en) * 2012-12-05 2014-07-17 Murata Mfg Co Ltd Electronic component with bump and manufacturing method of electronic component with bump
WO2014112458A1 (en) * 2013-01-16 2014-07-24 ピーエスフォー ルクスコ エスエイアールエル Method for manufacturing semiconductor device

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
AU653610B2 (en) * 1991-07-10 1994-10-06 Sumitomo Electric Industries, Ltd. Semiconductor device
US5700715A (en) * 1994-06-14 1997-12-23 Lsi Logic Corporation Process for mounting a semiconductor device to a circuit substrate
WO1996003020A1 (en) * 1994-07-19 1996-02-01 Olin Corporation Integrally bumped electronic package components
US6097097A (en) * 1996-08-20 2000-08-01 Fujitsu Limited Semiconductor device face-down bonded with pillars
EP1029346A4 (en) * 1997-08-22 2006-01-18 Vertical Circuits Inc Vertical interconnect process for silicon segments with thermally conductive epoxy preform
EP1029346A1 (en) * 1997-08-22 2000-08-23 Vertical Circuits, Inc. Vertical interconnect process for silicon segments with thermally conductive epoxy preform
US6462420B2 (en) * 1999-02-12 2002-10-08 Rohm Co., Ltd. Semiconductor chip and semiconductor device having a chip-on-chip structure
EP1167068A1 (en) * 1999-10-08 2002-01-02 Dai Nippon Printing Co., Ltd. Non-contact data carrier and ic chip
EP1167068A4 (en) * 1999-10-08 2007-04-04 Dainippon Printing Co Ltd Non-contact data carrier and ic chip
US7041533B1 (en) 2000-06-08 2006-05-09 Micron Technology, Inc. Stereolithographic method for fabricating stabilizers for semiconductor devices
US6946732B2 (en) * 2000-06-08 2005-09-20 Micron Technology, Inc. Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the same
US8101459B2 (en) 2001-08-24 2012-01-24 Micron Technology, Inc. Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetween
KR20030026206A (en) * 2001-09-25 2003-03-31 미쓰비시덴키 가부시키가이샤 Semiconductor device
US6677677B2 (en) 2001-09-25 2004-01-13 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
KR20030058703A (en) * 2001-12-31 2003-07-07 엘지전자 주식회사 structure of bear chip connection with printed circuit board
WO2003079439A3 (en) * 2002-03-19 2004-05-21 Koninkl Philips Electronics Nv Chip stack with intermediate cavity
US7242093B2 (en) 2002-07-29 2007-07-10 Nec Electronics Corporation Semiconductor device
US7560810B2 (en) 2002-08-21 2009-07-14 Seiko Epson Corporation Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
JP2004104102A (en) * 2002-08-21 2004-04-02 Seiko Epson Corp Semiconductor device and its manufacturing method, circuit substrate and electronic apparatus
US6960830B2 (en) * 2002-10-31 2005-11-01 Rohm Co., Ltd. Semiconductor integrated circuit device with dummy bumps
US6943060B1 (en) * 2002-12-18 2005-09-13 Netlogic Microsystems, Inc. Method for fabricating integrated circuit package with solder bumps
US6750552B1 (en) * 2002-12-18 2004-06-15 Netlogic Microsystems, Inc. Integrated circuit package with solder bumps
US8474138B2 (en) 2003-06-30 2013-07-02 Brother Kogyo Kabushiki Kaisha Method of manufacturing the ink-jet head
US7360874B2 (en) 2003-06-30 2008-04-22 Brother Kogyo Kabushiki Kaisha Ink-jet printer, ink-jet head and method of manufacturing the ink-jet head
JP4578220B2 (en) * 2004-12-07 2010-11-10 パナソニック株式会社 Semiconductor device
JP2006165209A (en) * 2004-12-07 2006-06-22 Matsushita Electric Ind Co Ltd Semiconductor device and its manufacturing process
JP2007251053A (en) * 2006-03-17 2007-09-27 Fujitsu Ltd Mounting structure of semiconductor device and method of manufacturing mounting structure
JP2008258380A (en) * 2007-04-04 2008-10-23 Shinko Electric Ind Co Ltd Semiconductor device and wiring substrate used therein
JP2009016557A (en) * 2007-07-04 2009-01-22 Fujikura Ltd Semiconductor device
WO2011104779A1 (en) * 2010-02-23 2011-09-01 パナソニック株式会社 Semiconductor integrated circuit device
CN102956590A (en) * 2011-08-17 2013-03-06 台湾积体电路制造股份有限公司 Dummy flip chip bumps for reducing stress
US10290600B2 (en) 2011-08-17 2019-05-14 Taiwan Semiconductor Manufacturing Company, Ltd. Dummy flip chip bumps for reducing stress
US10734347B2 (en) 2011-08-17 2020-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Dummy flip chip bumps for reducing stress
US8912649B2 (en) 2011-08-17 2014-12-16 Taiwan Semiconductor Manufacturing Company, Ltd. Dummy flip chip bumps for reducing stress
US9287234B2 (en) 2011-08-17 2016-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Dummy flip chip bumps for reducing stress
US9711477B2 (en) 2011-08-17 2017-07-18 Taiwan Semiconductor Manufacturing Company, Ltd. Dummy flip chip bumps for reducing stress
JP2013214557A (en) * 2012-03-30 2013-10-17 Olympus Corp Electrode forming body, wiring board, and semiconductor device
JP2014132635A (en) * 2012-12-05 2014-07-17 Murata Mfg Co Ltd Electronic component with bump and manufacturing method of electronic component with bump
WO2014112458A1 (en) * 2013-01-16 2014-07-24 ピーエスフォー ルクスコ エスエイアールエル Method for manufacturing semiconductor device

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