JPH01238148A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH01238148A JPH01238148A JP63065431A JP6543188A JPH01238148A JP H01238148 A JPH01238148 A JP H01238148A JP 63065431 A JP63065431 A JP 63065431A JP 6543188 A JP6543188 A JP 6543188A JP H01238148 A JPH01238148 A JP H01238148A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electrodes
- bump
- equal
- parallelism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 230000002093 peripheral Effects 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Abstract
PURPOSE: To hold the parallelism of a chip with respect to a semiconductor substrate and to improve the connecting strength against a twist or the like by surrounding the periphery of a bump electrode disposed substantially at an equal interval at the center of the chip with a dummy bump wholly in contact with the chip and the substrate.
CONSTITUTION: Bump electrodes 2 are so provided at the center of a chip 1 as to connect circuit elements in the chip to wiring conductors of a supporting board at positions occupying the vertexes of regular triangular shapes. Accordingly, the intervals between the adjacent electrodes 2 are substantially equal. Dummy bumps 3 are provided substantially at equal intervals at the peripheral edges of the chip 1 around the electrodes 2, and further surrounded by resin 4. Accordingly, the parallelism between the chip 1 by the bumps 3 and a circuit board 9 is reinforced to improve its strength against a distortion such as a twist, a thermal stress or the like.
COPYRIGHT: (C)1989,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63065431A JPH01238148A (en) | 1988-03-18 | 1988-03-18 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63065431A JPH01238148A (en) | 1988-03-18 | 1988-03-18 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01238148A true JPH01238148A (en) | 1989-09-22 |
Family
ID=13286906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63065431A Pending JPH01238148A (en) | 1988-03-18 | 1988-03-18 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01238148A (en) |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU653610B2 (en) * | 1991-07-10 | 1994-10-06 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
WO1996003020A1 (en) * | 1994-07-19 | 1996-02-01 | Olin Corporation | Integrally bumped electronic package components |
US5637925A (en) * | 1988-02-05 | 1997-06-10 | Raychem Ltd | Uses of uniaxially electrically conductive articles |
US5700715A (en) * | 1994-06-14 | 1997-12-23 | Lsi Logic Corporation | Process for mounting a semiconductor device to a circuit substrate |
US6097097A (en) * | 1996-08-20 | 2000-08-01 | Fujitsu Limited | Semiconductor device face-down bonded with pillars |
EP1029346A1 (en) * | 1997-08-22 | 2000-08-23 | Vertical Circuits, Inc. | Vertical interconnect process for silicon segments with thermally conductive epoxy preform |
EP1167068A1 (en) * | 1999-10-08 | 2002-01-02 | Dai Nippon Printing Co., Ltd. | Non-contact data carrier and ic chip |
US6462420B2 (en) * | 1999-02-12 | 2002-10-08 | Rohm Co., Ltd. | Semiconductor chip and semiconductor device having a chip-on-chip structure |
KR20030026206A (en) * | 2001-09-25 | 2003-03-31 | 미쓰비시덴키 가부시키가이샤 | Semiconductor device |
KR20030058703A (en) * | 2001-12-31 | 2003-07-07 | 엘지전자 주식회사 | structure of bear chip connection with printed circuit board |
JP2004104102A (en) * | 2002-08-21 | 2004-04-02 | Seiko Epson Corp | Semiconductor device and its manufacturing method, circuit substrate and electronic apparatus |
WO2003079439A3 (en) * | 2002-03-19 | 2004-05-21 | Koninkl Philips Electronics Nv | Chip stack with intermediate cavity |
US6750552B1 (en) * | 2002-12-18 | 2004-06-15 | Netlogic Microsystems, Inc. | Integrated circuit package with solder bumps |
US6946732B2 (en) * | 2000-06-08 | 2005-09-20 | Micron Technology, Inc. | Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the same |
US6960830B2 (en) * | 2002-10-31 | 2005-11-01 | Rohm Co., Ltd. | Semiconductor integrated circuit device with dummy bumps |
JP2006165209A (en) * | 2004-12-07 | 2006-06-22 | Matsushita Electric Ind Co Ltd | Semiconductor device and its manufacturing process |
US7242093B2 (en) | 2002-07-29 | 2007-07-10 | Nec Electronics Corporation | Semiconductor device |
JP2007251053A (en) * | 2006-03-17 | 2007-09-27 | Fujitsu Ltd | Mounting structure of semiconductor device and method of manufacturing mounting structure |
US7360874B2 (en) | 2003-06-30 | 2008-04-22 | Brother Kogyo Kabushiki Kaisha | Ink-jet printer, ink-jet head and method of manufacturing the ink-jet head |
JP2008258380A (en) * | 2007-04-04 | 2008-10-23 | Shinko Electric Ind Co Ltd | Semiconductor device and wiring substrate used therein |
JP2009016557A (en) * | 2007-07-04 | 2009-01-22 | Fujikura Ltd | Semiconductor device |
WO2011104779A1 (en) * | 2010-02-23 | 2011-09-01 | パナソニック株式会社 | Semiconductor integrated circuit device |
US8101459B2 (en) | 2001-08-24 | 2012-01-24 | Micron Technology, Inc. | Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetween |
CN102956590A (en) * | 2011-08-17 | 2013-03-06 | 台湾积体电路制造股份有限公司 | Dummy flip chip bumps for reducing stress |
JP2013214557A (en) * | 2012-03-30 | 2013-10-17 | Olympus Corp | Electrode forming body, wiring board, and semiconductor device |
JP2014132635A (en) * | 2012-12-05 | 2014-07-17 | Murata Mfg Co Ltd | Electronic component with bump and manufacturing method of electronic component with bump |
WO2014112458A1 (en) * | 2013-01-16 | 2014-07-24 | ピーエスフォー ルクスコ エスエイアールエル | Method for manufacturing semiconductor device |
-
1988
- 1988-03-18 JP JP63065431A patent/JPH01238148A/en active Pending
Cited By (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5637925A (en) * | 1988-02-05 | 1997-06-10 | Raychem Ltd | Uses of uniaxially electrically conductive articles |
AU653610B2 (en) * | 1991-07-10 | 1994-10-06 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
US5700715A (en) * | 1994-06-14 | 1997-12-23 | Lsi Logic Corporation | Process for mounting a semiconductor device to a circuit substrate |
WO1996003020A1 (en) * | 1994-07-19 | 1996-02-01 | Olin Corporation | Integrally bumped electronic package components |
US6097097A (en) * | 1996-08-20 | 2000-08-01 | Fujitsu Limited | Semiconductor device face-down bonded with pillars |
EP1029346A4 (en) * | 1997-08-22 | 2006-01-18 | Vertical Circuits Inc | Vertical interconnect process for silicon segments with thermally conductive epoxy preform |
EP1029346A1 (en) * | 1997-08-22 | 2000-08-23 | Vertical Circuits, Inc. | Vertical interconnect process for silicon segments with thermally conductive epoxy preform |
US6462420B2 (en) * | 1999-02-12 | 2002-10-08 | Rohm Co., Ltd. | Semiconductor chip and semiconductor device having a chip-on-chip structure |
EP1167068A1 (en) * | 1999-10-08 | 2002-01-02 | Dai Nippon Printing Co., Ltd. | Non-contact data carrier and ic chip |
EP1167068A4 (en) * | 1999-10-08 | 2007-04-04 | Dainippon Printing Co Ltd | Non-contact data carrier and ic chip |
US7041533B1 (en) | 2000-06-08 | 2006-05-09 | Micron Technology, Inc. | Stereolithographic method for fabricating stabilizers for semiconductor devices |
US6946732B2 (en) * | 2000-06-08 | 2005-09-20 | Micron Technology, Inc. | Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the same |
US8101459B2 (en) | 2001-08-24 | 2012-01-24 | Micron Technology, Inc. | Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetween |
KR20030026206A (en) * | 2001-09-25 | 2003-03-31 | 미쓰비시덴키 가부시키가이샤 | Semiconductor device |
US6677677B2 (en) | 2001-09-25 | 2004-01-13 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
KR20030058703A (en) * | 2001-12-31 | 2003-07-07 | 엘지전자 주식회사 | structure of bear chip connection with printed circuit board |
WO2003079439A3 (en) * | 2002-03-19 | 2004-05-21 | Koninkl Philips Electronics Nv | Chip stack with intermediate cavity |
US7242093B2 (en) | 2002-07-29 | 2007-07-10 | Nec Electronics Corporation | Semiconductor device |
US7560810B2 (en) | 2002-08-21 | 2009-07-14 | Seiko Epson Corporation | Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
JP2004104102A (en) * | 2002-08-21 | 2004-04-02 | Seiko Epson Corp | Semiconductor device and its manufacturing method, circuit substrate and electronic apparatus |
US6960830B2 (en) * | 2002-10-31 | 2005-11-01 | Rohm Co., Ltd. | Semiconductor integrated circuit device with dummy bumps |
US6943060B1 (en) * | 2002-12-18 | 2005-09-13 | Netlogic Microsystems, Inc. | Method for fabricating integrated circuit package with solder bumps |
US6750552B1 (en) * | 2002-12-18 | 2004-06-15 | Netlogic Microsystems, Inc. | Integrated circuit package with solder bumps |
US8474138B2 (en) | 2003-06-30 | 2013-07-02 | Brother Kogyo Kabushiki Kaisha | Method of manufacturing the ink-jet head |
US7360874B2 (en) | 2003-06-30 | 2008-04-22 | Brother Kogyo Kabushiki Kaisha | Ink-jet printer, ink-jet head and method of manufacturing the ink-jet head |
JP4578220B2 (en) * | 2004-12-07 | 2010-11-10 | パナソニック株式会社 | Semiconductor device |
JP2006165209A (en) * | 2004-12-07 | 2006-06-22 | Matsushita Electric Ind Co Ltd | Semiconductor device and its manufacturing process |
JP2007251053A (en) * | 2006-03-17 | 2007-09-27 | Fujitsu Ltd | Mounting structure of semiconductor device and method of manufacturing mounting structure |
JP2008258380A (en) * | 2007-04-04 | 2008-10-23 | Shinko Electric Ind Co Ltd | Semiconductor device and wiring substrate used therein |
JP2009016557A (en) * | 2007-07-04 | 2009-01-22 | Fujikura Ltd | Semiconductor device |
WO2011104779A1 (en) * | 2010-02-23 | 2011-09-01 | パナソニック株式会社 | Semiconductor integrated circuit device |
CN102956590A (en) * | 2011-08-17 | 2013-03-06 | 台湾积体电路制造股份有限公司 | Dummy flip chip bumps for reducing stress |
US10290600B2 (en) | 2011-08-17 | 2019-05-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dummy flip chip bumps for reducing stress |
US10734347B2 (en) | 2011-08-17 | 2020-08-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dummy flip chip bumps for reducing stress |
US8912649B2 (en) | 2011-08-17 | 2014-12-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dummy flip chip bumps for reducing stress |
US9287234B2 (en) | 2011-08-17 | 2016-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dummy flip chip bumps for reducing stress |
US9711477B2 (en) | 2011-08-17 | 2017-07-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dummy flip chip bumps for reducing stress |
JP2013214557A (en) * | 2012-03-30 | 2013-10-17 | Olympus Corp | Electrode forming body, wiring board, and semiconductor device |
JP2014132635A (en) * | 2012-12-05 | 2014-07-17 | Murata Mfg Co Ltd | Electronic component with bump and manufacturing method of electronic component with bump |
WO2014112458A1 (en) * | 2013-01-16 | 2014-07-24 | ピーエスフォー ルクスコ エスエイアールエル | Method for manufacturing semiconductor device |
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