JPH01224124A - Fin tube type heat exchanger and its manufacture - Google Patents
Fin tube type heat exchanger and its manufactureInfo
- Publication number
- JPH01224124A JPH01224124A JP5093488A JP5093488A JPH01224124A JP H01224124 A JPH01224124 A JP H01224124A JP 5093488 A JP5093488 A JP 5093488A JP 5093488 A JP5093488 A JP 5093488A JP H01224124 A JPH01224124 A JP H01224124A
- Authority
- JP
- Japan
- Prior art keywords
- tube
- heat
- honeycomb plate
- fin
- honeycomb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 14
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、熱媒体流通用のチューブとハニカム板を利用
したフィンとを備えたフィンチューブ型熱交換器に関す
る。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a fin-tube heat exchanger equipped with tubes for heat medium circulation and fins using honeycomb plates.
（従来技術及びその間居点）
従来から半導体ヒートシンクの分野では、半導体から発
生した熱を能率よく冷却するために各種の冷却器が開発
されているが、さらに能率のよい冷却器が要望されてい
る。(Prior art and its location) In the field of semiconductor heat sinks, various types of coolers have been developed to efficiently cool the heat generated from semiconductors, but there is a demand for even more efficient coolers. .
ところで、冷却器の放熱フィンの素材としてハニカム板
が優れた特性を備えていることは、従来から周知である
が、ハニカム板とチューブとの接合部が線接触になって
しまい、ハニカム板の特性を十分に発揮したハニカム状
の放熱フィンは未だ知られていない。By the way, it has long been known that honeycomb boards have excellent properties as a material for the heat dissipation fins of coolers. There is still no known honeycomb-shaped heat dissipation fin that fully demonstrates this.
（発明の目的）
本発明は、ハニカム板の放熱吸熱フィンの素材としての
優れた特性を発揮し得るフィンチューブ型熱交換器及び
その製造方法を提供することを目的としている。(Objective of the Invention) An object of the present invention is to provide a fin-tube heat exchanger that can exhibit excellent properties as a material for heat-radiating and heat-absorbing honeycomb plate fins, and a method for manufacturing the same.
（発明の構成）
（１）技術的手段
第１発明は、内部に熱媒体が流通するチューブの一端部
に熱源を取付ける熱源取付部を設け、チューブの他端部
にハニカム板を、ハニカム板の冷却風流通方向の端面に
形成した溝でチューブの両面からチューブを挟むように
固ｍして放熱吸熱用のフィンを設け、前記フィンとチュ
ーブとが面接触するように前記溝の端面に面状密着部を
形成し、面状密着部でフィンとチューブの伝熱効率を向
上するようにしたことを特徴とするフィンチューブ型熱
交換器である。(Structure of the Invention) (1) Technical Means The first invention provides a heat source attachment part for attaching a heat source to one end of a tube through which a heat medium flows, and a honeycomb plate to the other end of the tube. Fins for heat dissipation and heat absorption are provided by solidifying grooves formed on the end faces in the cooling air flow direction so as to sandwich the tube from both sides of the tube, and planar grooves are formed on the end faces of the grooves so that the fins and the tube are in surface contact with each other. This is a fin-tube type heat exchanger characterized in that a contact portion is formed and the heat transfer efficiency between the fins and the tube is improved by the planar contact portion.
第２発明は、熱媒体流通用のチューブの一端部に熱源を
取付ける熱源取付部を形成し、ハニカム板の冷却風流通
方向の一面に、チューブとチューブを挾むハニカム板の
溝が面接触するように溝の表面を押潰した面状密着部を
プレス加工で形成し、この面状密着部でチューブの他端
部とハニカム板が面接触するようにハニカム板をチュー
ブの両面に固着して放熱吸熱用のフィンを形成したこと
を特徴とするフィンチューブ型熱交換器の製造方法であ
る。The second invention forms a heat source attachment part for attaching a heat source to one end of a tube for heat medium circulation, and the grooves of the honeycomb plate sandwiching the tubes are in surface contact with one surface of the honeycomb plate in the cooling air circulation direction. A planar contact part is formed by pressing the surface of the groove as shown in FIG. This is a method for manufacturing a fin tube type heat exchanger, characterized in that fins for heat radiation and heat absorption are formed.
（２）作用
第１発明では、面状密着部でチューブとハニカム板との
間の熱伝達効率を上げ、熱交換器の能率を向上する。(2) Effects In the first invention, the heat transfer efficiency between the tube and the honeycomb plate is increased in the planar close contact portion, and the efficiency of the heat exchanger is improved.
第２発明では、プレス加工で容易にハニカム板に面状密
着部を形成し、ハニカム板を利用した熱交換器の生産性
を上げる。In the second invention, a planar contact portion is easily formed on a honeycomb plate by press working, thereby increasing the productivity of a heat exchanger using a honeycomb plate.
（実施例）
本発明を採用した半導体ヒートシンク用のフィンチュー
ブ冷却器を示す第１図で、１０は内部に熱媒体を収容し
たチューブである。このチューブ１０は銅又はアルミ製
であり、銅製の場合は水又はフレオンを熱媒体に使用し
、アルミ製の場合はフレオンを熱媒体に使用する。いず
れの場合も熱媒体は、体積比で略３０％だけ封入する。(Example) In FIG. 1 showing a fin tube cooler for a semiconductor heat sink employing the present invention, 10 is a tube containing a heat medium therein. This tube 10 is made of copper or aluminum, and if it is made of copper, water or Freon is used as the heat medium, and if it is made of aluminum, Freon is used as the heat medium. In either case, approximately 30% by volume of the heat medium is enclosed.
チューブ１０の図中の左端部には、被冷却発熱体である
半導体１２を取付けるベースプレート１４（熱源取付部
）が設けられている。なお、熱源は発熱体に限らず、冷
熱の場合もある。アルミ板製のベースプレート１４はチ
ューブ１０を通す溝１５（第２図）が裏面に形成され、
２枚のベースプレート１４を四隅のビス１６でチューブ
１０を挟み付けるように固定してある。A base plate 14 (heat source attachment part) is provided at the left end of the tube 10 in the figure to which a semiconductor 12, which is a heat generating element to be cooled, is attached. Note that the heat source is not limited to a heating element, but may also be a cold source. The base plate 14 made of an aluminum plate has a groove 15 (FIG. 2) formed on the back surface for passing the tube 10 through.
Two base plates 14 are fixed with screws 16 at the four corners so as to sandwich the tube 10 therebetween.
第１図で、チューブ１０の右端部には、ベースプレート
１４からチューブ１０に伝わる熱を放熱するフィン２０
が設けられている。このフィン２０はアルミ製のハニカ
ム板２１に溝２５を詳しくは後述するように形成して溝
２５の部分で、２枚のハニカム板２１（第２図）でチュ
ーブ１０を挟み付けるように接着等の手段で固着してあ
る。接着の他には、「ろう付け」等の手段がある。In FIG. 1, a fin 20 is provided at the right end of the tube 10 to radiate heat transmitted from the base plate 14 to the tube 10.
is provided. The fins 20 are made by forming grooves 25 in an aluminum honeycomb plate 21 as will be described in detail later, and by gluing or otherwise sandwiching the tube 10 between the two honeycomb plates 21 (Fig. 2) at the grooves 25. It is fixed by means of. In addition to adhesion, there are other methods such as "brazing".
この溝２５は、第３図、第４図に示すように、ハニカム
板２１の端面２３の一部を押し潰して、半円形をなし、
端面に所定の面積を有する面状密着部２２を形成してあ
る。As shown in FIGS. 3 and 4, this groove 25 is formed into a semicircular shape by crushing a part of the end surface 23 of the honeycomb plate 21.
A planar contact portion 22 having a predetermined area is formed on the end face.
以上の構成では、半導体１２の発熱量がベースプレート
１４に伝わり、ベースプレート１４に挟み付けられてい
る部分のチューブ１０で熱媒体が蒸発し、熱をフィン２
０へ伝える。フィン２０では、第１図の紙面に直角方向
に流れる冷却風がフィン２０の通路２４を通ることによ
って、チューブ１０からフィン２０に伝わる半導体１２
の発熱量が放熱し、このフィン２０部分でチューブ１０
内の熱媒体が再び凝縮して半導体１２を冷却する。In the above configuration, the amount of heat generated by the semiconductor 12 is transmitted to the base plate 14, the heat medium is evaporated in the portion of the tube 10 sandwiched between the base plate 14, and the heat is transferred to the fins 14.
Tell 0. In the fin 20, the semiconductor 12 is transmitted from the tube 10 to the fin 20 by the cooling air flowing in a direction perpendicular to the paper plane of FIG.
The amount of heat generated is radiated, and the tube 10 is
The heat medium inside condenses again and cools the semiconductor 12.
フィン２０を形成するハニカム板２１は従来から周知の
通り、包絡面積に対して表面積が大きく、放熱フィンの
素材として優れた特性を備えているが、従来ではチュー
ブ１０とハニカム板２１の接合部が線接触になっており
、チューブ１０とハニカム板２１との熱伝達効率が低く
、ハニカム板２１の放熱能力を十分に発揮していない。As is conventionally known, the honeycomb plate 21 forming the fin 20 has a large surface area relative to the envelope area and has excellent properties as a material for heat dissipation fins. Since they are in line contact, the heat transfer efficiency between the tubes 10 and the honeycomb plates 21 is low, and the heat dissipation ability of the honeycomb plates 21 is not fully demonstrated.
そこで、本発明の場合では、ハニカム板２１の溝２５に
面状密着部２２を形成して、チューブ１０とハニカム板
２１を面状密着部２２で面接触するようにして、チュー
ブ１０とハニカム板２１間の熱伝達効率を上げ、ハニカ
ム板２１の放熱能力を発揮し、半導体１２を高能率で冷
却する。Therefore, in the case of the present invention, the planar contact portion 22 is formed in the groove 25 of the honeycomb plate 21 so that the tube 10 and the honeycomb plate 21 are in surface contact with each other at the planar contact portion 22. The heat transfer efficiency between the honeycomb plates 21 is increased, the heat dissipation ability of the honeycomb plate 21 is exhibited, and the semiconductor 12 is cooled with high efficiency.
次に、第５図で第１図のヒートシンク用冷却器の製造方
法を説明する。まず第５図（ａ）で、周知のように帯状
のアルミ板を積層して部分的に接着し、積層方向に引き
伸ばして六角柱状の通路２４を有するハニカム板２１を
形成する。・第５図（ｂ）では、ハニカム板２１の端面
２３にプレス型３０を押し付けて、プレス型３ｏの突起
部３１で、第５図（Ｃ）の溝２５をハニカム板２１に形
成する。溝２５の端面は突起部３１で押し潰されること
になるので、溝２５の端面が所定の面積を有する面状密
着部２２になる。Next, a method of manufacturing the heat sink cooler shown in FIG. 1 will be explained with reference to FIG. First, as shown in FIG. 5(a), as is well known, strip-shaped aluminum plates are laminated and partially adhered, and stretched in the lamination direction to form a honeycomb plate 21 having hexagonal columnar passages 24. - In FIG. 5(b), the press die 30 is pressed against the end surface 23 of the honeycomb plate 21, and the grooves 25 in FIG. 5(C) are formed in the honeycomb plate 21 using the projections 31 of the press die 3o. Since the end face of the groove 25 is crushed by the protrusion 31, the end face of the groove 25 becomes a planar contact portion 22 having a predetermined area.
一方、チューブ１０は第５図（ｄ）のように内部に熱媒
体を突起１１から封入し、突起１１を封止する。このチ
ューブ１０を第５図（ｅ）で、接着剤３４を貯留する容
器３５に浸漬してチューブ１゜に接着材を塗布する。接
着剤としては、エポキシ系やアクリル系、若しくは半田
等を使用する。なお、第５図（ａ）〜（ｃ）の工程と第
５図（ｄ）〜（Ｃ）の工程は並行して行うのが、良いが
、第５図（ｄ）の熱媒体封入工程は、任意の工程で行う
ことが可能である。On the other hand, as shown in FIG. 5(d), the tube 10 encloses a heat medium therein through the protrusion 11 and seals the protrusion 11. As shown in FIG. 5(e), this tube 10 is immersed in a container 35 for storing an adhesive 34, and the adhesive is applied to the tube 1°. As the adhesive, epoxy, acrylic, solder, or the like is used. Note that it is better to perform the steps in FIGS. 5(a) to 5(c) and the steps in FIG. 5(d) to (C) in parallel, but the heat medium encapsulation step in FIG. 5(d) , can be performed in any step.
以上のようにして製造したチューブ１ｏとハニカム板２
１を、第５図（ｒ）でチューブ１ｏの接着材を塗布した
部分に両面からハニカム板２１の溝２５を接着し、ハニ
カム板２１を矢印方向に圧接シテ、前記フィン２０を形
成する。このフィン２０では、ハニカム板２１の接合面
に微少な隙間３６を隔て、フィン２０の放熱能力を向上
するようにしてある。最後に、第５図（ｇ）でベースプ
レート１４をチューブ１０に固定する。Tube 1o and honeycomb plate 2 manufactured as above
1, the grooves 25 of the honeycomb plate 21 are adhered from both sides to the adhesive-applied portion of the tube 1o as shown in FIG. 5(r), and the honeycomb plate 21 is pressed in the direction of the arrow to form the fins 20. In this fin 20, a small gap 36 is provided between the bonding surfaces of the honeycomb plates 21 to improve the heat dissipation ability of the fin 20. Finally, the base plate 14 is fixed to the tube 10 as shown in FIG. 5(g).
以上の製造方法によれば、突起部３１を有するプレス型
３０でハニカム板２１をプレス加工するだけでよいので
、ハニカム板２１に面状密着部２２が形成された溝２５
の加工が従来より簡単になる。しかも、？ａ２５の端面
に面５状密着部２２が形成され、チューブ１０とハニカ
ム板２１の接触面積が面状密着部２２の分だけ増え、チ
ューブ１０とハニカム板２１間の熱伝達効率が向上する
。According to the above manufacturing method, it is only necessary to press the honeycomb plate 21 with the press die 30 having the projections 31.
processing becomes easier than before. Moreover,? A five-sided contact portion 22 is formed on the end face of a25, and the contact area between the tube 10 and the honeycomb plate 21 increases by the amount of the contact area 22, improving the heat transfer efficiency between the tube 10 and the honeycomb plate 21.
従来のようにハニカム板２１のアルミ帯状板２６に切削
加工で溝２５を形成する場合には、アルミ帯状板２６が
薄いので、アルミ帯状板２６を引き伸ばす前の積層した
状態で溝２５を切削加工する必要があり、アルミ帯状板
２６を引き伸ばした後に、略半円形になるようにアルミ
帯状板２６を切削することは困難である。When forming the grooves 25 in the aluminum strip plate 26 of the honeycomb plate 21 by cutting as in the conventional method, since the aluminum strip plate 26 is thin, the groove 25 is cut while the aluminum strip plates 26 are stacked before being stretched. Therefore, it is difficult to cut the aluminum strip plate 26 into a substantially semicircular shape after stretching the aluminum strip plate 26.
（別の実施例）
（１） 本発明によるフィンチューブ型熱交換器は、以
上のように半導体用のヒートシンクに採用する場合に限
らず、少くとも熱交換を必要とする分野に応用すること
ができる。(Another Example) (1) The fin-tube heat exchanger according to the present invention is not limited to being used as a heat sink for semiconductors as described above, but can be applied at least to fields that require heat exchange. can.
特に、冷温蔵庫の熱交換器に使用する場合は、チューブ
１０の両端を切断して熱媒体のコンデンサーに接続すれ
ばよい。In particular, when used in a heat exchanger for a cold storage, both ends of the tube 10 may be cut and connected to a heat medium condenser.
（２） ハニカム板２１の押し潰しによる溝２５の形成
は、チューブ１０を接着する場合に溝２５を利用する場
合に限らず、例えば第５図（ｃ）の部分４０．４１等の
位置に、冷却風に乱流を起こして、ハニカム板２１の放
熱能力を一層向上するようにしてもよい。(2) The formation of the grooves 25 by crushing the honeycomb plate 21 is not limited to the case where the grooves 25 are used when bonding the tube 10. The heat radiation ability of the honeycomb plate 21 may be further improved by causing turbulence in the cooling air.
更に、チューブ１０やベースプレート１４を設けずに、
ハニカム板２１単体で部分４０，４１に直接に熱源とな
る発熱体を固着することもできる。Furthermore, without providing the tube 10 or the base plate 14,
A heating element serving as a heat source can also be directly fixed to the portions 40 and 41 of the honeycomb plate 21 alone.
なお、溝２５はハニカム板２１の両面に形成する場合も
ある。また、溝２５も半円形の場合に限らず、チューブ
１０の断面形状によっては角形の溝でもよい。Note that the grooves 25 may be formed on both sides of the honeycomb plate 21. Further, the groove 25 is not limited to a semicircular shape, but may be a rectangular groove depending on the cross-sectional shape of the tube 10.
（発明の効果）
以上説明したように第１発明によるフィンチューブ型熱
交換器では、内部に熱媒体が流通するチューブ１０の一
端部に半導体１２（熱源）を取付けるベースプレート１
４（熱源取付部）を設け、チューブ１０の他端部にハニ
カム板２１を、チューブ１０の両面からチューブ１ｏを
挾むように固着して放熱吸熱用のフィン２０を設け、前
記フィン２０とチューブ１０とが面接触するようにハニ
カム板２１に面状密着部２２を形成し、面状密着部２２
でフィン２０とチューブ１０の伝熱効率を向上するよう
にしたので、ハニカム板２１の溝２５に面状密着部２２
を形成でき、チューブ１０とハニカム板２１を面状密着
部２２で面接触させることができ、チューブ１０とハニ
カム板２１間の熱伝達効率が上り、ハニカム板２１の放
熱能力を十分に発揮でき、半導体１２を高能率で冷却す
ることができる。(Effects of the Invention) As explained above, in the fin-tube heat exchanger according to the first invention, the base plate 1 has the semiconductor 12 (heat source) attached to one end of the tube 10 through which the heat medium flows.
4 (heat source attachment part), a honeycomb plate 21 is fixed to the other end of the tube 10 so as to sandwich the tube 1o from both sides of the tube 10, and fins 20 for heat dissipation and heat absorption are provided. A planar contact portion 22 is formed on the honeycomb plate 21 so that the planar contact portions 22 are in surface contact with each other.
Since the heat transfer efficiency between the fins 20 and the tube 10 is improved, the planar contact portion 22 is formed in the groove 25 of the honeycomb plate 21.
can be formed, the tube 10 and the honeycomb plate 21 can be brought into surface contact at the planar contact portion 22, the heat transfer efficiency between the tube 10 and the honeycomb plate 21 is increased, and the heat dissipation ability of the honeycomb plate 21 can be fully demonstrated. The semiconductor 12 can be cooled with high efficiency.
次に、第２発明のフィンチューブ型熱交換器の製造方法
では、ハニカム板２１の一面２３に、チューブ１０が面
接触するようにハニカム板２１の表面を押潰した溝状の
面状密着部２２をプレス加工で形成するようにしたので
、突起部３１を有するプレス型３０でハニカム板２１を
プレス加工するだけでよくなり、ハニカム板２１に面状
密着部２２が形成された溝２５を従来より大巾に簡単に
形成できる。Next, in the method for manufacturing a fin-tube heat exchanger of the second invention, a groove-like planar contact portion is formed by crushing the surface of the honeycomb plate 21 so that the tube 10 is in surface contact with the one surface 23 of the honeycomb plate 21. 22 is formed by press working, it is only necessary to press the honeycomb plate 21 with the press die 30 having the projections 31, and the grooves 25 in which the planar contact parts 22 are formed in the honeycomb plate 21 can be formed using the conventional method. It can be easily formed into a wider width.
ハニカム板２１の冷却風流通方向の一面２３に、チュー
ブ１０とチューブ１０を挾むハニカム板２１の満２５が
面接触するように溝２５の表面を押潰した面状密着部２
２をプレス加工で形成するようにしたので、ハニカム板
２１の強度が強い方向にプレス加工することになり、ハ
ニカム板２１を第５図（ｂ）のプレス型３０でプレス加
工しても面状密着部２２を形成するのに必要な溝２５の
縁部だけを圧潰することができ、ハニカム板２１の他の
部分は変形せず、容易にハニカム板２１に溝２５と面状
密着部２２を形成できる。A planar contact portion 2 in which the surface of the groove 25 is crushed so that the tube 10 and the honeycomb plate 21 sandwiching the tube 10 are in surface contact with one surface 23 of the honeycomb plate 21 in the cooling air flow direction.
Since the honeycomb plate 21 is formed by press working, the honeycomb plate 21 is pressed in the direction where its strength is strong. It is possible to crush only the edges of the grooves 25 necessary to form the close contact portions 22, the other portions of the honeycomb plate 21 are not deformed, and the grooves 25 and the planar close contact portions 22 are easily formed on the honeycomb plate 21. Can be formed.
特に、２枚のハニカム板２１の間に隙間３６（第５図（
ｆ））を形成した場合には、隙間３６に冷却風が流れ、
−層フイン２０の放熱能力が向上する。In particular, there is a gap 36 between the two honeycomb plates 21 (see Fig. 5).
f)), cooling air flows through the gap 36,
- The heat dissipation ability of the layer fins 20 is improved.
第１図は本発明を採用した半導体ヒートシンクの平面図
、第２図は第１図の■矢視図、第３図はハニカム板の平
面図、第４図は第３図の■矢視図、第５図は半導体ヒー
トシンクの製造工程を示す工程図である。１０・・・チ
ューブ、１４・・・ペースブレート、２０・・・フィン
、２２・・・面状密着部、２５・・・溝、３０・・・プ
レス型、３１・・・突起部特許出願人 日本アルミニウ
ム工業株式会社代理人 弁理士 大森忠孝・−）−
Ｃｂ）Figure 1 is a plan view of a semiconductor heat sink adopting the present invention, Figure 2 is a view in the direction of the ■ arrow in Figure 1, Figure 3 is a plan view of a honeycomb plate, and Figure 4 is a view in the direction of the ■ arrow in Figure 3. , FIG. 5 is a process diagram showing the manufacturing process of a semiconductor heat sink. DESCRIPTION OF SYMBOLS 10... Tube, 14... Pace plate, 20... Fin, 22... Planar contact part, 25... Groove, 30... Press mold, 31... Projection patent applicant Japan Aluminum Industry Co., Ltd. Representative Patent Attorney Tadataka Omori・-)-Cb)
Claims (3)
を取付ける熱源取付部を設け、チューブの他端部にハニ
カム板を、ハニカム板の冷却風流通方向の端面に形成し
た溝でチューブの両面からチューブを挟むように固着し
て放熱吸熱用のフィンを設け、前記フィンとチューブと
が面接触するように前記溝の端面に面状密着部を形成し
、面状密着部でフィンとチューブの伝熱効率を向上する
ようにしたことを特徴とするフィンチューブ型熱交換器
。(1) A heat source attachment part for attaching a heat source is provided at one end of the tube through which the heat medium flows, a honeycomb plate is provided at the other end of the tube, and a groove formed on the end face of the honeycomb plate in the direction of cooling air is used to connect the tube. Fins are fixed to sandwich the tube from both sides for heat dissipation and heat absorption, and planar contact parts are formed on the end faces of the grooves so that the fins and the tube are in surface contact, and the planar contact parts are used to connect the fins and the tube. A fin-tube heat exchanger characterized by improved heat transfer efficiency.
ある特許請求の範囲第１項記載のフィンチューブ型熱交
換器。(2) The fin-tube heat exchanger according to claim 1, wherein a minute gap is formed at the seam of the honeycomb plates.
る熱源取付部を形成し、ハニカム板の冷却風流通方向の
一面に、チューブとチューブを挾むハニカム板の溝が面
接触するように溝の表面を押潰した面状密着部をプレス
加工で形成し、この面状密着部でチューブの他端部とハ
ニカム板が面接触するようにハニカム板をチューブの両
面に固着して放熱吸熱用のフィンを形成したことを特徴
とするフィンチューブ型熱交換器の製造方法。(3) A heat source attachment part is formed at one end of the tube for heat medium circulation, and the grooves of the honeycomb plate sandwiching the tubes are in surface contact with one side of the honeycomb plate in the cooling air circulation direction. A planar contact part is formed by pressing the surface of the groove, and the honeycomb plate is fixed to both sides of the tube so that the other end of the tube and the honeycomb board are in surface contact at this planar contact part, thereby dissipating heat and absorbing heat. A method for manufacturing a fin-tube heat exchanger, characterized in that fins are formed for use in the fin-tube heat exchanger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5093488A JPH01224124A (en) | 1988-03-03 | 1988-03-03 | Fin tube type heat exchanger and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5093488A JPH01224124A (en) | 1988-03-03 | 1988-03-03 | Fin tube type heat exchanger and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01224124A true JPH01224124A (en) | 1989-09-07 |
| JPH0249813B2 JPH0249813B2 (en) | 1990-10-31 |
Family
ID=12872649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5093488A Granted JPH01224124A (en) | 1988-03-03 | 1988-03-03 | Fin tube type heat exchanger and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01224124A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111491874B (en) | 2017-12-18 | 2021-02-23 | 日铁系统集成株式会社 | Vehicle dispatch management device, vehicle dispatch management system, vehicle dispatch management method, program, and storage medium |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4894046A (en) * | 1972-03-13 | 1973-12-04 | ||
| JPS5111059A (en) * | 1974-07-18 | 1976-01-28 | Fuji Heavy Ind Ltd | Netsukokankyofuinno seizosochi |
| JPS5832535A (en) * | 1981-08-20 | 1983-02-25 | Mitsubishi Keikinzoku Kogyo Kk | Method and device for connection between plate material and tube |
-
1988
- 1988-03-03 JP JP5093488A patent/JPH01224124A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4894046A (en) * | 1972-03-13 | 1973-12-04 | ||
| JPS5111059A (en) * | 1974-07-18 | 1976-01-28 | Fuji Heavy Ind Ltd | Netsukokankyofuinno seizosochi |
| JPS5832535A (en) * | 1981-08-20 | 1983-02-25 | Mitsubishi Keikinzoku Kogyo Kk | Method and device for connection between plate material and tube |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0249813B2 (en) | 1990-10-31 |
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