CN219609138U

CN219609138U - Semiconductor chip test fixture

Info

Publication number: CN219609138U
Application number: CN202320089595.7U
Authority: CN
Inventors: 刘明华; 甘健康
Original assignee: CHENGDU SHANGMING INDUSTRIAL CO LTD
Current assignee: CHENGDU SHANGMING INDUSTRIAL CO LTD
Priority date: 2023-01-31
Filing date: 2023-01-31
Publication date: 2023-08-29
Anticipated expiration: 2033-01-31

Abstract

The utility model belongs to the technical field of semiconductor test. In view of the problem that the existing semiconductor chip has poor heat dissipation effect in the test process, the utility model discloses a semiconductor chip test fixture, which structurally comprises a test platform, wherein the inside of the test platform is hollow, and a water inlet pipe and a water outlet pipe which are communicated with the inside of the test platform are arranged at the side parts of the test platform; the upper surface of the test platform is provided with a test groove for placing a semiconductor chip; the semiconductor refrigerating sheet is arranged in the test groove; the hot surface of the semiconductor refrigerating sheet is attached to the bottom of the test groove; the heat dissipation fins are fixedly connected with the hot surface of the semiconductor refrigerating sheet and extend to the inside of the test platform through the test groove; when in test, the cooling medium enters the test platform from the water inlet pipe and flows out from the water outlet pipe to form flow inside the test platform, so that heat of the radiating fins is taken away. The test fixture can rapidly take away heat generated in the test process of the semiconductor chip, and has good heat dissipation effect.

Description

Semiconductor chip test fixture

Technical Field

The utility model belongs to the technical field of semiconductor testing, and particularly relates to a semiconductor chip testing jig.

Background

After the semiconductor chip is manufactured, various data performances are required to be tested. In order to detect the output stability of the semiconductor chip, the semiconductor chip needs to be tested under the conditions of rated power and full power, and under the condition, a large amount of heat energy is released, so that an external heat dissipation device is required to rapidly dissipate heat and cool the semiconductor chip.

The existing heat dissipation modes are mostly air cooling, liquid cooling and the like, heat cannot be rapidly taken away under full-load power operation, only one part of the semiconductor chip can be directly dissipated, and the problems of low heat dissipation efficiency and poor heat dissipation effect exist.

Disclosure of Invention

In view of the problems of poor heat dissipation effect and low heat dissipation efficiency of the conventional semiconductor chip during testing, one of the purposes of the present utility model is to provide a semiconductor chip testing fixture, which can rapidly take away heat, thereby being beneficial to improving heat dissipation efficiency and heat dissipation effect.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the semiconductor chip testing jig comprises a testing platform, wherein the inside of the testing platform is hollow, and a water inlet pipe and a water outlet pipe which are communicated with the inside of the testing platform are arranged at the side part of the testing platform; the upper surface of the test platform is provided with a test groove for placing a semiconductor chip; a semiconductor refrigeration piece mounted in the test slot; the hot surface of the semiconductor refrigeration piece is attached to the bottom of the test groove; the plurality of groups of radiating fins are fixedly connected with the hot surface of the semiconductor refrigerating sheet and extend to the inside of the test platform through the test groove.

When in testing, the cooling medium enters the testing platform from the water inlet pipe and flows out from the water outlet pipe so as to form flow inside the testing platform, thereby taking away the heat of the radiating fins.

In one of the technical schemes of the utility model, the radiating surface of the radiating fin is wavy.

In one of the technical schemes of the utility model, the water inlet pipe and the water outlet pipe are arranged on two opposite sides of the test platform;

correspondingly, a plurality of groups of the radiating fins are arranged side by side along the direction perpendicular to the flow direction of the cooling medium.

In one of the technical schemes of the utility model, a plurality of groups of the radiating fins are uniformly arranged at equal intervals along the direction perpendicular to the flowing direction of the cooling medium.

In one embodiment of the present utility model, the wave is a sine wave or a triangle wave.

In one of the technical schemes of the utility model, the semiconductor refrigerating sheet also comprises a heat conducting substrate which is attached to the cold face of the semiconductor refrigerating sheet.

In one of the technical schemes of the utility model, the connection mode of the semiconductor refrigerating sheet, the heat conducting substrate and the radiating fins is screw fixation or resin gluing or welding fixation.

In one of the embodiments of the present utility model, the heat-conducting substrate and the heat-dissipating fins are made of copper or aluminum.

As can be seen from the above description, compared with the prior art, the utility model has the following beneficial effects:

1. when testing, the semiconductor chip used as a heat dissipation source is connected with the cold face of the semiconductor refrigerating sheet through the heat conducting base plate, the cooling medium flows on the test platform, heat on the heat dissipation fins is taken away, and therefore heat generated in the semiconductor chip testing process is transferred to the cooling medium in a heat transfer mode, heat dissipation is achieved, the heat can be quickly taken away in the mode, and the heat dissipation effect is good.

2. The water inlet pipe and the water outlet pipe are arranged on two opposite sides of the test platform, and the radiating fins are arranged at equal intervals perpendicular to the flowing direction of the cooling medium, so that the flowing speed of the cooling medium can be improved; meanwhile, the radiating surfaces of the radiating fins are wavy, and the radiating surfaces are matched with each other, so that the radiating effect of the radiating fins is improved.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are necessary for the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic three-dimensional structure of the present utility model.

Fig. 2 is a top view of the present utility model.

Fig. 3 is a schematic cross-sectional view taken along line A-A' of fig. 2.

Fig. 4 is a schematic cross-sectional view taken along line B-B' of fig. 2.

Fig. 5 is a schematic view of a plurality of sets of heat dissipating fins.

Reference numerals: 1-a test bench is flat; 11-a water inlet pipe; 12-a water outlet pipe; 13-a test slot; 2-semiconductor refrigerating sheets; 3-heat radiating fins.

Detailed Description

Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, in the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

Embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.

The embodiment of the utility model discloses a testing jig for a semiconductor chip, which has the structure shown in figures 1-5 and comprises a testing platform 1, a semiconductor refrigerating sheet 2 and radiating fins 3.

Specifically, as shown in fig. 4, the test platform 1 is hollow, and a water inlet pipe 11 and a water outlet pipe 12 which are communicated with the internal cavity of the test platform 1 are arranged at the side parts. The upper surface of the test platform 1 is provided with a test slot 13 for receiving a semiconductor chip to be tested.

The semiconductor refrigeration piece 2 is arranged in the test groove 13, the hot surface of the semiconductor refrigeration piece is attached to the bottom of the test groove 13, and the cold surface of the semiconductor refrigeration piece faces upwards.

The heat radiating fins 3 and the semiconductor refrigerating plate 2 are fixedly connected on the hot surfaces and extend into the inner cavity of the test platform 1 through the test groove 13.

When the structure is adopted to work, when the semiconductor chip is required to be tested, the semiconductor chip is firstly placed in the test groove 13, and then the semiconductor chip is tested; at this time, the semiconductor refrigerating sheet 2 is opened, a cooling medium such as water enters the test platform 1 from the water inlet pipe 11 and is discharged from the water outlet pipe 12, and flow is formed in the test platform 1, so that heat of the radiating fins 3 is taken away, and heat dissipation is realized; the method can rapidly take away the heat generated by the semiconductor chip in the test process, and has the advantages of high heat dissipation efficiency and good heat dissipation effect.

In one embodiment of the present utility model, in order to increase the heat transfer rate between the semiconductor refrigeration sheet 2 and the semiconductor chip, the cold side of the semiconductor refrigeration sheet 2 is provided with a heat conductive substrate (not shown in the drawings) in a bonding manner.

In one embodiment of the present utility model, as shown in fig. 5, in order to enhance the heat dissipation effect of the heat dissipation fin 3, the surface shape of the heat dissipation surface of the heat dissipation fin 3 is wave-shaped, such as sine wave, triangular wave, etc.

The radiating fin with the structure can effectively increase the radiating area of the radiating fin, thereby improving the radiating effect of the radiating fin 3.

It will be appreciated that the surface shape of the heat radiating surface of the heat radiating fin 3 may also be referred to as other wave-like shape.

In one embodiment of the utility model, the water inlet pipe 11 and the water outlet pipe 12 are arranged on opposite sides of the test platform 1. And the plurality of groups of radiating fins 3 are uniformly arranged at equal intervals along the direction perpendicular to the flow direction of the cooling medium, so that the flow speed of the cooling medium is increased, and the cooling medium is further facilitated to rapidly take away the heat of the radiating fins 3.

In one embodiment of the present utility model, the semiconductor refrigeration sheet 2, the heat conducting substrate and the heat dissipating fins 3 may be connected together by screws, resin adhesion or welding.

In one embodiment of the present utility model, the heat conductive substrate and the heat dissipation fins 3 are made of copper or aluminum.

It will be appreciated that the thermally conductive base plate and the heat sink fins 3 may also be manufactured from other thermally conductive materials.

As can be seen from the above description, the working principle and the beneficial effects of the embodiment of the utility model are as follows:

when in testing, the semiconductor chip serving as a heat dissipation source is connected with the cold face of the semiconductor refrigerating sheet 2 through the heat conducting substrate, the cooling medium flows in the test platform 1 to take away the heat on the heat dissipation fins 3, so that the heat generated in the testing process of the semiconductor chip is transferred to the cooling medium in a heat transfer mode to realize heat dissipation, and the heat can be quickly taken away in the mode, so that the heat dissipation effect is good; further, the water inlet pipe 11 and the water outlet pipe 12 are arranged at two opposite sides of the test platform 1, and the radiating fins 3 are arranged at equal intervals perpendicular to the flowing direction of the cooling medium, so that the flowing speed of the cooling medium can be improved; meanwhile, the radiating surfaces of the radiating fins 3 are wavy, and the radiating surfaces are matched with each other, so that the radiating effect of the radiating fins 3 is improved.

The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the utility model, and is not meant to limit the scope of the utility model, but to limit the utility model to the particular embodiments, and any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the utility model are intended to be included within the scope of the utility model.

Claims

1. A semiconductor chip test fixture is characterized by comprising:

the testing platform is hollow in the inside, and a water inlet pipe and a water outlet pipe which are communicated with the inside of the testing platform are arranged on the side part of the testing platform; the upper surface of the test platform is provided with a test groove for placing a semiconductor chip;

a semiconductor refrigeration piece mounted in the test slot; the hot surface of the semiconductor refrigeration piece is attached to the bottom of the test groove;

the plurality of groups of radiating fins are fixedly connected with the hot surface of the semiconductor refrigerating sheet and extend to the inside of the test platform through the test groove;

2. The semiconductor chip test fixture of claim 1, wherein the heat dissipation surface of the heat dissipation fin is wavy.

3. The semiconductor chip test fixture according to claim 1 or 2, wherein the water inlet pipe and the water outlet pipe are provided at opposite sides of the test platform;

4. The semiconductor chip test fixture of claim 3, wherein the plurality of sets of heat dissipating fins are uniformly arranged at equal intervals along a direction perpendicular to a flow direction of the cooling medium.

5. The semiconductor chip test jig according to claim 2, wherein the wave shape is a sine wave or a triangular wave.

6. The semiconductor chip test fixture of claim 1, further comprising a thermally conductive substrate bonded to the cold side of the semiconductor cooling fin.

7. The fixture of claim 6, wherein the semiconductor cooling plate, the heat conducting substrate and the heat dissipating fins are connected by screws or resin adhesive or welded.

8. The semiconductor chip test fixture of claim 6, wherein the thermally conductive substrate and the heat sink fins are each made of copper or aluminum.