CN220653839U - Heat abstractor and vehicle controller - Google Patents
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- CN220653839U CN220653839U CN202321897881.2U CN202321897881U CN220653839U CN 220653839 U CN220653839 U CN 220653839U CN 202321897881 U CN202321897881 U CN 202321897881U CN 220653839 U CN220653839 U CN 220653839U
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- 229910052802 copper Inorganic materials 0.000 claims abstract description 51
- 239000010949 copper Substances 0.000 claims abstract description 51
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 48
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
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- 238000001704 evaporation Methods 0.000 claims description 22
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- 238000009833 condensation Methods 0.000 claims description 18
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation device and a vehicle-mounted controller. The heat dissipating device includes a heat dissipating fin having a surface, and further includes: the heat source device comprises a copper heat conducting block, wherein the copper heat conducting block is fixedly arranged on the surface, a plurality of grooves penetrating through the copper heat conducting block are formed in the vertical direction of the surface at intervals, a heat pipe is arranged at the grooves, and the upper part of the grooves is attached to a heat source. The core component of the utility model is a heat pipe, which is a high-efficiency heat transfer element, and can efficiently transfer heat in a long distance without external energy under a very small temperature difference by utilizing the phase change principle and capillary action. According to the utility model, the heat conductivity can be improved under the condition that other heat conduction conditions are unchanged, and the heat conduction quantity of the heat dissipation device in unit time can be greatly improved, so that the heat dissipation requirement of the high-power and high-torque air-cooled vehicle-mounted controller can be met.
Description
Technical Field
The present utility model relates to the field of heat dissipation technologies, and in particular, to a heat dissipation device and a vehicle-mounted controller.
Background
The electric drive unit is the power heart of the new energy automobile, and the importance of the electric drive unit is self-evident. The thermal management of the controller is naturally extremely important as an important component of the electric drive unit to control the power output and the function implementation. At present, two heat dissipation modes of the vehicle-mounted controller are usually air cooling heat dissipation and water cooling heat dissipation. Compared with air cooling, the water cooling heat dissipation is carried out, the cooling medium is 50% glycol solution, and the heat capacity of the cooling medium is far greater than that of air. The water cooling heat dissipation is widely applied to large-scale new energy automobiles due to the good cooling effect, so as to meet the requirements of high power and high torque of the large-scale new energy automobiles in the market. The air cooling heat dissipation is generally divided into natural cooling and forced air cooling, and is often used on A0-level vehicle type and light trucks, and the application scene of the vehicle type determines that the market has no excessively high requirements on electric driving power and torque, and the air cooling heat dissipation can meet the heat dissipation requirement of the vehicle-mounted controller.
However, as the competition of new energy markets in China is becoming more and more vigorous, each host factory pushes the under-flag A0-class vehicle model to an application scene with wider range in order to pursue profits, so that more stringent requirements on power and torque indexes of electric drive products are provided, the internal temperature of a vehicle-mounted controller cannot be maintained within a safe working temperature range of a device by conventional air cooling heat dissipation, and if water cooling heat exchange with stronger heat dissipation capability is adopted, the rise of the whole vehicle architecture and the cost is probably brought. At present, how to improve the A0-level vehicle type performance index becomes a problem which puzzles the developer of a host factory under the condition that the cost of the whole vehicle is not much.
Disclosure of Invention
Therefore, the present utility model is directed to a heat dissipating device and a vehicle-mounted controller, which can improve the heat conductivity under the condition that other heat conduction conditions are not changed, and can greatly improve the heat conduction amount of the heat dissipating device in unit time, so that the heat dissipating requirement of the high-power and high-torque air-cooled vehicle-mounted controller can be met.
According to one aspect of the present utility model, there is provided a heat dissipating device including a heat dissipating fin having a surface, further comprising:
the heat source device comprises a copper heat conducting block, wherein the copper heat conducting block is fixedly arranged on the surface, a plurality of grooves penetrating through the copper heat conducting block are formed in the vertical direction of the surface at intervals, a heat pipe is arranged at the grooves, and the upper part of the grooves is attached to a heat source.
In the above technical solution, the core component is a heat pipe, and the heat pipe is a high-efficiency heat transfer element, which uses the phase change principle and capillary action, and can efficiently transfer heat in a long distance without external energy under a very small temperature difference. The shape of the heat pipe may be any form (circular, square or other) and the whole heat pipe may be divided into three parts: the device comprises an evaporation section, an insulation section and a condensation section. In the evaporation section, external heat causes the working medium part of the section to evaporate and form pressure difference between the evaporation section and the condensation section, steam is sent to the condensation section, as long as the temperature of the condensation section is lower than the saturation temperature of the steam, the steam is solidified, and latent heat of vaporization is transferred to an external copper heat conducting block and a heat radiating fin, and a liquid absorption core structure (tube core) is arranged on the wall of the heat conducting block. The condensed liquid is returned from the condensing section to the evaporating section by means of capillary forces generated by the wick. As long as the heat pipe normally operates below a few limits, the working medium vaporization latent heat can be continuously transferred from the evaporation section to the condensation section, the heat exchange carried out by the vaporization latent heat is several orders of magnitude larger than the heat transferred by the single-phase convection coefficient in a sensible heat mode, and the heat transfer efficiency of the heat pipe is hundreds to thousands times higher than that of pure copper of the same material.
In some embodiments, the heat dissipating device further comprises: the fan support is arranged at the lower part of the radiating fins, and is matched with one side of the radiating fins to form a semi-closed cavity, and a radiating fan is arranged at one side of the cavity; forming an air duct inside the cavity through the cooling fan; the direction of the air duct is an air inlet, a fin gap and an air outlet in sequence.
In the technical scheme, the heat generated by the heat source is quickly transmitted to the surfaces of the radiating fins through the heat pipe, the heat is transmitted to the radiating fins again, the radiating fan blows air flow to the radiating fins to cool the fins, the heat is taken away along the air duct, and the radiating rate is greatly improved.
In some embodiments, the air duct has a cross-sectional dimension of: air inlet > fin gap = air outlet, or air inlet > air outlet > fin gap.
In the technical scheme, the slit effect, namely the narrow pipe effect of the terrain, is realized by setting the cross section size of the air duct, and when the air flow flows into the canyon formed by the terrain from the open area, the air mass cannot be accumulated in a large amount, so that the air flow is accelerated to flow through the canyon, and the wind speed is increased. When exiting the canyon, the air flow rate is slowed down again. The effect of such topographical canyons on airflow; known as the "throat effect". It should be noted that, because the fin gaps are parallel to the air duct, the size of the cross section is not calculated by the space occupied by the heat dissipation fins in the above technical scheme, that is, the fin gaps further increase the flow velocity, so that the heat can be taken away more quickly.
In some embodiments, a thermally conductive silicone grease is attached between the copper thermally conductive block and the surface.
In the technical scheme, the copper heat conducting block is assembled with the radiating fins through the screws, and the contact thermal resistance between the copper heat conducting block and the radiating fins is reduced through the heat conducting silicone grease coated on the lower surface of the copper heat conducting block. The thickness of the heat conduction silicone grease is controlled between 0.1 and 0.5mm, and the effect is optimal when the thickness of a coating film is 0.2mm.
In some embodiments, the wall surface of the heat pipe heat insulation section is attached to the wall surface of the groove, the end of the heat pipe condensation section is attached to the surface, and the end of the heat pipe evaporation section is attached to the heat source.
In the technical scheme, the heat pipe and the copper heat conduction block are combined to form the novel heat dissipation device, wherein specific assembly details are that firstly, a groove with a rectangular cross section is processed on the upper surface of the copper heat conduction block according to the welding position of the MOSFET pipe, then the heat pipe is processed according to the shape of the groove, an evaporation section of the heat pipe is assembled into the groove, and the end head of the evaporation section, the lower surface of the MOSFET pipe and the copper heat conduction block are welded and fixed through vacuum reflow soldering. The requirement is made on the process, so that bubbles are prevented from being generated in the welding process as much as possible, the heat resistance of the system is increased by the bubbles, and the heat conduction capacity of the heat dissipation device is reduced. Finally, the heat insulation section of the heat pipe is processed to be attached to the wall surface of the groove as much as possible, the condensation section of the heat pipe is attached to the heat radiation fins, and the heat insulation section and the condensation section are connected with the copper heat conduction block through welding; through the structure, the heat conduction efficiency can be greatly improved, and heat can be taken away more quickly.
In some embodiments, the heat transfer direction of the heat pipe is perpendicular to the air duct.
In the above technical solution, the purpose of this arrangement is to reduce the volume of the entire heat dissipating device by means of the lateral air duct. Meanwhile, the surface area utilization rate of the radiating fins can be effectively utilized, and the heat conduction efficiency is increased. Further, on the basis that the air duct drives the air flow to contact with the heat flow to realize entropy increase, the entropy is further increased after the air flow absorbs heat, and the gap between the fins is smaller, so that the air flow speed can be increased by effectively utilizing a slit effect, the heat conduction efficiency is greatly improved, and the heat can be taken away rapidly.
According to an aspect of the present utility model, there is provided an in-vehicle controller including: a heat dissipating device as described above, and,
the MOSFET tubes are fixedly arranged on the copper heat conduction block, are arranged right above the grooves and are attached to the evaporation section of the heat pipe;
and the thin film capacitor is fixedly connected to the surface, and a heat conduction gasket is attached between the thin film capacitor and the surface.
In the technical scheme, the power module in the controller adopts a mode that the MOSFET tubes are connected in parallel, the cooling mode is that the fan is used for forced air cooling to assist in radiating by the radiating fins, heat generated by the operation of the MOSFET tubes is quickly transmitted to the lower shell through the heat pipe, the heat is transmitted to the radiating fins again, the radiating fan blows air flow to the radiating fins, the radiating fins are cooled, and the heat is taken away. The heat conducting pad is arranged on the surface of the thin film capacitor so as to strengthen the heat conduction between the thin film capacitor and the shell.
In some embodiments, the surface of the MOSFET tube, which is attached to the evaporation section of the heat pipe, is soldered to the copper heat conducting block by vacuum reflow soldering.
In the technical scheme, the purpose of the arrangement is that under the vacuum environment, oxygen, water vapor and other gases in welding spots are all eliminated, and the problems of oxidization, bubbles, air holes and the like can not occur during welding, so that more uniform, stable and reliable welding quality can be obtained. Further, the sticking effect is ensured, the increase of the thermal resistance of the system is avoided, and the heat conduction capacity of the heat dissipation device is weakened.
In some embodiments, the heat conduction direction of the vehicle-mounted control is sequentially: MOSFET tube, copper heat conduction block and heat pipe, heat radiation fin and air outlet.
In the above technical solution, the purpose of this arrangement is to reduce the volume of the entire heat dissipating device by means of the lateral air duct. Meanwhile, the surface area utilization rate of the radiating fins can be effectively utilized, and the heat conduction efficiency is increased. Further, on the basis that the air duct drives the air flow to contact with the heat flow to realize entropy increase, the entropy is further increased after the air flow absorbs heat, and the gap between the fins is smaller, so that the air flow speed can be increased by effectively utilizing a slit effect, the heat conduction efficiency is greatly improved, and the heat can be taken away rapidly.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an embodiment of an in-vehicle controller according to the present utility model;
fig. 2 is a schematic structural diagram of a copper heat conducting block 6 and a heat pipe 7 according to an embodiment of the vehicle controller of the present utility model;
FIG. 3 is a schematic cross-sectional view of an embodiment of the vehicle controller of the present utility model.
Detailed Description
The utility model is described in further detail below with reference to the drawings and examples. It is specifically noted that the following examples are only for illustrating the present utility model, but do not limit the scope of the present utility model. Likewise, the following examples are only some, but not all, of the examples of the present utility model, and all other examples, which a person of ordinary skill in the art would obtain without making any inventive effort, are within the scope of the present utility model.
The utility model provides a heat dissipation device, which can improve the heat conductivity under the condition that other heat conduction conditions are unchanged, and can greatly improve the heat conduction quantity of the heat dissipation device in unit time, so that the heat dissipation requirement of an air-cooled vehicle-mounted controller with high power and high torque can be met.
Referring to fig. 1, fig. 1 is a schematic diagram of an apparatus structure of an on-vehicle controller according to an embodiment of the utility model. It should be noted that the vehicle-mounted controller in this embodiment already includes the heat dissipating device, and therefore the description will be made in this embodiment together with the vehicle-mounted controller and the heat dissipating device.
A heat dissipating double-fuselage and controller, the concrete structure is formed: the heat-conducting device comprises a controller upper cover 1, a thin film capacitor 2, a controller lower shell and heat-radiating fins 3, a heat-radiating fan 4, a fan bracket 5, a copper heat-conducting block 6, a heat pipe 7 and a MOSFET 8.
In this embodiment, the power module in the controller adopts the mode of parallel connection of the MOSFET tubes 8, the cooling mode is that the fan forces air cooling to assist with heat dissipation of the heat dissipation fins, fig. 1 only shows the components with larger heating value in the controller and the structure closely related to the heat exchange process, and other structures are commonly used electronic components in the vehicle-mounted controller, which are not described herein again.
In this embodiment, referring to fig. 2 and 3, the heat dissipating device includes a heat dissipating fin 3, the heat dissipating fin 3 has a surface 31, and further includes: the copper heat conduction block 6, this copper heat conduction block 6 sets firmly in surface 31, and this copper heat conduction block 6 is provided with a plurality of slots 61 that run through this copper heat conduction block in the vertical direction A of surface 31 interval, and slot 61 department is provided with heat pipe 7, and just above this slot laminating with MOSFET pipe 8. The thin film capacitor 2 is fixedly connected to the surface 31, and a heat conducting pad (not shown) is attached between the thin film capacitor 2 and the surface 31, and the heat conducting pad is placed between the thin film capacitor 2 and the surface 31, so that the heat conduction effect between the thin film capacitor and the shell is enhanced. The controller upper cover 1 is matched with the radiating fins 3.
The dimensions of the mosfets used in the present embodiment are 30mm x 20mm x 5mm, the chips and diodes in the mosfets are usually located near the central axis, in order to shorten the heat transfer distance, the grooves are disposed right under each of the mosfets, in order to ensure that the heat pipes in the grooves can have enough contact area with the mosfets, and in order to avoid the problem that the heat pipes are too large in size and too high in cost during mass production, the suitable width of the heat pipes should be one fourth of the width of the mosfets, so in the present embodiment, the width of the grooves is about 5.1mm, and the machining accuracy is about plus or minus 0.1 mm;
in this embodiment, the core component is a heat pipe. A heat pipe is a high-efficiency heat transfer element that can efficiently transfer heat over a long distance without external energy under a very small temperature difference using a phase change principle and capillary action. The shape of the heat pipe may be any form (circular, square or other) and the whole heat pipe may be divided into three parts: the device comprises an evaporation section, an insulation section and a condensation section. In the evaporation section, external heat causes the working medium part of the section to evaporate and form pressure difference between the evaporation section and the condensation section, steam is sent to the condensation section, as long as the temperature of the condensation section is lower than the saturation temperature of the steam, the steam is solidified, and latent heat of vaporization is transferred to an external copper heat conducting block and a heat radiating fin, and a liquid absorption core structure (tube core) is arranged on the wall of the heat conducting block. The condensed liquid is returned from the condensing section to the evaporating section by means of capillary forces generated by the wick. As long as the heat pipe normally operates below a few limits, the working medium vaporization latent heat can be continuously transferred from the evaporation section to the condensation section, the heat exchange carried out by the vaporization latent heat is several orders of magnitude larger than the heat transferred by the single-phase convection coefficient in a sensible heat mode, and the heat transfer efficiency of the heat pipe is hundreds to thousands times higher than that of pure copper of the same material.
In this embodiment, referring to fig. 1 and 3, the heat dissipating device further includes: the fan bracket 5 is arranged at the lower part of the radiating fins 3, the fan bracket 5 is matched with one side of the fins 32 of the radiating fins 3 to form a semi-closed cavity 9, and one side of the cavity is provided with the radiating fan 4; an air duct B is formed inside the cavity 9 by the cooling fan 4; the direction of the air duct is an air inlet 91, a gap between the fins 32 and an air outlet 92 in sequence. The heat generated by the MOSFET tube 8 is quickly conducted to the surface 31 of the lower radiating fin 3 through the heat pipe 7, the heat is conducted to the fin 32 at the lower part of the radiating fin 3, the radiating fan 4 blows air flow to the radiating fin 3, the fin 32 is cooled, the heat is taken away along the air channel B, and the radiating rate is greatly improved.
In this embodiment, the size of the cross section of the air duct B is: air intake 91 > fin 32 gap = air outlet 92, or air intake 91 > air outlet 92 > fin 32 gap. The former does not require modification of the shape of the fin 32 and the latter can further increase the advantages of the slit effect. In this embodiment, the air inlet 91 > the gap between the fins 32=the air outlet 92 is taken as an example. It should be noted that the present embodiment emphasizes the gap between the fins 32, because the fin 32 has to face the air duct B with its groove surface in order to ensure the heat dissipating device, i.e. the fin 32 is parallel to the air duct B, and if it is vertical, the heat dissipating effect is greatly reduced. Further, in the present embodiment, the cross-sectional dimension of the air duct B is defined instead of the cross-sectional dimension of the fan bracket 5 or the dimension of the cavity 9, because the shapes of different controllers are different, and in order to achieve the slit effect, only the cross-sectional dimension of the air duct B can be defined, which will not be described in detail later.
In this embodiment, the slot effect, i.e., the slot effect of the terrain, is achieved by providing the cross-sectional dimensions of the air duct, and when the air flow is from the open area into the canyon of the terrain, the air flow is accelerated through the canyon and the wind speed increases due to the inability of the air mass to accumulate in large amounts. When exiting the canyon, the air flow rate is slowed down again. The effect of such topographical canyons on airflow; known as the "throat effect". It should be noted that, because the fin gaps are parallel to the air duct, the size of the cross section is not calculated by the space occupied by the heat dissipation fins in the above technical scheme, that is, the fin gaps further increase the flow velocity, so that the heat can be taken away more quickly.
In the present embodiment, a heat conductive silicone grease (not shown) is attached between the copper heat conductive block 6 and the surface 31. The copper heat conducting block 6 is assembled with the heat radiating fins 3 through screws, and the contact thermal resistance between the copper heat conducting block and the heat radiating fins is reduced through heat conducting silicone grease (not drawn in the figure) coated on the lower surface of the copper heat conducting block 6. The thickness of the heat conduction silicone grease is controlled between 0.1 and 0.5mm, and the effect is optimal when the thickness of a coating film is 0.2mm. Therefore, in this example, the thickness of the coating film was 0.2mm.
In this embodiment, referring to fig. 2 and 3, the wall surface of the heat insulation section (not shown) of the heat pipe 7 is bonded to the wall surface of the groove 61, the end of the condensation section (not shown) of the heat pipe 7 is bonded to the surface 31, and the end of the evaporation section (not shown) of the heat pipe 7 is bonded to the MOSFET tube 8. It should be noted that the heat insulation section, the condensation section and the evaporation section of the heat pipe 7 are heat pipe structures existing in the prior art, and those skilled in the art can perform the arrangement according to the description without further development. The heat pipe 7 and the copper heat conduction block 6 are combined to form a new heat dissipation device, wherein the specific assembly details are that firstly, a groove 61 with a rectangular cross section is processed on the upper surface of the copper heat conduction block 6 according to the welding position of the MOSFET tube 8, then the heat pipe 7 is processed according to the shape of the groove 61, an evaporation section of the heat pipe 7 is assembled into the groove 61, and the end head of the evaporation section, the lower surface of the MOSFET tube 8 and the copper heat conduction block 6 are fixed through vacuum reflow welding. The requirement is made on the process, so that bubbles are prevented from being generated in the welding process as much as possible, the heat resistance of the system is increased by the bubbles, and the heat conduction capacity of the heat dissipation device is reduced. Finally, the heat insulation section of the heat pipe 7 is processed to be attached to the wall surface of the groove 61 as much as possible, the condensation section of the heat pipe 7 is attached to the heat radiation fins 3, and the heat insulation section and the condensation section are connected with the copper heat conduction block 6 through welding; through the structure, the heat conduction efficiency can be greatly improved, and heat can be taken away more quickly.
Referring to fig. 3, the heat transfer direction C of the heat pipe is perpendicular to the air duct B. The transverse air duct B is utilized to reduce the volume of the whole heat dissipating device. Meanwhile, the surface area utilization rate of the radiating fins 3 can be effectively utilized, and the heat conduction efficiency is increased. Further, on the basis that the air duct B drives the air flow to contact with the heat flow to realize entropy increase, the entropy is further increased after the air flow absorbs heat, and the gap between the fins 32 is smaller, so that the slit effect can be effectively utilized to increase the air flow speed, the heat conduction efficiency is greatly improved, and the heat can be rapidly taken away.
In this embodiment, the heat exchange between the heat source and the surface 31 and the fins 32 includes heat conduction and convection, wherein the heat conduction accounts for more than 95% of the heat exchange amount. The heat quantity Q (corresponding to Q1, Q2, Q3 and Q4 in the figure) transferred by heat conduction of the heat dissipating device is calculated as follows:
Q＝-K·A·(dT/dx)
where K is the thermal conductivity (K/(m·w)) of the heat pipe 7 and the copper heat conduction block 6, a is the contact area of the heat pipe 7 and the copper heat conduction block 6 with the heat source, and dT/dx is the temperature gradient on the heat pipe 7 and the copper heat conduction block 6. The controller adopts forced air cooling to dissipate heat, as shown in fig. 3, heat generated by the operation of the MOSFET tube is quickly transferred to the surface 31 through the heat pipe, the heat is transferred to the fins 32 again, the cooling fan 4 blows air flow to the fins 32 to cool the fins 32, and the heat is taken away.
In this embodiment, the copper heat conduction block 6 is made of copper, and the heat conductivity of copper is 397W/(mK), and the heat conductivity of a heat conduction pipe having a length of 30mm to 40mm is usually 1000 to 3500W/(mK). According to the assembly form of the heat pipe and the copper heat conduction block in the embodiment, the equivalent heat conductivity of the assembly body ranges from 397W/(m.K); in engineering applications, the temperature gradient across the heat pipe 7 and the copper heat conducting block 6 is typically in the range of 10-15 ℃.
In this embodiment, the copper heat sink is combined with the heat pipe, which has much higher thermal conductivity than the single heat sink. Under the condition that other heat conduction conditions are unchanged, the heat conductivity is improved, the heat conduction quantity of the heat dissipating device in unit time can be greatly improved, and therefore the heat dissipating requirement of the high-power and high-torque air-cooled vehicle-mounted controller can be met. Under the condition that the power and torque requirements of the vehicle-mounted controller are unchanged, the embodiment is adopted, the cooling fan can be of a lower flow and smaller pressure head specification, and therefore space can be reserved for the electric drive unit. The heat pipe is a mature technical product, has the advantages of light weight and small volume, combines the heat pipe with the traditional heat dissipation block, and does not bring great change to the volume of the heat dissipation device, thus being beneficial to the layout of components in the controller.
The foregoing description is only a partial embodiment of the present utility model, and is not intended to limit the scope of the present utility model, and all equivalent devices or equivalent processes using the descriptions and the drawings of the present utility model or directly or indirectly applied to other related technical fields are included in the scope of the present utility model.
Claims (9)
1. A heat sink comprising, a heat sink fin having a surface, further comprising:
the heat source device comprises a copper heat conducting block, wherein the copper heat conducting block is fixedly arranged on the surface, a plurality of grooves penetrating through the copper heat conducting block are formed in the vertical direction of the surface at intervals, a heat pipe is arranged at the grooves, and the upper part of the grooves is attached to a heat source.
2. A heat sink as recited in claim 1, further comprising:
the fan support is arranged at the lower part of the radiating fins, and is matched with one side of the radiating fins to form a semi-closed cavity, and a radiating fan is arranged at one side of the cavity; forming an air duct inside the cavity through the cooling fan; the direction of the air duct is an air inlet, a fin gap and an air outlet in sequence.
3. A heat sink as in claim 2, wherein,
the size of the section of the air duct is as follows: air inlet > fin gap = air outlet, or air inlet > air outlet > fin gap.
4. A heat sink as in claim 1, wherein,
and heat conduction silicone grease is adhered between the copper heat conduction block and the surface.
5. A heat sink as in claim 1, wherein,
the wall surface of the heat pipe heat insulation section is attached to the wall surface of the groove, the end head of the heat pipe condensation section is attached to the surface, and the end head of the heat pipe evaporation section is attached to the heat source.
6. A heat sink as in claim 2, wherein,
the heat transfer direction of the heat pipe is perpendicular to the air duct.
7. A vehicle-mounted controller, characterized by comprising: a heat dissipating device as set forth in any one of claims 1-6, and,
the MOSFET tubes are fixedly arranged on the copper heat conduction block, are arranged right above the grooves and are attached to the evaporation section of the heat pipe;
and the thin film capacitor is fixedly connected to the surface, and a heat conduction gasket is attached between the thin film capacitor and the surface.
8. An in-vehicle controller according to claim 7, wherein,
and one surface of the MOSFET tube, which is attached to the evaporation section of the heat pipe, is welded to the copper heat conduction block through vacuum reflow soldering.
9. An in-vehicle controller according to claim 7, wherein,
the heat conduction direction of the vehicle-mounted control is as follows: MOSFET tube, copper heat conduction block and heat pipe, heat radiation fin and air outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321897881.2U CN220653839U (en) | 2023-07-18 | 2023-07-18 | Heat abstractor and vehicle controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321897881.2U CN220653839U (en) | 2023-07-18 | 2023-07-18 | Heat abstractor and vehicle controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220653839U true CN220653839U (en) | 2024-03-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321897881.2U Active CN220653839U (en) | 2023-07-18 | 2023-07-18 | Heat abstractor and vehicle controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220653839U (en) |
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2023
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