JPH0122260Y2 - - Google Patents
Info
- Publication number
- JPH0122260Y2 JPH0122260Y2 JP16755782U JP16755782U JPH0122260Y2 JP H0122260 Y2 JPH0122260 Y2 JP H0122260Y2 JP 16755782 U JP16755782 U JP 16755782U JP 16755782 U JP16755782 U JP 16755782U JP H0122260 Y2 JPH0122260 Y2 JP H0122260Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- terminal
- piezoelectric vibrator
- insulating
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000605 extraction Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 description 18
- 239000000758 substrate Substances 0.000 description 17
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16755782U JPS5972032U (ja) | 1982-11-05 | 1982-11-05 | 圧電振動子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16755782U JPS5972032U (ja) | 1982-11-05 | 1982-11-05 | 圧電振動子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5972032U JPS5972032U (ja) | 1984-05-16 |
JPH0122260Y2 true JPH0122260Y2 (fr) | 1989-06-30 |
Family
ID=30366548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16755782U Granted JPS5972032U (ja) | 1982-11-05 | 1982-11-05 | 圧電振動子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5972032U (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07105689B2 (ja) * | 1987-09-08 | 1995-11-13 | セイコーエプソン株式会社 | 圧電振動子 |
-
1982
- 1982-11-05 JP JP16755782U patent/JPS5972032U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5972032U (ja) | 1984-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100870612B1 (ko) | 압전 공진자 및 압전공진자를 케이스 내에 내장한 장치 | |
JP2001196488A (ja) | 電子部品装置及びその製造方法 | |
US6815313B2 (en) | Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same | |
JPH065401A (ja) | チップ型抵抗素子及び半導体装置 | |
JPS5985123A (ja) | 圧電振動子用気密ベ−ス | |
US5265316A (en) | Method of manufacturing a pressure seal type piezoelectric oscillator | |
JPS62202548A (ja) | 半導体装置 | |
JP2001110925A (ja) | 導電性キャップ、電子部品及び導電性キャップの絶縁皮膜形成方法 | |
JP2534881B2 (ja) | 気密封止回路装置 | |
JPH0122260Y2 (fr) | ||
JP3235467B2 (ja) | 電子部品 | |
JPS58215812A (ja) | 水晶振動子等の密封容器 | |
JPS6318335B2 (fr) | ||
JP4235417B2 (ja) | 表面実装型電子部品及びその製造方法 | |
JPH08130432A (ja) | 圧電振動子の保持構造 | |
JP2003297453A (ja) | 表面実装型気密端子とそれを用いた水晶振動子 | |
JP3109655B2 (ja) | 電子部品 | |
JP3084757B2 (ja) | 気密端子およびその製造方法 | |
JPH11307309A (ja) | チップ型サーミスタ | |
JP2003110398A (ja) | 圧電デバイス | |
JP3556111B2 (ja) | 電子部品用パツケージ、それを用いた電子部品組立構体および電子部品組立構体の製造方法 | |
JP2568788Y2 (ja) | 表面実装型電子部品 | |
JPH0445251Y2 (fr) | ||
JPS6261166B2 (fr) | ||
JP2000164745A (ja) | 気密パッケージ用キャップおよび気密パッケージ |