JPH01215034A - Semiconductor device - Google Patents

Abstract

PURPOSE:To detect the positional deviation of mounting easily and to enable mounting at low cost, by respectively dividing electrodes at a plurality of two ore more of positions in electrodes for joining on a semiconductor mounting substrate into the plural or installing positional-displacement detecting electrodes around each junction electrode. CONSTITUTION:Junction electrodes at two positions positioned at the opposite angles of an IC chip 3 in electrodes 2 for joining formed onto a substrate 1 are divided into four of electrodes 2a, 2b, 2c, 2d and 2e, 2f, 2g, 2h respectively while test pins 9 are connected to the junction electrodes 2a-2h on the substrate 1, a checker 8 deciding mutual continuity or non-continuity among each electrode is connected, and sections among respective electrode are checked at all times. When the position of a bump electrode 4 is displaced, sections among the electrodes 2a-2b-2c are decided to be continuity, 2d is decided to be non- continuity, and positional deviation is determined. Accordingly, the IC chip 3 is fixed under the state, in which the continuity of sections among the electrodes 2a-2d and sections among the electrodes 2e-2h is decided, in the adjustment of the location of the IC chip 3.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to integrated circuit elements (hereinafter referred to as IC) used in electronic equipment.
It is called. ), and specifically relates to a mounting board in a flip-chip mounting method in which an IC chip is directly mounted on a board.

BACKGROUND OF THE INVENTION In recent years, there has been remarkable progress in IC mounting technology for electronic devices, and in particular, direct mounting methods for IC chips have been used.

The conventional semiconductor device described above will be described below with reference to the drawings.

FIG. 4 is a cross-sectional view showing a state in which an IC chip is mounted on a conventional semiconductor board, FIG. 6 is a plan view of electrode arrangement, and FIG. 6 is a model diagram at the time of mounting.

In Fig. 4, 1 is the substrate, 2 is the bonding electrode ζ on the substrate.
is an IC chip, and 4 is a bump electrode of the IC chip.

The IC tip 3 is formed with bonding bump electrodes made of a material such as gold or solder. On the other hand, bonding electrodes 2 are formed on the surface of the substrate 1, and the arrangement thereof is as shown in FIG. 6 (corresponding to the bump electrodes of the IC chip 3).

A mounting method for the semiconductor board configured as described above will be described below.

First, the prepared IC chip 3 is attracted by the collet 5 for mounting, and is then carried to the vicinity of the bonding electrode of the substrate 1 to be mounted. Next, the bump electrode 4 and the bonding electrode 2 of the substrate are aligned, but as shown in FIG. 6, this position is confirmed with the human eye (or a television camera) 7 through a mirror 6, and the alignment is performed. . Thereafter, the collet 6 was pushed down to fix the IC chip 3 to the substrate 1, and the bump electrodes 4 and the bonding electrodes 4 were bonded. (At this time, the electrodes are usually bonded by applying pressure, heating, or ultrasonic vibration.) Problems to be Solved by the Invention However, in the above configuration, when aligning the IC chip 3, the bump electrodes 3 are The height is only 10
Since the diameter is about 0 to 10 microns, it is very difficult to monitor from the side through the mirror 6. For this reason,
Conventionally, single positioning has been performed by monitoring from multiple directions and using positioning marks on the periphery, but the accuracy is very poor and positional deviations as shown in FIG. 7 often occur. Such misalignment can cause defects such as short circuits and opens, and can also reduce reliability because the gap between the electrodes becomes smaller. In addition, when trying to improve the accuracy of alignment, it requires a large number of man-hours, resulting in an increase in cost, and there are many problems such as the inability to cope with the increase in the density of the bump electrodes 3.

In view of the above-mentioned problems, the present invention provides a semiconductor mounting substrate that has a simple structure and can be easily aligned.

Means for Solving the Problems In order to solve the above-mentioned problems, the semiconductor mounting substrate of the present invention has the following features:
A configuration in which the bonding electrode pattern is divided into at least two parts at at least two or more locations among the bonding electrodes corresponding to the bump electrodes, or a configuration in which a second electrode is arranged around each bonding electrode. It is equipped with the following.

Effect: With the above-described configuration, the present invention can perform positioning while monitoring electrical conduction and non-conduction between the divided electrodes at the same location, and the bag electrode can be aligned between the divided bonding electrodes. It is possible to detect as the correct position a state in which the position is incorrect, or a state in which specific conditions overlap, thereby preventing positional deviation. In addition, when a second electrode is placed around the bonding electrode, this second electrode is used as a positional deviation detection electrode,
Positioning can be performed while monitoring electrical conduction or non-continuity with the bonding electrode, and a state in which the bump electrode straddles between the bonding electrode and the second detection electrode can be detected as a positional deviation. This allows you to prevent misalignment.

Embodiment Hereinafter, a semiconductor device according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1(,) shows a plan view of a semiconductor packaging substrate in a first embodiment of the present invention. In FIG. 1 (-), 2a, 2b, 2c, and 2d are electrodes obtained by dividing the first bonding electrode into four, and 2@, 2f, 2q, and 2h are electrodes obtained by dividing the second bonding electrode into four. 1 is a substrate, 2 is another bonding electrode, 3 is an IC chip, and 4 is a bump electrode, which have the same structure as the conventional one.

The operation of the semiconductor substrate constructed as described above will be explained below with reference to FIGS.

FIG. 1 (,) shows two bonding electrodes located diagonally of the IC chip 3 among the bonding electrodes 2 formed on the substrate 1.
The bump electrode 4 is shown divided into the respective electrodes 2a, 2b, 20, 2d, 2., 2f, 2g, 2h.
It is in a state of overlapping.

The method for mounting the IC chip 3 is as shown in FIG. 3, in which the IC chip 3 is attracted to an IC chip mounting collet 6 and then transferred to the substrate 1. On the other hand, test pins 9 are connected to the bonding electrodes 2a to 2h of the substrate 1.

A checker 8 is connected to this test pin to determine whether the electrodes are mutually conductive or non-conductive, and constantly checks between the electrodes. Now, when the bump electrodes are misaligned as shown in FIG. Something turns out to be true. Therefore, when adjusting the position of the IC chip 3, check the continuity checker's judgment with the
By fixing the IC chip 3 in a state where conductivity is determined between the electrodes 2a to 2d and between the electrodes 20 to 2h, it is possible to mount the IC chip 3 without causing positional deviation.

As described above, according to this embodiment, by dividing the two electrodes of the bonding electrode and checking the conduction/non-continuity between each electrode, it is possible to easily detect the misalignment of the IC chip mounting position. It can be implemented without causing any misalignment. In addition, since positional deviation detection can be performed electrically, I
The position of the C-chip mounting device can be easily controlled, and the cost of mounting the C-chip mounting device is significantly lower than that of the conventional method. (Conventional position control was performed using video information from a television camera or the like, and the cost of the device was considerable.) A second embodiment of the present invention will be described below with reference to the drawings.

FIG. 2 is a plan view of a semiconductor substrate showing a second embodiment of the present invention. In the figure, 10a.

10b is a second detection electrode provided around the bonding electrode 2. Note that other bonding electrodes are omitted.

The operation of the semiconductor substrate configured as described above will be described below.

The method of mounting the IC chip 3 is the same as that of the first embodiment (Fig. 3).
This method is similar to that described above, but the detection of positional deviation is different. First, the test pin 9 is connected to the bonding electrode 2 and the detection electrode 10.
Continuity/non-continuity checker 8 provided between a and 1ob
It is connected to the. If the IC chip 3 is misaligned, the bump electrode 4 overlaps the bonding W, pole 2, and detection electrode 10a or 10b, so the checker 8 determines continuity between the bonding electrode and the detection electrode. However, it is recognized that a positional shift has occurred.

As described above, by providing the second electrode around the bonding electrode, this second electrode can be used as a positional deviation detection electrode, and the mounting positional deviation of the IC chip can be easily determined.

In addition, in both the first and second embodiments, the bonding electrodes at diagonal positions were divided and detection electrodes were provided around them. Even if it is provided, the same effect can be obtained.

Effects of the Invention As described above, the present invention has the advantage of dividing at least two or more of the bonding electrodes on a semiconductor substrate into two or more electrodes, or by creating a second positional shift around each bonding electrode. By providing a detection electrode, it is possible to easily detect a mounting position shift during IC chip mounting (flip chip mounting), and furthermore, mounting and dispersion can be configured without the need for an optical system device such as a television camera. Therefore, a mounting device can be realized at extremely low cost, and when used for mounting electronic equipment, low cost mounting is possible.

[Brief explanation of the drawing]

FIG. 1(-) is a plan view of a semiconductor device according to a first embodiment of the present invention, FIG. 1(b) is an enlarged view of the junction electrode portion of FIG. 1(a), and FIG. A plan view of the semiconductor device in the second embodiment, FIG. 3 is a model diagram when mounted on the same device, FIG. 4 is a sectional view of a conventional IC chip mounted state,
FIG. 5 is a plan view of FIG. 4, FIG. 6 is a configuration diagram during conventional IC chip mounting, and FIG. 7 is a plan view showing a conventional mounting misalignment on a semiconductor device board. 1... Substrate, 2... Bonding electrode, 2a
~2h... Divided bonding electrode, 3...
...IC chip, 4...bump electrode, 5...
...Collet for IC chip mounting, e...mirror, etc., 7...human eye or television camera,
8...Continuity/non-continuity checker-19...
・Test pin. Name of agent: Patent attorney Toshio Nakao and one other person
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Claims (2)

[Claims] (1) In a semiconductor device in which an IC chip having a bump electrode formed on a bonding electrode is firmly connected to a bonding electrode on a substrate corresponding to the bump electrode, among the bonding electrodes formed on the substrate, The bonding electrodes at at least two or more locations are each divided into at least two or more electrodes, and the divided bonding electrodes are arranged to be interconnected by fixing the bump electrodes. Semiconductor equipment. (2) The semiconductor device according to claim 1, wherein second electrodes are arranged around at least two bonding electrodes of the bonding electrodes of the substrate.