JPH01212453A - Semiconductor device - Google Patents

Abstract

PURPOSE:To make it possible to hold properly a semiconductor device on a carrier tape in a state that the device is initially positioned by a method wherein a surface part to be adhered formed on the main surface on the surface mounting side of a surface mounting type package is formed in such a design as to be able to be immersed in holding holes provided openly on the carrier tape which is used for a packing of this semiconductor device. CONSTITUTION:A carrier tape 1 is provided with a holding tape 2 and a plurality of holding holes 4 are arranged at equal intervals and bored on the center line of the tape 2 and are formed in such a design that a protruding part 23, which is used as a part to be adhered formed on the main surface on the surface mounting side of a package 22, can be fitted in them. When the part 23 of an IC 24 placed on the tape 2 is matched to the hole 4 and is fitted in it, the lower surface of the part 23 is adhered to an adhesive part 6 of an adhesive tape 5 adhered on the rear of the tape 2 and is held. Thereby, the holding force of the adhesive tape is increased and a semiconductor device can be properly held on the carrier tape in a state that the device is initially positioned.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a technique for improving the mounting workability of semiconductor devices, particularly semiconductor devices equipped with surface-mounted packages.・Semiconductor integrated circuit device equipped with a line package (hereinafter referred to as SOP/I)
(C) relates to effective technology that can be used for

[Conventional technology] Resin-sealed SOP/tC used for consumer logic, etc.
When automatically mounting a printed wiring board on a printed wiring board, an automated mounting technology using a carrier tape is sometimes used.

In other words, in the SoP/IC manufacturing factory, the SOP/IC
The ICs are arranged regularly and at equal intervals on a carrier tape, are adhesively held by an adhesive tape, and are packaged by winding the carrier tape around a reel.

Then, for users of 5OP-IC, SOP-IC
The carrier tape that packed the group is unwound from the reel,
The regularly arranged 5OP-ICs are sequentially removed, placed on a printed wiring board, and automatically mounted by reflow soldering or the like.

The carrier tape used in such carrier tape-based mounting automation technology includes a holding tape having a plurality of holding holes and an adhesive tape that is attached to the back side of the holding tape. By bending and sinking into the holding hole from the back side, it is configured to adhere to and hold the back side of the SOP/IC aligned with the holding hole.

An example of the mounting automation technology using a carrier tape is "Introduction to Automatic Assembly of Electronic Components" published by Nikkan Kogyo Shimbun, July 30, 1980, pages 45 to 47.

[Problem to be solved by the invention]

In the carrier tape used for such automatic mounting work, ejector bin marks are formed on the back side of the SOP/IC package, which reduces the effective adhesive area between the SOP/IC package and the adhesive tape. Therefore, the holding force and positioning of the adhesive tape against the SOP/IC becomes insufficient, causing the SOP/IC to move relative to the carrier tape, resulting in a problem that work efficiency and positional accuracy during mounting are reduced. This was revealed by the present inventor.

An object of the present invention is to provide a semiconductor device that can realize reliable positioning when mounting automation technology using a carrier tape is adopted.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

An overview of typical inventions disclosed in this application is as follows.

In other words, in a semiconductor device equipped with a surface-mounted package, the surface to be adhered to the main surface of the surface-mounted side of the package can be inserted into a holding hole formed in a carrier tape used for packaging this semiconductor device. It was formed in

(Function) According to the above-described means, since the adhesive surface formed on the back surface of the package is inserted into the holding hole formed in the carrier tape when the semiconductor device is packaged, the adhesive tape of the carrier tape is inserted into the holding hole formed in the carrier tape. In this case, the adhesive tape adheres over a wide area to the surface to be adhered.Therefore, the holding power of the adhesive tape to the semiconductor device is increased, and its movement and displacement are prevented.

〔Example〕

FIG. 1 is a perspective view showing a state in which a 5OP-IC, which is an embodiment of the present invention, is packaged with a carrier tape, and FIG. 2 is an enlarged partial vertical sectional view taken along line I-1 in FIG.

In this example, the semiconductor device according to the present invention is a semiconductor device (hereinafter referred to as an IC) having a surface-mounted resin-sealed package.
), and this fc package is a small out line package (SOP).
It is formed in the form of In other words, the package of this IC has a plurality of outer leads molded into gull wing expansion, which are aligned on a pair of side surfaces, and are aligned so that the back surface of the outer leads protrudes very slightly from the back surface of the package. It is set up. And this I
C is configured to be packed with carrier tape 1.

The carrier tape 1 includes a holding tape 2, and this tape 2 is formed of paper or the like into a band shape having a width wider than the length of the ICI. If necessary, silicone coated paper containing copper foil or silicone coated paper may be used for the holding tape 2. A large number of pilot holes 3 are arranged at equal intervals on both ends of the holding tape 2, and a plurality of holding holes 4 are arranged at equal intervals on the center line of the holding tape 2. It is set up.

The holding hole 4 of the holding tape 2 is formed in an oval shape,
The shape, size, etc. are appropriately set so that a convex portion (described later) as a sticky portion formed on the main surface of the package on the imposition side can be fitted therein.

An adhesive tape 5 is arranged on the center line of the back surface of the holding tape 2 and is adhered so as to cross the group of four holding holes formed in the holding tape 2. The adhesive tape 5 is formed into a band shape using crepe paper and has a width narrower than the longitudinal dimension of the holding hole 4, and a nitrile rubber adhesive is applied to the surface to be mated with the holding tape 2 side. An adhesive layer 6 is formed.

On the other hand, an IC to be packaged is molded into a resin-sealed package 22 in a semiconductor device manufacturing factory using a transfer molding apparatus as shown in FIGS. At the same time, the convex portion 23 as the adhered portion is simultaneously molded on the main surface of the package on the rotation side. Next, the molding of this package will be described in detail. This explanation clarifies the details of the configuration of 1C according to this embodiment.

A workpiece 10 as a molding object in this package molding process is configured as shown in FIGS. 3 and 4, and includes a multiple lead frame l'l.

This multiple lead frame 11 is integrally formed using a thin plate made of a copper-based (copper or its alloy) material such as phosphor bronze or oxygen-free copper by a suitable means such as punching press processing or etching processing. The multiple lead frame has a plurality of unit lead frames 12 arranged horizontally.
arranged in rows. However, only one unit is illustrated.

The unit lead frame 12 includes a pair of outer frames 13 each having a positioning hole 13a, and both outer frames extend in parallel at a predetermined interval. A pair of section frames 14 are provided between adjacent unit lead frames 12.12.
are disposed parallel to each other and integrally constructed between both outer frames 13 and 13, and the unit lead frame 12 is constructed within a substantially square frame formed by these outer frames and section frames.

In each unit lead frame 12, both outer frames 13.
A pair of dam members 15 are disposed between the dam members 13 so as to be parallel to each other and perpendicular to the outer frame, and are integrally suspended. On one of the outer frames 13, a tab suspension lead 16 is arranged approximately in the middle and integrally protrudes in the right angle direction, and the tip of each tab suspension lead 16 is formed into a substantially square flat plate shape. A tab 17 is arranged approximately at the middle end and is integrally suspended. A plurality of leads 18 are arranged on the dam member 15 at equal intervals in the longitudinal direction, are parallel to each other, and integrally protrude perpendicular to the dam member 15. are disposed such that their tips are close to the tab 17 and surround it, thereby forming an inner portion 18a. On the other hand, the ends of the extended portions of the leads 18 on the side opposite to the tabs are connected to the section frame 14, and constitute outer portions 18b. A portion of the dam member 15 between adjacent leads 18, 18 substantially constitutes a dam 15a that blocks the flow of resin during package molding, which will be described later.

A pellet bonding operation and a wire bonding operation are performed for each unit lead frame 12 in the multi-lead frame according to the above structure. These bonding operations are sequentially performed for each unit lead frame 12 by pitch-feeding the multiple lead frames in the lateral direction.

Through the pellet bonding process, as shown in FIGS. 3 and 4, the pellet 19 as a semiconductor integrated circuit element into which a bipolar integrated circuit (not shown) has been fabricated in the previous process is formed. A suitable pellet bonding device (
(not shown) via a bonding layer 20 formed by a bonding layer 20 (not shown).

A wire 21 made of a copper-based material is connected between the electrode pad of the pellet 19 fixedly mounted on the tab 17 and the inner part 18a of the lead 18 in each unit lead frame 2. Wire bonding equipment i! (not shown) is used,
Both ends are bonded and bridged. Thereby, the integrated circuit built into the pellet 19 is electrically extracted to the outside via the electrode pad, the wire 21, and the inner part 18a and outer part 18b of the lead 1B.

For the multiple lead frames that have been pelletized and wire-bonded in this way, a group of packages are resin-sealed for each unit lead frame using a transfer molding machine as shown in Figures 5 and 6. Then, the unit lead frames are simultaneously molded.

The transfer molding apparatus shown in FIG. 5 includes a pair of upper mold 31 and lower mold 32, and the upper mold 31 and the lower mold 32 are clamped together by a cylinder device (not shown). They are respectively attached to the mounting unit and the lower mounting unit (described later). A plurality of sets of upper mold cavity recesses 33a and lower mold cavity recesses 33b are recessed in the mating surfaces of the upper mold 31 and the lower mold 32 so as to cooperate with each other to form the cavity 33. When transfer molding a resin-sealed package using the multiple lead frame 11 having the above configuration, each cavity 33 in the upper mold 31 and lower mold 32 is formed by a pair of dams 15a, 1 in each unit lead frame 12.
Each corresponds to the space between 5A.

A pot 34 is provided on the mating surface of the upper die 31.
A plunger 35 that is moved forward and backward by a cylinder device (not shown) is inserted into the bot 34 so as to be able to feed resin (hereinafter referred to as resin) as a molding material. A cull 36 is arranged and sunk in the mating surface of the lower mold 3.2 at a position opposite to the pot 34, and a plurality of runners 37 are arranged radially and sunk so as to connect to the pots 34, respectively. It is set up. The other end of each runner 37 is connected to the lower cavity recess 33b, and a gate 3B is formed at the connection portion so that resin can be injected into the cavity 33. In addition, on the mating surface of the lower die 32, a relief recess 39 is formed in a rectangular shape slightly larger than the outer shape of the multiple lead frame 11, and has a constant depth approximately equal to the thickness thereof, so that the relief recess 39 can escape the thickness of the lead frame. It is embedded in.

Furthermore, in this embodiment, the lower mold cavity recess 3
A hole 40 for forming a convex portion is recessed in the bottom surface of the carrier tape 3b, and the hole 40 has a planar shape that can fit into the holding hole 4 in the carrier tape l. It is formed into a smaller phase shape. An ejector block 41 is fitted into the bottom of the hole 40 so as to be slidable in the vertical direction.

The upper mold 31 and lower mold 32 configured in this way are attached to the mold plates 4 in the upper and lower mounting units 43 and 44.
5 and 46, respectively. Further, an ejector mechanism is attached to the upper and lower mounting units 43 and 44, and the ejector mechanism is configured to eject the molded product from each cavity 33 with an ejector pin 47.4B after resin molding. Ejector pins 47.48 have their rear end heads disposed within upper and lower mounting units 43.44, ejector pin plates 47A, 48A and retainer plates 47B, 48B.
is held between. The ejector pin 47.4B passes through the mold plate 45.46, the upper mold 31, and the lower mold 32, respectively, so that its tip faces the cavity recesses 33a, 33b and the bottom of the runner 37. Among the ejector pins 48 of the lower mold, the one desired in the cavity recess 33b is the ejector block 41 slidably fitted into the hole 40.
is faced with.

The ejector pin 47 of the upper mold is positioned at the bottom of the cavity recess 33a when the mold is closed by a spring, but after the mold is opened, the restoring force of the spring pushes it into the cavity from the bottom of the cavity, etc., and releases the molded product. It is designed to be pushed out. The ejector pin 48 of the lower mold is positioned at the bottom of the ejector block, runner, etc. when the mold is closed by a spring, but after the mold is opened, the upper end is thrust into the cavity etc. by pushing up by another mechanism of the retainer plate 48B. It is designed to extrude molded products.

During transfer molding, the multiple lead frames 11 having the above configuration are accommodated in relief recesses 39 recessed in the lower mold 32, and the pellets 19 in each unit lead frame 12 are accommodated in each cavity 33. It is arranged and set like this. Next, the upper mold 31 and the lower mold 32
The molds are clamped, and resin 49 is fed from the pot 34 by the plunger 35 into each cavity 33 through the runner 37 and the gate 38 and press-fitted therein.

After injection, when the resin is thermoset and the resin-sealed package 22 is molded, the upper mold 31 and the lower mold 32 are opened, and the group of packages 22 is released by the ejector pins 47 and 48. .

In this way, as shown in FIG. 7, the multiple lead frame 11 on which the packages 22 groups have been molded is removed from the transfer molding apparatus 30. Inside the package 22 molded with resin in this way, there is a tab 1.
7. The pellet 19, the inner part 18a of the lead 18, and the wire are sealed with resin.

Here, in this embodiment, the lower mold cavity recess 3
3b is set to mold the main surface on the imposition side of the package 22, and since the hole 40 is recessed in the bottom of the cavity recess 33b, the main surface on the imposition side of the package 22 is formed. The convex portion 23 is formed by the hole portion 40.

The planar shape of the convex portion 23 is formed into an elliptical shape that is slightly smaller than the holding hole 4 in the carrier tape l according to the planar shape of the hole portion 40 . Further, the height of the convex portion 23 is set so as to protrude outward from the main surface on the imposition side of the package 22 and not to protrude outward from the main rotating surface of the outer lead, which will be described later.

Then, the package 22 is placed in the lower mold cavity recess 33b.
When the package 22 is released from the mold, the ejector block 41 fitted into the bottom of the hole 40 in which the convex part 23 is formed is pushed up by the ejector bin 48, and the package 22 is released from the mold. Normally, the height of the convex portion 23 is reduced due to this push-up. Therefore, in order to form the height of the convex portion 23 to a desired value, the hole portion 40 is It is desirable to set the depth of the convex part 23. Moreover, since the convex part 23 defines the effective adhesive area with the carrier tape, as will be described later, it is desirable that the convex part 23 be as smooth as possible.

In this embodiment, since the package 22 is pushed up through the ejector block 41 rather than the ejector bin 48 itself, the height and surface roughness of the convex portion 23 can be sufficiently satisfied depending on the manufacturing precision of the ejector block 41. Accuracy can be ensured.

After the multi-lead frame into which the package has been molded passes through a plating process, as shown in FIG. After the outer frame 13 and dam 15a are cut off by the lead cutting device shown in FIG.
The outer portion 18b of No. 8 is bent downward.

Lead cutting and forming equipment used in this process! 50 is the 8th
As shown in the figure, the feeder 51 is equipped with a feeder 51, which uses an intermittent feeding device (not shown) to move multiple lead frames 11 as a workpiece in one direction at a pitch corresponding to the unit lead frame 12. It is configured to advance. A loader 52 is installed at one end of the feeder 51 (hereinafter referred to as the front end), and the loader 52 loads the multiple lead frames 11 housed in a rack or the like.
It is configured to dispense one sheet onto a feeder 51. A lead cutting device W153 is installed in the middle of the feeder 51, and this device is constructed as shown in FIG. On one side of the lead cutting device W53 in the feeder 51, a lead forming device 54 configured as shown in FIG. 10 is installed in line with the lead cutting device 53. 53 and 54
A handler 55 holds an IC portion 57 as an intermediate product separated from the outer frame of the multiple lead frame 11 by the lead cutting device 53 and connects the lead forming device 54 to the lead forming device 54.
It is equipped so that it can be transferred to An unloader 56 is installed at the rear end of the feeder 51, and this unloader 56 removes the outer frame portion 5B, which is a residual component of the multiple lead frame 11 from which the tCC part 7 was cut out by the lead cutting device 53, from the feeder 51. It is configured to be sequentially lowered and discharged.

The lead cutting device 53 shown in FIG. 9 includes an upper mounting plate 60 and a lower mounting plate 70.
0 is configured to be moved up and down by a cylinder W1 (not shown) to approach and move away from a lower mounting plate 70 fixedly installed on the machine base. Holders 61 and 71 are fixedly attached to both mounting plates 60 and 70, respectively, and upper presser mold 62 and lower presser mold 72 (hereinafter referred to as upper mold 62 and lower mold 72) are attached to both holders 61 and 71. ) are held in alignment with each other.

The upper mold 62 and the lower mold 72 are each formed into a substantially channel-shaped steel shape that fits into each other, and the upper mold 6
2 and the lower mold 72 are configured to press the root portion of the lead 9 from above and below by means of left and right holding portions 63 and 73. In addition, the upper die 62 is similar to the outer frame presser described later.
It is configured to be independently suspended by a guide 6B and a spring 69.

A pair of punches 64 formed in a substantially comb tooth shape (not shown) are arranged in the upper holder 61 on both left and right sides of the upper die 62 so as to correspond to the pitch of the groups of leads 18, and are fixed vertically downward. The punch 64 has a shearing blade 66 disposed on the edge of the teeth and is configured to cut off the outer frame 13 and the dam 18a in cooperation with a shearing die to be described later. An outer frame holder 67 is slidably fitted onto a guide 68 and supported on the upper holder 61 so as to be movable up and down, and the outer frame holder 67 is independently suspended and always urged downward by a spring 69. It is configured to The spring 69 allows the outer frame presser 67 to press and press the outer frame 13 of the lead frame with the upper surface of a shearing goug, which will be described later.

On the other hand, a pair of shearing guides 76 are attached to the holding part 73 of the lower die 72.
The shearing die 76 is disposed on both left and right sides of the reed and is formed in a shape that follows the lower surface of the reed shape, and the shearing die 76 is formed to cut off the outer frame 13 and the dam 15a in cooperation with the shearing blade 66 of the punch 64. ing.

The lead forming device 54 shown in FIG. 1O includes an upper mounting plate 80 and a lower mounting plate 90. Holders 81 and 91 are fixedly attached to the mounting plates 80 and 90, respectively, which are configured to approach and move away from the lower mounting plate 90 fixedly installed above. 81 and 91 have an upper presser die 82 and a lower presser die 92 (hereinafter sometimes referred to as upper die 82 and lower die 92).

) are held aligned with each other. The upper mold 82 and the lower mold 92 are each formed into a substantially channel-shaped steel shape that fits into each other, and the upper mold 82
The lower mold 92 is configured to press the root portion of the lead 18 from above and below using pressing portions 83 and 93 on the left and right sides. The upper die 82 also includes a guide B8 and a spring 8.
It is configured to be independently suspended by 9.

A pair of forming punches 84 are arranged in the upper holder 81 on both left and right sides of the upper mold 82 so as to correspond to the pitch of the groups of leads 18, and are fixed vertically downward. The lead 18 is configured to be able to be bent into a gull wing shape in cooperation with the lead 18. A curved surface portion 85 is formed with an appropriate curvature on the inner shoulder portion of the punch 84 that comes into sliding contact with the outer portion 18b.

On the other hand, a pair of molding guides 94 are attached to the holding part 93 on the lower mold 92.
They are disposed on both left and right sides of the lead outer portion 18b, and are formed in a shape that follows the gull-wing shaped lower surface of the lead outer portion 18b after molding.

Next, the effect will be explained.

As described above, a plurality of solder-plated multiple lead frames 11 are stored in a rack or the like and supplied to the loader 52 of the lead cutting and forming apparatus 50. Loader 52
The multiple lead frames 11 fed to the feeder 51 are sequentially delivered from a rack or the like onto the feeder 51 by a loader 52. frame 12
．． It is advanced one pitch at intervals of 12.

Then, the multiple lead frames 11 are fed step by step on the feeder 51, and the unit lead frames 12 are sequentially fed to the lead cutting device 53.

Here, the operation of the lead cutting device will be explained.

As shown in FIG. 9, the multiple lead frame 11
The unit lead frame 12 is set in the lower die 72 by stepwise feeding so that the package 22 is dropped into the recess. At this time, the convex portion 23 protruding from the lower surface of the package 22 is used as a positioning portion. As a result, the root portion of the lead 18 comes into contact with the holding portion 73 of the lower die 72.

Next, the upper mounting plate 60 is lowered by the cylinder device, and the upper mold 62 and the outer frame retainer 67 are aligned with the lower mold 72 by the biasing force of the spring 69. As a result, the root portion of the lead 18 is clamped and fixed between the pressing portion 63 of the upper mold 62 and the pressing portion 73 of the lower mold 72. Further, the outer frame 13 is clamped and fixed between the outer frame presser 67 and the upper surface of the shearing die 76.

Thereafter, when the upper mounting plate 60 is further lowered, the punch 64 is lowered. At this time, the upper die 62 and the outer frame retainer 67 are compressed and deformed by the tin ring 89, so the lower die 72 and the shearing die are 76 is pressed. As the punch 64 descends, the outer frame 13 and the dam 1 are sheared by the cooperation between the shearing blade 66 of the punch 64 and the shearing die 76.
8a is cut off from the lead 18 group.

When the punch 64 completes a predetermined stroke, the punch 6
4 is raised by the upper mounting plate 60 and returned to its original standby state.

In the lead cutting bag W153, when the cutting is completed and the upper mounting plate 60 is raised, the MSP-10 part 5, which is an intermediate product separated from the outer frame 13 of the multiple lead frame 11, is removed.
7 is transferred from the lower die 72 onto the lower die 92 in the lead forming device 54 by the handler 55.

When the 10 parts 60 are transferred to the lead forming device 54, the multiple lead frame 11 is fed step by step by one pitch of the unit lead frame 12 by the feeder 51, and the above-described cutting operation is performed on the next unit lead frame 12. will be implemented. Thereafter, the cutting operation is repeated for each unit lead frame 12.

Then, the outer frame portion 58 as a residue of the multiple lead frame 11 after the cutting work for all unit lead frames 12 has been completed is lowered from above the feeder 51 in the unloader 56 and collected in a predetermined case.

On the other hand, the ten parts 57 supplied to the lead forming device 54 are subjected to a lead forming operation by this device.

Here, the operation of the lead forming device 54 will be explained.

As shown in FIG.
is set by dropping the package 22 into the recess. Accordingly, at this time, the convex portion 23 protruding from the lower surface of the package 22 is used as a positioning portion.

The root portion of the lead 18 comes into contact with the holding portion 93 of the lower die 92.

Next, the upper mounting plate 80 is lowered by the cylinder device, and the upper mold 82 is aligned with the lower mold 92 by the biasing force of the spring 89. As a result, the root portion of the lead 18 as the bent portion is clamped and fixed between the pressing portion 83 of the upper mold 82 and the pressing portion 93 of the lower mold 92.

Thereafter, when the upper mounting plate 80 is further lowered, the punch 84 is lowered. At this time, the upper mold 82 is pressed against the lower mold 82 because the spring 89 is compressed and deformed.

Furthermore, when the punch 84 is lowered relative to the forming die 94, the lead 18 is moved toward the forming die 94 as the punch 84 is lowered.
4, it is bent to follow this molding die 94 and is molded into a desired gull wing shape. The outer portion 18b of the lead 18 (hereinafter sometimes referred to as outer lead) formed in a gull wing shape in this way has a lower surface (main surface on the surface side) that is slightly smaller than the lower surface of the convex portion 23 of the package 22. It is designed to protrude downward.

When the bread thousand 84 completes the prescribed stroke, the bread thousand eight
4 is raised and returned to the original standby state. Thereafter, the molded IC is removed from the lower mold 92 and sent to the next process.

Resin-sealed SOP/IC2 manufactured as above
4. After undergoing screening through environmental testing and selection inspection through electrical property testing, non-defective products are shown in Figures 1 and 2.
As shown in the figure, it is packed with carrier tape l.

That is, a good IC 24 is held by a suitable holding means (not shown) such as a vacuum suction collet, and the holding tape is held so that the protrusion 23 on the lower surface of the package 22 is aligned with the holding hole 4 in the carrier tape 1. It will be listed on 2. When the convex portion 23 of the IC 24 is aligned and inserted into the holding hole 4, as shown in FIG.
3, the IC 24 is adhesively held by the adhesive tape 5 with the holding tape 2 in between. At this time, since the lower surface of the convex portion 23 as the surface to be adhered is fitted into the holding hole 4, the adhesive tape 4 does not have to bend deeply into the retaining hole 4 to transfer its adhesive Ji6 to the lower surface of the convex portion 23. It can be glued all over. Therefore, since the effective adhesive area of the adhesive layer 6 of the adhesive tape 5 becomes large, its holding power becomes extremely strong.

In addition, since the convex portion 23 is formed to be soft and conformal to the holding hole 4, when the convex portion 23 is inserted into the holding hole 4, the convex portion 23 and the opening edge of the holding hole 4 are engaged. Therefore, the IC 24 is reliably positioned by the holding tape 2 via the protrusion 23 and the holding hole 4. Therefore, combined with the increase in the effective adhesive area, IC2
4 will be properly and strongly packed in carrier tape l.

In this way, the carrier tape l holding the IC 24 group in position is wound into a reel by a winding device or the like (not shown). etc. will be supplied to

In an IC mounting factory, etc., as shown in FIG. 11, the carrier tape l is regularly fed out from a reel (not shown) and is pitch-fed through the pilot hole 3, and the adhesive tape 5 is holding tape 2
The sprocket 7 separates the film from the sprocket 7. In conjunction with this pitch feeding, the package 2 is moved from above the holding tape 2.
IC 24 is removed from carrier tape 1 by suctioning and holding IC 24 by vacuum suction collet 8 .

The removed IC 24 is then automatically mounted on the printed wiring board 25 as shown in FIGS. 12 and 13.

In FIGS. 12 and 13, printed wiring board 2
A plurality of lands 26 are disposed on the 5 OP-IC 24 to correspond to each outer lead 18b of the resin-sealed 5 OP-IC 24 to be mounted, and are formed into a substantially rectangular thin plate shape using a solder material. As mentioned above, the I that is suction-held by the collet and removed from the carrier tape 1
The C24 is arranged so that the groups of outer leads 18b are aligned with the groups of lands 26, and its main surface on the imprint side is brought into contact with the board and the land, and each outer lead 1
8b and the land 26 are subjected to reflow soldering. By this flow soldering process, a solder mound Fi21 is formed, and the IC 24 is electrically and mechanically connected to the printed wiring board @25.

In this mounting work, if a positioning portion 2 that engages with a convex portion 23 protruding from the main surface on the imposition side of the IC 24 is formed at the center of the group of lands 26 of the printed wiring board 25,
By engaging the convex portion 23 of the IC 24 with the positioning portion 28', the IC 24 can be positioned, so that alignment between the group of outer leads 18b and the group of lands 26 can be precisely and easily ensured.

By the way, as shown in FIG. 14, in the case of a conventional IC 24' in which the convex part 23 is not protruded from the main surface on the imposition side, and the concave part 23' formed by the ejector pin mark is recessed. , the effective adhesive area of the adhesive layer 6 of the adhesive tape 5 becomes narrow.

That is, if there is no convex portion on the bottom surface of the IC, in order for the adhesive tape 5 to adhere the adhesive layer 6 to the IC 24', the holding hole 4 must be
It is necessary to penetrate deep into the bend.

In this state where the adhesive tape 5 has penetrated deeply, the opening edge portion of the adhesive tape 5 has a large area toward the center and is separated from the IC 24'.

Furthermore, if the ejector pin mark recess 23' is sunk in the IC 24' in the central part where it has penetrated deeply, the adhesive tape 5 will be in a state of bridging between the openings of the recess 23'. Therefore, the adhesive layer 6 of the adhesive chip 15 cannot adhere to the bottom surface of the recess 23'.
The area that C24' adheres to package 22' is extremely limited.

If the adhesive area of the adhesive tape is small like this,
The adhesive holding force of the adhesive tape to the IC is reduced, so when the carrier tape is wound onto a reel or fed out, and since the IC is not positioned by the holding hole, the IC is held in place on the carrier after the adhesive tape is peeled off. As a result, the IC moves loosely with respect to the tape, causing the IC to fall off from the carrier tape or become misaligned. As a result, efficiency and mounting accuracy are reduced in automatic mounting work using the carrier tape.

However, in this embodiment, as mentioned above, the IC24
is adhesively held on the carrier tape l with a large adhesive area, and the protrusion 23 is fitted into the holding hole 4 to regulate its position, so that the IC 24 is reliably positioned and strongly held on the carrier tape l. Therefore, when packaging and automatic mounting using carrier tape, IC
24 will not fall off or move loosely from the carrier tape 1, and will be carried out properly and precisely.

According to the embodiment described above, the following effects can be obtained.

(1) By forming the adhesive surface on the main surface of the surface-mounted package so that it can fit into the holding hole formed in the carrier tape used for packaging this semiconductor device, the carrier tape The adhesive tape can be applied over a wide area to the surface to be adhered within the holding hole, increasing the adhesive tape's holding power to the semiconductor device, allowing the semiconductor device to be properly held in the desired position on the carrier tape. can be done.

(2) By forming the adhesive surface into a convex shape that can engage at least a portion of the holding hole, the positioning of the carrier tape relative to the semiconductor device can be further improved by the engagement of the adhesive surface with the holding hole. can be increased.

(3) By reliably positioning the IC on the carrier tape, it is possible to improve the reliability and work efficiency of IC packaging and automatic mounting using the carrier tape. Productivity can be significantly increased.

(4) By forming a positioning portion in the center of the land group of the printed wiring board to engage with the adhesive surface protruding from the main surface on the imposition side of the semiconductor device, the printed wiring of this semiconductor device can be easily adjusted. At the time of board mounting, the position can be regulated by engaging the adhesive surface part with the positioning part, so that the alignment state between the semiconductor device and the land can be precisely and easily ensured.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the adhesive part is not limited to being formed in a smaller shape with the holding hole, but may be formed in a shape such that part of it engages with a part of the holding hole when it is immersed in the holding hole. .

In the above explanation, we have mainly explained the case where the invention made by the present inventor is applied to the mounting automation technology using a carrier tape for SOP/IC having a surface-mounted package, which is the field of application that formed the background of the invention, but it is limited to this. The present invention can be applied to all semiconductor devices equipped with surface-mounted packages such as QFP/IC, MSP/IC, etc.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

By forming the adhesive surface on the main surface of the surface-mounted package so that it can be inserted into the holding hole formed in the carrier tape used for packaging the semiconductor device, the adhesive tape of the carrier tape can be fixed. Since the adhesive can be applied to the surface to be adhered with a wide surface inside the holding hole, the adhesive tape can increase the holding power of the semiconductor device to properly hold the semiconductor device in the desired position on the carrier tape. can be done.

[Brief explanation of the drawing]

Fig. 1 is a partial perspective view showing the packing state of an SOP/IC with a carrier tape, which is an embodiment of the present invention; Fig. 2 is an enlarged partial vertical sectional view taken along the line ■-■ of Fig. 1; Fig. 3; 4 is a longitudinal sectional view taken along the line IV-IV of FIG. 3, FIG. 5 is a front sectional view of the transfer molding device, and FIG. 6 is a partial plan view of the object to be packaged. 7 is a partial plan view showing the resin-sealed package after molding; FIG. 8 is a schematic plan view showing the lead cutting and molding device; FIG. 9 is a front sectional view showing the lead cutting device. Fig. 10 is a front sectional view showing the lead forming device, Fig. 11 is a partially cutaway front view showing the mounting operation, Fig. 12 is a perspective view showing the mounting state, the first drawing is a longitudinal sectional view, FIG. 14 is a longitudinal sectional view showing a comparative example for explaining the effect. l...carrier tape, 2...holding tape, 3...
・Pilot hole, 4... Holding hole, 5... Adhesive tape, 6... Adhesive layer, 7... Sprocket, 8... Vacuum suction collet, 11... Multiple lead frame, 12
...Unit lead frame, 13...Outer frame, 14...
- Section frame, 15... Dam member, 15a... Dam, 16... Tab suspension lead, 17... Tab, 18
...Lead, 18a...Inner part, 18b...Outer part (outer lead), 19...Pellet, 20...
...Ponding layer, 21...Wire, 22...Package, 23...Convex part (sticky part), 24...S
OP/IC (semiconductor device), 25... Printed wiring board, 26... Land, 27... Solder sensitive layer, 28...
...Positioning unit, 30...Transfer molding device, 3
1... Upper mold, 32... Lower mold, 33... Cavity, 33a... Upper mold cavity recess, 33b...
Lower mold cavity recess, 34... pot, 35...
Plunger, 36... Cal, 37... Runner, 38
...Gate, 39...Escape recess, 40...Hole,
41... Ejector block, 43.44... Mounting unit, 45.46... Template, 47.48... Ejector pin, 47A, 48A... Ejector bin plate, 47B, 48B... Retainer plate, 50
... Lead cutting and forming device, 51 ... Feeder, 52
...Loader, 53...Lead cutting device, 54...
Lead forming device, 55...handler, 56...unloader, 57...Ic section, 58...outer frame section. Agent Patent Attorney Tatsu Kajihara

Claims (1)

[Scope of Claims] 1. A semiconductor device equipped with a surface-mounted package, wherein an adhesive surface is provided on the main surface of the surface-mounted side of the package on a carrier tape used for packaging the semiconductor device. What is claimed is: 1. A semiconductor device characterized in that the semiconductor device is formed so that it can be inserted into a holding hole. 2. The semiconductor device according to claim 1, wherein the adhesive surface portion and the holding hole of the carrier tape are each formed so as to be at least partially engaged with each other. 3. The semiconductor device according to claim 1, wherein the adhesive surface portion is configured to be used as a positioning portion when the semiconductor device itself is mounted.