JPH06252291A - Semiconductor device - Google Patents

Abstract

PURPOSE:To ensure a favorable positioning accuracy in works after resin seal ing, and improves working speed. CONSTITUTION:A notch 26 for alignment is formed at two opposite corners of a TQFP IC resin sealing package body 25. Each of the two notches 26 is a shallow pyramidal hole and provided with a V-shaped butting face 50. Thus, butting a pair of guiding pawls 51, mounted on a mounting apparatus, against the butting faces of the alignment notches 26 from both sides, accomplishes accurate IC positioning and increases working speed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a technique for accurately positioning a semiconductor device having a surface mount type package when it is mounted on a substrate.
The present invention relates to a device effectively used for positioning a semiconductor integrated circuit device (hereinafter referred to as TQFP IC) provided with a thin quad flat package.

[0002]

2. Description of the Related Art Generally, in a work after resin sealing in a TQFP / IC which is an example of a surface mount type semiconductor device, various processes such as a cutting process of leads, a molding process or a printed wiring board are performed. Positioning work is required in the mounting process. For example, when mounting a TQFP IC on a printed wiring board, a plurality of outer lead groups of the TQFP IC are accurately positioned on a plurality of lands provided on the printed wiring board,
Must be soldered.

Conventionally, this positioning work is performed by the following means. A positioning station is installed to perform position correction work. Position correction work is performed by a position correction mechanism that uses laser light, scattered light, nails, blocks, and the like. Position correction work is carried out by equipping an image recognition and correction device using a CCD camera.

[0004]

However, it is particularly small, the pitch between leads is narrow, and the number of leads is large.
In the QFP / IC, it is difficult to accurately position the plurality of outer leads on the plurality of lands provided on the printed wiring board due to the limitation of the resolution capability.
The outer lead may not be accurately arranged on the land portion of the printed wiring board.

Further, there is a problem that the work speed is lowered due to the addition of the correction work. When the type of semiconductor device to be handled changes, it is necessary to change the equipment according to the type, and there is a drawback that the setup work becomes complicated.

The object of the present invention is to improve the positioning accuracy in the alignment work during the work after sealing.
Another object of the present invention is to provide a semiconductor device capable of improving work speed.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0008]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, a plurality of leads electrically connected to the respective electrodes of the semiconductor pellet in which an electronic circuit is formed, and a package body for sealing the semiconductor pellet and a part of the lead are provided. A semiconductor device provided with a package is characterized in that the package is provided with an alignment portion for performing alignment during a work after sealing.

[0010]

According to the above-mentioned means, for example, when mounting a semiconductor device on a printed wiring board, by accurately aligning the aligning portion on the mounting machine side with the aligning portion provided on the package, The semiconductor device can be aligned with good workability.

[0011]

1 (a) and 1 (b) are a front view and a plan view showing a TQFP / IC and a mounting claw of a mounting machine according to an embodiment of the present invention. 2 to 5 are explanatory diagrams of each step for explaining the method of manufacturing the TQFP / IC. Figure 6
(A), (b) is the partially cut front view and top view which show TQFP * IC. FIG. 7 is a perspective view showing a mounted state of the TQFP / IC.

In this embodiment, the semiconductor device according to the present invention is configured as a semiconductor integrated circuit device (TQFP IC) having a thin quad flat package. The TQFP / IC 9 includes a pellet in which a semiconductor integrated circuit is formed, and a package 10 that surrounds the pellet and electrically guides the semiconductor integrated circuit to the outside.
Has a plurality of leads electrically connected to the respective electrodes of the pellet semiconductor pellet, and a package body for resin-sealing the pellet and a part of the lead.

That is, the TQFI / IC9 package 10 is made of resin and is molded into a substantially square flat plate by a resin molding method such as transfer molding. The outer lead 19b group is provided on each of four side surfaces of the main body 25 so as to project outward, and is provided with a group of outer leads 19b that are bent and formed in a so-called gull wing shape. A pellet 22 having a circuit built therein is resin-sealed. And the pellet 22
The integrated circuit built in is formed by each outer lead 19b via the bonding wire 23 bridged between the electrode pad of the pellet 22 and the inner lead 19a integrally connected to each outer lead 19b. The package body 25 is electrically drawn out.

A TQFP, which is an embodiment of the present invention, will be described below.
An IC manufacturing method will be described. By this explanation, TQFP
-The details of the structure of the IC will be clarified together.

In this embodiment, the manufacturing method of the TQFP / IC is based on the multiple lead frame 11 shown in FIG.
Is used. The multiple lead frame 11 is made of a thin plate made of a spring material having a relatively large mechanical strength, such as an iron-nickel alloy or phosphor bronze, and is suitable for punching or etching. Is integrally molded with the lead frame 11, and the surface of the multiple lead frame 11 is plated with silver (Ag) or the like.
It is partially or wholly applied so that the wire bonding described later is properly performed (not shown). A plurality of unit lead frames 12 are arranged side by side in a row in the multiple lead frame 11. However, only one unit is shown.

The unit lead frame 12 has a positioning hole 13
There is provided a pair of outer frames 13 in which a is provided, and both outer frames 13 are arranged in parallel at a predetermined interval and extend in series. Adjacent unit lead frame 1
A pair of section frames 14 are provided between the outer frame 13 and the outer frame 13,
The unit lead frames 12 are arranged in parallel with each other between the 13 and are integrally installed. The unit lead frame 12 is formed in a substantially square frame body (frame) formed by the outer frame and the section frame.

In each unit lead frame 12, a dam suspension member 15 is provided at the connecting portion of the outer frame 13 and the section frame 14 so as to be disposed in a substantially right angle direction and integrally projected. The four dam members 16 are arranged so as to have a substantially square frame shape and are integrally suspended.

A tab suspension lead 17 is arranged at one end of each dam member 16 on the side of the section frame 14, and the tab suspension leads 17 are arranged at approximately 4
The tabs 18, which are integrally provided so as to face each other in the direction of 5 degrees and are formed in a substantially square flat plate shape at the tips of the tab suspension leads 17, are substantially concentric with the frame shape of the dam member 16 group. The tab suspension leads 17 are integrally arranged so as to be suspended by the tab suspension leads 17.

Each tab suspension lead 17 is bent near the tab 18, and the tab suspension lead 17 is bent.
Due to the bending, the tab 18 is lowered from the surface of the lead group 19 described later by the thickness of the pellet 22 described later (so-called tab lowering).

Further, a plurality of leads 19 as electric wiring are arranged on the dam member 16 at equal intervals in the longitudinal direction, and are integrally projected so as to be parallel to each other and orthogonal to the dam member 16. . The inner end of each lead 19 is arranged so that the tip surrounds a tab 18 for bonding a pellet, which will be described later, to form an inner portion (hereinafter sometimes referred to as an inner lead) 19a. . On the other hand, the outer extension of each lead 19 has its tip connected to the outer frame 13 and the section frame 14,
Outer part (hereinafter sometimes referred to as outer lead) 1
9b respectively. The portion of the dam member 16 between the adjacent leads 19, 19 dams the flow of the resin at the time of molding the package to be described later.
It substantially constitutes a.

For the multiple lead frame thus constructed, pellet bonding work and then wire bonding work are carried out for each unit lead frame. These bonding operations are sequentially performed for each unit lead frame by laterally pitching multiple lead frames.

First, as shown in FIG. 3, pellets 22 as a semiconductor integrated circuit structure in which an integrated circuit is formed by a so-called pre-process in the manufacturing process of a semiconductor device by pellet bonding work are performed. The unit lead frame 12 is arranged at a substantially central portion on the tab 18 and is mechanically fixed by a bonding layer 21 formed between the tab 18 and the pellet 22 for bonding. As a method for forming the pellet bonding layer 21, a bonding method using a gold-silicon eutectic layer, a soldering layer, a silver paste adhesive layer, or the like can be used. However, it is desirable to form the bonding layer 21 so that it does not become a barrier of heat transfer from the pellet to the tub, if necessary.

Then, by wire bonding work,
As shown in FIG. 3, a bonding wire 23 is ultrasonic thermocompression bonded between the bonding pad 22a of the pellet 22 bonded on the tab 18 and the inner portion 19a of the lead 19 of each unit lead frame 12. By using a suitable wire bonding device (not shown), such as a conventional wire bonding device,
Both ends thereof are respectively bonded and bridged.
As a result, the integrated circuit formed in the pellet 22 is bonded to the bonding pad 22a and the bonding wire 2
3, inner portion 19a and outer portion 19b of the lead 19
It will be electrically drawn out through the.

The pellet 24 and the wire-bonded assembly 24 thus formed include a package main body 25 group which is resin-sealed for each unit lead frame, and a transfer molding device 30 as shown in FIG. Used and co-molded per unit lead frame group.

The transfer molding apparatus 30 shown in FIG. 4 is provided with a pair of upper mold 31 and lower mold 32 which are clamped to each other by a cylinder device or the like (not shown).
On the mating surface of the upper mold 31 and the lower mold 32, a plurality of upper mold cavity recesses 33a and a plurality of lower mold cavity recesses 33b are provided so as to cooperate with each other to form the cavity 33.

A pot 34 is opened on the mating surface of the upper die 31, and a cylinder device (not shown) is provided in the pot 34.
A plunger 35 that is advanced and retracted by is inserted so that a resin (hereinafter, referred to as a resin) as a molding material can be fed.

On the mating surface of the lower mold 32, a cull 36 is disposed so as to face the pot 34 and is recessed.
A plurality of runners 37 are radially arranged so as to be respectively connected to the pots 34 and are recessed. The other end of each runner 37 is connected to the lower cavity recess 33b, and a gate 38 is formed at that connection so that the resin can be injected into the cavity 33. Further, the multiple lead frame 11 is provided so that an escape recess 39 can escape the thickness of the lead frame on the mating surface of the lower die 32.
It has a rectangular shape slightly larger than the outer shape, and is submerged at a constant depth of a size approximately equal to its thickness.

Further, in this embodiment, the convex portions 40 for forming the notches for alignment, which will be described later, are provided at the two corner portions at diagonal positions in the upper mold cavity concave portion 33a, respectively. There is. Each convex portion 40 is formed in a square thin pyramid shape, and its height and size are set so that the notch for alignment formed by this can surely exert the positioning function described later. Has been done.

When the resin-sealed package body is transfer-molded by using the assembly 24 having the above structure, the cavities 3 in the upper mold 31 and the lower mold 32 are formed.
3 is a pair of dams 16 in each unit lead frame 12.
It corresponds to the space between a and 16a, respectively.

At the time of transfer molding, in the assembly 24 having the above-mentioned structure, the multiple lead frame 11 has the lower die 3
It is housed in the escape recess 39 that is buried in the unit 2, and the pellets 22 in each unit lead frame 12 are arranged and set so as to be housed in each cavity 33.

Subsequently, the upper mold 31 and the lower mold 32 are clamped, and the resin 41 is moved from the pot 34 by the plunger 35 through the runner 37 and the gate 38.
It is sent to 3 and press-fitted.

After the injection, when the resin is thermoset and the resin-sealed package body 25 is molded, the upper die 31 and the lower die 32 are opened, and the package body is ejected by an ejector pin (not shown). Twenty-five groups are released. The assembly 28 in which the group of package bodies 25 is molded in this manner is removed from the transfer molding device 30 as shown in FIG. The tab 18, the pellet 22, the inner portion 19a of the lead 19 and the wire 23 are provided inside the package body 25 resin-molded as described above.
Will be resin-sealed.

A notch 26 for positioning is formed on the upper surface of the resin-sealed package main body 25 by the convex portion 40 of the upper mold cavity concave portion 33a, and the resin-sealed package is formed at two corner portions at diagonal positions. It is provided symmetrically with respect to the center position of the main body 25. Each notch 26 is recessed in the shape of a square shallow pyramid hole, and a V-shaped abutting surface 50 is formed therein. Positioning guide claws on the mounting machine side, which will be described later, are abutted against these V-shaped abutting surfaces 50, so that the TQFP / IC, which will be described later, is aligned with the printed wiring board. Incidentally, the direction indicating mark 27 is cut in a triangular shape at one of the remaining two corners.

Although not shown, the assembly 28, which is a semi-finished product formed by molding the resin-sealed package body, sequentially cuts off the outer frame 13 and the dam 16a for each unit lead frame in the lead cutting molding process, and The outer portion 19b of each lead 19 is bent and formed in a gull wing shape. As a result, resin-sealed TQFP / IC
9 is manufactured, but the notch 26 for positioning is recessed in the pair of corners of the resin-sealed package body 25 in the package 10 of the TQFP / IC 9.

The resin-sealed type T manufactured as described above
The QFP / IC 9 is mounted on the printed wiring board as shown in FIG.

A plurality of lands 43 are arranged on the printed wiring board 42 so as to correspond to the outer leads 19b of the resin-sealed TQFP / IC 9 which is a mounting object, and a substantially rectangular thin plate made of a solder material is used. It is formed in a shape, and this TQFP / IC9
Of the outer leads 19b are aligned and brought into contact with each other, and each outer lead 19b and the land 43 are electrically and mechanically connected by a solder layer (not shown) formed by a reflow soldering process. .

The work of aligning the outer leads 19b of the resin-sealed TQFP / IC 9 with the lands 43 of the printed wiring board 42 is performed as follows.
That is, as shown in FIG. 1, a pair of positioning guide claws 51 are provided in the mounting mechanism side positioning mechanism portion, and these guide claws 51 are provided so as to be movable back and forth on the same straight line. And their tip surfaces 52 are TQFP · I
It is formed in a V-shape that matches the abutting surfaces 50 of the two corners of the resin-sealed package body 25 of the C9 package 10.

When the TQFP / IC 9 is mounted on the printed wiring board 42, the TQFP / IC 9 is transported and stopped at the pickup position. At this time, TQFP
The IC 9 is disposed between the pair of guide claws 51 on the mounting machine side, and the two corners provided with the notches 26 are disposed along the advancing / retreating direction of the guide claws 51.

Next, the pair of guide claws 51 on the mounting machine side advance and stop at predetermined positions, so that each guide claw 51 has two notches for alignment in the resin-sealed package body 25 of the TQFP / IC 9. The resin-sealed package main body 25 is abutted against the abutting surface 50 of the portion 26.
Positioning is performed by being sandwiched by the pair of guide claws 51. By this alignment, the center position of the resin-sealed package body 25 is aligned with the center position of the collet suction surface at the time of suction of the collet 53 provided on the mounting machine side.

When the alignment of the TQFP / IC 9 is completed, the collet 53 on the mounting machine side descends to the pickup position and comes into contact with the upper surface of the resin-sealed package body 25 of the TQFP / IC 9 to stop. At this time, as described above,
The center position of the resin-sealed package body 25 is the collet 53.
Is aligned with the center position of the suction surface of.

Next, the pair of guide claws 51 on the mounting machine side are T-shaped.
Abutting surface 5 at two corners of QFP / IC9
While retreating from 0, collet 53 is TQFP · I
C9 is adsorbed and moved to the put-down position where the printed wiring board 42 is arranged. And collet 53
The TQFP / IC 9 moved by is transferred onto the printed wiring board 42 in a state where each outer lead 19b is aligned with each land 43 of the printed wiring board 42, and is transferred onto the printed wiring board 42 as described above. Solder mounted.

According to the above embodiment, the following effects can be obtained. By locating the notches for alignment in the two corners of the resin-sealed package body of the TQFP / IC, and abutting the abutting surfaces of these notches with the tip end surface of the guide claw on the mounting machine side, By performing the alignment of the TQFP / IC, the alignment work speed is high and the alignment can be performed accurately.

Since it is not necessary to change the equipment on the mounting machine side according to the number of outer leads and the pitch between the outer leads, the setup time for the work can be shortened even when the type of IC to be handled changes. Good sex.

The equipment on the mounting machine side is also inexpensive.

FIG. 8 shows a TQFP / second embodiment of the present invention.
It is a top view which shows IC.

In the first embodiment, by aligning the center position of the resin-sealed package body 25 in the TQFP IC 9 with the center position of the suction surface of the collet 53, the TQFP IC 9 is aligned with the printed wiring board 42. However, in the second embodiment, TQFP · I is placed at the center of the suction surface of the collet 53.
The position eccentric from the center position of the resin-sealed package body 25A at C9A is aligned. The TQFP / IC 9A is aligned with the printed wiring board 42 by the eccentric position.

Therefore, according to the second embodiment, the notches 26 each having a square shallow pyramid hole shape are formed at the two corners diagonally located on the upper surface of the resin-sealed package body 25A.
Although A is formed, these notches 26A are not formed symmetrically and have different sizes. That is,
The center position between the abutting surfaces 50A in each notch 26A is arranged at a position displaced from the center position of the resin-sealed package body 25A.

Therefore, the TQFP.I of the collet 53 is
When C9A is adsorbed, the center of the adsorbing surface of the collet 53 is arranged at a position deviated from the center on the upper surface of the resin-sealed package body 25A, and the TQFP / IC9A is adsorbed by the collet 53 and transferred to the printed wiring board 42. Will be.

FIG. 9 shows TQFP, which is Embodiment 3 of the present invention.
It is a partially cut front view and a plan view showing an IC and a guide claw on the mounting machine side.

The third embodiment differs from the first embodiment in TQFP.
-The configuration of the alignment portion formed on the resin-sealed package body of the IC is different. The alignment portion according to the third embodiment is formed by integrally forming, on the side surfaces of two corner portions of the resin-sealed package body 25B at diagonal positions, protrusions 60 that project outward diagonally. .
A pair of guide claws 51 on the mounting machine side that are abutted against these
The front end surface 52B of B is the resin-sealed package body 25B.
It is formed in a shape that matches the abutting surface 50B at the tip of the protruding portion 60, and the alignment work of the TQFP / IC 9B is performed in the same manner as described in the first embodiment.

FIG. 10 is a fourth embodiment of the present invention TQFP.
-A partially cut front view and a plan view showing an IC and a guide pawl on the mounting machine side.

The fourth embodiment also differs from the first to third embodiments in the positioning mechanism. That is, the fourth embodiment is TQFP.
-Through corners of the IC 9C, which are diagonally opposite to each other in the resin-sealed package body 25C, through-holes 70 are formed so as to vertically pass therethrough. The light emitting unit 71 arranged above and below the positioning mechanism unit on the mounting machine side.
And a pair of the light receiving portions 72 are provided at a predetermined distance.

Therefore, when aligning the TQFP / IC 9C, each light projecting portion 71 of the aligning mechanism portion on the mounting machine side is arranged.
The light rays projected from the light pass through the through holes 70 formed in the resin-sealed package body 25C of the TQFP / IC 9C and are received by the respective light receiving portions 72.
The C29C alignment is performed.

FIG. 11 shows TQFP which is Embodiment 5 of the present invention.
-A partially cut front view and a plan view showing an IC and a guide pawl on the mounting machine side.

In the first to fourth embodiments, the alignment portion is formed on the resin-sealed package body, but in the fifth embodiment, it is formed on the lead. That is, the fifth embodiment is shown in FIG.
As shown in FIG. 12, in each unit lead frame 12D of the multiple lead frame 11D, two tab suspension leads 17D at diagonal positions of the tab 18 are extended to the outside of the dam member 16 so that the tab suspension leads 17D shown in FIG. As shown in FIG.
The positioning leads 80 are projected outward on the diagonals from the side surfaces of the two corner portions at the diagonal positions.

These mounting leads 80 are mounted on the mounting machine side.
Tip surface 52D aligned with the abutting surface 50D of the protruding tip of the
Is provided with a pair of guide claws 51D,
The alignment work of the FP / IC 9D is performed in the same manner as that described in the first embodiment.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

The plurality of alignment portions formed on the package body are not limited to being formed on the corner portions of the package body, but may be formed on each side of the package body.

The notch for alignment is not limited to the square hole shape, but may be a semicircular hole shape, a partially notched prismatic shape, or the like, and the shape is not limited.

In the above description, the invention made by the present inventor is the field of application which is the background of the invention.
Although the case of application to a P / IC has been described, the present invention is not limited to this, and a normal QFP / IC or TQFI
The present invention can be applied to ICs including surface mount packages such as ICs and QFI / ICs, and other semiconductor devices in general. Further, it is effective when applied to a semiconductor device which is particularly small in size, has a narrow pitch between leads, and has a large number of leads.

Further, although the present invention has been described above in the mounting work of the semiconductor device, the present invention is not limited to the mounting work, and positioning is required in a work process after sealing, for example, a lead cutting process or a molding process. It is possible to apply to the process.

[0062]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

By providing the package with an alignment portion for performing alignment during the work after sealing, it is possible to accurately perform the process after sealing, for example, a cutting process, a molding process, or a mounting process on a printed wiring board. The semiconductor device can be aligned with good workability.

[Brief description of drawings]

1A and 1B are a front view and a plan view showing a TQFP / IC according to an embodiment of the present invention and a guide claw on a mounting machine side.

FIG. 2 is a partially omitted plan view showing a multiple lead frame used in the method for manufacturing the TQFP / IC.

FIG. 3 is a partially omitted plan view showing a state after a pellet and wire bonding step.

FIG. 4 is a partially omitted vertical sectional view showing a molding step of a resin-sealed package body.

FIG. 5 is a partially cutaway partially cutaway plan view showing the assembly after molding the resin-sealed package body.

FIG. 6 is a partially cut front view and a plan view showing a TQFP / IC according to an embodiment of the present invention.

FIG. 7 is a perspective view showing a mounted state of a TQFP / IC.

FIG. 8 is a plan view showing a TQFP / IC that is Embodiment 2 of the present invention.

9A and 9B are a partially cut front view and a plan view showing a TQFP / IC that is Embodiment 3 of the present invention and a guide claw on the mounting machine side.

10A and 10B are a partially cut front view and a plan view showing a TQFP / IC that is Embodiment 4 of the present invention and a guide pawl on the mounting machine side.

11A and 11B are a partially cut front view and a plan view showing a TQFP / IC according to a fifth embodiment of the present invention and a guide pawl on the mounting machine side.

FIG. 12 is a partially omitted plan view showing a multiple lead frame used in a method of manufacturing a TQFP / IC according to a fifth embodiment of the present invention.

[Explanation of symbols]

9, 9A, 9B, 9C, 9D ... TQFP / IC (semiconductor device), 10 ... Package, 11, 11D ... Multiple lead frame, 12, 12D ... Unit lead frame, 13 ...
Outer frame, 14 ... Section frame, 15 ... Dam suspension member, 16
... dam member, 16a ... dam, 17, 17D ... tab suspension lead, 18 ... tab, 19 ... lead, 19a ... inner portion (inner lead), 19b ... outer portion (outer lead), 21 ... bonding layer, 22 ... pellet, 22a
... bonding pad, 23 ... wire, 24 ... assembly,
25, 25A, 25B, 25C, 25D ... Resin-sealed package body, 26 ... Positioning notch, 27 ... Direction mark, 28 ... Assembly after resin-sealed package body molding, 30 ... Transfer molding device, 31 … Upper mold, 32…
Lower mold, 33 ... Cavity, 33a ... Upper mold cavity recess, 33b ... Lower mold cavity recess, 34 ... Pot,
35 ... Plunger, 36 ... Cull, 37 ... Lanna, 38 ...
Gate, 39 ... Escape recess, 40 ... Positioning notch forming protrusion, 41 ... Resin, 42 ... Printed wiring board, 4
3 ... Land, 50, 50A, 50B, 50D ... Abutting surface, 51, 51B, 51D ... Guide claw, 52, 52B,
52D ... Tip surface, 53 ... Collet, 60 ... Protrusion, 70
... through hole, 71 ... light projecting portion, 72 ... light receiving portion, 80 ... positioning lead.

Claims (5)

[Claims] 1. A plurality of leads electrically connected to each electrode of a semiconductor pellet in which an electronic circuit is formed, and a package body for sealing the semiconductor pellet and a part of the lead. A semiconductor device provided with a package, wherein the package is provided with an alignment section for performing alignment during work after sealing. 2. The semiconductor device according to claim 1, wherein the alignment portion is a cutout portion formed in the package body. 3. The semiconductor device according to claim 1, wherein the alignment portion is a protrusion integrally formed on a side surface of the package body. 4. The semiconductor device according to claim 1, wherein the alignment section is a positioning hole formed so as to vertically penetrate the package body. 5. The alignment portion is a lead provided separately from a plurality of leads electrically connected to each electrode of the semiconductor pellet, and protrudes from a side surface of the package body. The semiconductor device according to claim 1, wherein the semiconductor device is a lead.