JP3250900B2 - Semiconductor device, method of manufacturing the same, and lead frame - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, a method of manufacturing the same, and a lead frame, and more particularly to a semiconductor device having a connection portion connected to an external terminal on the bottom surface of a package, a method of manufacturing the same, and a lead frame.

2. Description of the Related Art With the recent miniaturization, high speed, and high performance of electronic devices, there is a similar demand for semiconductor devices used for them.

In addition to such demands on the semiconductor device itself, there is also a demand for improvement in mounting efficiency when the semiconductor device is mounted on a substrate and simplification of a mounting structure.

Therefore, a surface mounting type semiconductor device in which leads are connected on the surface of a mounting substrate is currently mainstream.
Further, there is a demand for a semiconductor device which has improved mounting efficiency and simplified mounting structure.

[0005]

2. Description of the Related Art As electronic devices have become more sophisticated in recent years, the density of semiconductor devices provided in the electronic devices has been increased, and the number of leads provided in the semiconductor devices has tended to increase accordingly. As a package structure for mounting a semiconductor device having a large number of leads on the surface in this way, a QFP (Quad Flat Package) type package having a configuration in which the leads extend outward from the four sides of the package so as to form a gull-wing shape is known. I have.

However, in the QFP type package structure in which the leads extend outward from the four sides of the package, as the number of leads increases, the thickness of the leads necessarily decreases, the mechanical strength decreases, and adjacent leads are formed. There is a possibility that the pitch between leads becomes narrow and interference between leads occurs.

A BGA is used as a surface mounting structure to solve this problem.
(Ball Grid Array) type package structure is known. FIG. 15 shows this BGA type package structure. A semiconductor device 1 adopting the BGA type package structure shown in FIG. 1 has a semiconductor chip 3 joined to a substrate 2 by a dicing agent 4 and an electrode portion disposed on the upper surface of the substrate 2 and a semiconductor chip. An electrical connection is made between the first and third wires by a wire 5. Further, a resin package 6 (shown in satin) is formed by disposing a mold resin on the upper portion of the substrate 2, and the semiconductor chip 3 is protected from the outside by the resin package 6.

Further, through holes or vias (not shown) are formed in the substrate 2, and the electrodes connected to the semiconductor chip 3 and the wires 5 by the through holes or vias are formed on the rear surface of the substrate 2. An external connection electrode (not shown) is formed at the extracted portion. A solder ball 7 is provided on the external connection electrode, and the semiconductor device 1 is mounted on the mounting board 8 by joining the solder ball 7 to an electrode portion 9 provided on the mounting board 8. And it was.

[0009]

However, in the above-described semiconductor device 1 having the conventional configuration, the solder balls 7 are formed after the resin package forming step of forming the resin package 6 is performed.
Must be performed on the substrate 2, and a solder ball 7 manufacturing process must be performed separately from the semiconductor device 1 manufacturing process. There is a problem that the semiconductor device 1 becomes complicated and the product cost of the semiconductor device 1 increases accordingly.

Further, in order to reliably electrically connect the semiconductor device 1 to the mounting board 8, it is necessary that the diameters of a large number of solder balls 7 provided on the semiconductor device 1 match exactly. This is because if the diameter of the solder ball 7 varies, a gap is generated between the solder ball 7 having a small diameter and the electrode portion 9, and the solder ball 7 and the electrode portion 9 are not formed.
This is because there is a possibility that the electrical connection with the device may not be reliably performed. However, it is difficult to manufacture a large number of solder balls 7 so that their diameters are exactly the same, so that there is a problem that the mounting yield when mounting the semiconductor device 1 on the mounting substrate 8 is reduced. Was.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and provides a semiconductor device, a method of manufacturing the same, and a lead frame capable of performing a reliable mounting process with a simple manufacturing process and reducing the product cost. The purpose is to:

[0012]

The above object can be attained by taking the following means.

According to a first aspect of the present invention, there is provided a semiconductor chip comprising:
A lead portion connected to the semiconductor chip is provided inside the resin package, and a part of the lead portion is exposed to the outside of the resin package so that its exposed surface is flush with the outer surface of the resin package. In the semiconductor device formed, a protrusion protruding outward from the outer surface of the resin package is formed integrally with the lead portion at the connection portion, and the thickness of the lead portion excluding the protrusion (H) is reduced. The thickness dimension (h) of the protruding portion is formed to be thinner, and the lead portion forms a part of the lead frame, and
The protruding portion is characterized in that it is formed thinner than the portion of the lead portion of the peripheral projecting portion.

Further, according to the present invention, the projecting portion is provided.
To the outside by plastically deforming the connection
It is characterized by having a protruding configuration .

A semiconductor device according to a third aspect of the present invention.
Is a resin tape with a lead pattern formed on the surface
And a semiconductor chip electrically connected to the lead pattern.
A hole is provided in a predetermined position of the resin tape and the resin tape.
A part of the lead pattern in the width direction is
The protrusion protruding from the resin tape and the semiconductor chip
Resin that seals the lead pattern surface including the
And a package.

A semiconductor device according to a fourth aspect of the present invention.
The method of manufacturing the device is connected to the semiconductor chip and
A lead forming a lead portion having a connection portion to be connected to a terminal.
Formed by the lead part forming step and the lead part forming step.
Electrical connection between the mounted lead and the mounted semiconductor chip.
The semiconductor chip mounting process to be connected and the semiconductor chip
Attach the mounted lead to the mold
Fill the inside with resin and put the semiconductor chip and lead part inside the resin
Table of the connection part buried in the part and formed in a part of the lead part
The resin is exposed so that the surface is flush with the outer surface of the resin.
Resin molding process to form a package
At the same time as the soldering process is performed.
Connection is plasticized by the internal pressure (F) generated by the
Protruding outward to form a protrusion
And a protrusion forming step.

Further, according to the present invention, the lead is provided.
In the part forming step, the connecting part formed on the lead part is c
Is performed, and the protruding part
The part where the protruding part is formed
It is characterized by being thin.

Further, the invention according to claim 6 is characterized in that the resin module
In the mold process, it is used when molding a resin package.
Of the projecting part of the mold
It is characterized by forming a recess corresponding to the shape
is there.

Further, the invention according to claim 7 provides the above resin module.
In the mold process, it is used when molding a resin package.
The connection part to the outside where the protrusion of the mold is formed.
Connected to a suction device for
The protrusion is projected outward with the suction force
It is characterized by the following.

[0020] According to another aspect of the present invention, there is provided a chip mounting portion on which a semiconductor chip is mounted, an inner lead portion connected to the semiconductor chip, and an outer portion of the resin package when embedded in the resin package. An outer lead portion having a connection portion exposed to the outside, wherein a protrusion is formed in the connection portion, and the thickness of the protrusion is smaller than the thickness dimension of the outer lead portion excluding the protrusion. dimensions were thin, and the protrusion and is characterized that it has thinner than portions of <br/> the lead portion of the peripheral projecting portion.

According to a ninth aspect of the present invention, there is provided the above-mentioned projection.
To the outside by plastically deforming the connection
It is characterized by having a protruding configuration.

[0022]

[0023]

[0024]

[0025]

The respective means described above operate as follows.

According to the first aspect of the present invention, the connecting portion formed on the lead portion is formed with a protruding portion protruding outward from the outer surface of the resin package. Function can be provided. Further, since the protruding portion is formed integrally with the lead portion, it is possible to eliminate the need for a solder ball which was required in a semiconductor device having a conventional configuration, thereby reducing the number of components and simplifying the manufacturing process. Can be planned.

Further, by the thickness dimension of the protrusions thinly formed than the thickness dimension of the lead portion excluding the projection portion,
The projection can be easily formed. In addition, it is possible to make the protruding portion protrude by the internal pressure generated in the mold when manufacturing the resin package, and it is possible to simplify the manufacturing process.

According to the second and ninth aspects of the present invention, the connecting portion is plastically deformed so that the protruding portion protrudes outward. Since processing can be performed with higher accuracy than when manufacturing with high accuracy so that the diameter dimension is uniform, it is possible to easily uniform the amount of protrusion of a large number of formed protrusions.

[0029]

According to the fourth aspect of the present invention, the projecting portion forming step of forming the projecting portion by plastically deforming the connecting portion by the internal pressure generated when the resin is filled in the mold and projecting outwardly. At the same time as the resin molding process .
Because, generally without additional changes or new process a manufacturing process being performed in the method of manufacturing a semiconductor device, it is possible to manufacture a semiconductor device according to claim 1. Therefore, the semiconductor device according to claim 1 can be manufactured at low cost.

According to the fifth aspect of the present invention, the portion where the protruding portion is formed is made thinner than other portions, so that the connecting portion protrudes to form a plastic portion which is formed when the protruding portion is formed. Processing can be performed with a small processing force,
The connection can be reliably plastically deformed by the internal pressure generated when the resin is filled in the mold. Further, since half-etching is used as a means for reducing the thickness of the portion where the protruding portion is formed with respect to other portions, the thin portion can be easily formed, and the lead portion is formed in the lead portion forming step. By using etching as a method for forming the thin portion, the formation of the thin portion and the formation of the lead portion can be performed collectively in the lead portion forming step.

According to the sixth aspect of the present invention, a concave portion corresponding to the shape of the projecting portion is formed at a position facing the projecting portion forming position of the mold used for molding the resin package. Only by making a small change to the structure, the projecting portion forming step can be performed simultaneously with the resin molding step. In addition, since the shape of the protrusion formed is determined by the shape of the recess, by forming a plurality of recesses formed in the mold with high precision, the shape of the protrusion formed by this mold is reduced. It can be made uniform.

According to the eighth aspect of the present invention, a suction device for sucking the connecting portion outward is provided at a portion of the mold where the protrusion is formed, and the suction force generated by the suction device is used as an auxiliary force. By making the protruding part project outward,
Since the protrusion is formed by the suction force generated by the suction device in addition to the internal pressure force generated when the resin is filled in the mold, the protrusion can be formed reliably and efficiently.

According to the invention of claim 8 , when the semiconductor chip is mounted, the chip mounting portion, the inner lead portion connected to the semiconductor chip, and the resin package when embedded in the resin package. In a lead frame including an outer lead portion having a connection portion exposed to the outside of the lead frame, by forming a protrusion on the connection portion, when the lead frame is mounted in a resin package, the protrusion is Since it protrudes outside the resin package, it can function as an external connection terminal.

[0035]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing a semiconductor device 10 according to one embodiment of the present invention, and FIG. 2 is a perspective view showing a bottom surface of the semiconductor device 10 according to one embodiment of the present invention. The semiconductor device 10 generally includes a semiconductor chip 11 and a lead portion 12.
And a resin package 13 and the like.

The semiconductor chip 11 is joined to the upper part of the die pad 14 using a die attach agent 15. A plurality of chip-side electrodes 16 are formed on the upper surface of the semiconductor chip 11. In addition, a plurality of lead portions 12 are arranged at positions facing the side of the semiconductor chip 11 so as to surround the semiconductor chip 11.

The lead portion 12 is made of, for example, Kovar 42a.
It is formed of a lead frame material such as lloy or a copper (Cu) alloy, and includes an inner lead portion 17 and an outer lead portion 18. The inner lead portion 17 and the outer lead portion 18 integrally and continuously form one lead. A wire 19 is bridged between the inner lead portion 17 and the chip side electrode 16 formed on the upper surface of the semiconductor chip 11 by performing a wire bonding process, and the chip side electrode 16 and the inner lead portion 17 are electrically connected. It is configured to be connected to.

The above-described semiconductor chip 11 and lead portion 12
Are sealed in a resin package 13 with a resin. Since the semiconductor chip 11 and the lead portion 12 are sealed in the resin package 13 as described above, oxidation of the semiconductor chip 11 and the lead portion 12 due to contact with air can be prevented, and water, dust, etc. 11 and the lead portion 12 can be prevented from adhering.

As shown in FIGS. 1 and 2, the outer lead portion 18 constituting the lead portion 12 has a configuration in which a part thereof is exposed to the outside of the resin package 13. A portion of the lead portion 18 exposed outside the resin package 13 is called a connection portion 20.

Here, paying attention to the connection section 20, FIG.
This will be described below with reference to FIGS. 3 and 4 in addition to FIG. still,
FIG. 3 is an enlarged view showing one of the plurality of connection portions 20 formed on the semiconductor device 10, and FIG.
It is sectional drawing which follows the A line.

The connecting portion 20 has a front surface 20 a exposed at the bottom surface 13 a of the resin package 13.
0 and the bottom surface 13a of the resin package 13 are substantially flush with each other. At a substantially central position of the connecting portion 20, a projecting portion 21 projecting in a hemispherical shape is formed. The projecting portion 21 is connected to the connecting portion 2 from the surface 20a of the connecting portion 20 (that is, the bottom surface 13a of the resin package 13).
It is formed so as to protrude outward by performing plastic working on 0. Therefore, the projecting portion 21 is formed integrally with the connecting portion 20, that is, integrally with the lead portion 12.

Further, as shown in FIG.
(Shown by an arrow h in the figure) is thinner than the thickness dimension (shown by an arrow H in the figure) of the lead portion 12 excluding the position where the protrusion 21 is formed. (H <
H). Specifically, for example, the thickness H of the lead portion 12 is set to H
When the height is set to 70 μm, the thickness h of the protrusion 21 is configured to be about h = 20 μm.

As described above, by setting the thickness h of the protrusion 21 to be smaller than the thickness H of the lead portion 12 other than the position where the protrusion 21 is formed, the protrusion 2
1 can be configured to be easily plastic-worked. It is conceivable that the mechanical strength of the projecting portion 21 may be reduced by reducing the thickness of the projecting portion 21, but as shown in FIG. The resin package 13 functions as a reinforcing material for the protruding portion 21 because the protruding portion 21 is formed so as to fill the inside of the protruding portion 21, so that the mechanical strength of the protruding portion 21 is maintained.

Next, a method of mounting the semiconductor device 10 on which the protruding portions 21 are formed on the mounting substrate 22 will be described with reference to FIG.

As described above, the surface 20a of the connecting portion 20 and the bottom surface 13a of the resin package 13 are configured to be substantially flush, and the protruding portion 21 is formed to be flush with the surface 20a.
In addition, since the semiconductor device 10 is configured to protrude outward from the bottom surface 13a, only the protrusion 21 protrudes downward (downward in FIG. 1) on the bottom surface of the semiconductor device 10. Further, since the protruding portion 21 is formed integrally with the lead portion 12, it is electrically connected to the semiconductor chip 11. Therefore, the protrusion 21 can function as a terminal for external connection, similarly to the conventional solder ball 7 (see FIG. 15).

More specifically, the board-side electrode 23 is formed at a predetermined position on the mounting board 22 so as to correspond to the position where the projecting portion 21 is formed, and a preset solder (not shown) is arranged on the board-side electrode 23. Set it up. Then, the semiconductor device 10
After the protrusion 21 is aligned with the substrate-side electrode 23, the substrate 21 is face-down to the mounting substrate 22, and then the substrate-side electrode 23 and the protrusion 21 are soldered by passing through a reflow furnace.

As described above, in the semiconductor device 10 according to the present embodiment, since the protrusion 21 has the same function as the solder bump, the semiconductor device 10 can be surface-mounted on the mounting substrate 22 and the semiconductor chip Even if 11 has a configuration having many chip-side electrodes 16, the connection with the mounting substrate 22 can be reliably performed.

Further, since the projecting portion 21 is formed integrally with the lead portion 12, the solder ball 7, which is required in the semiconductor device 1 having the conventional configuration, can be eliminated. As a result, the number of components can be reduced and the manufacturing process can be simplified as compared with the semiconductor device 1 having the conventional configuration, and the product cost can be reduced. Further, since the operation of mounting the semiconductor device 10 on the mounting substrate 22 can be performed by directly using the face-down bonding technology that has been generally performed conventionally, the mounting operation can be easily performed.

Next, a method of manufacturing the semiconductor device 10 having the above configuration will be described.

FIGS. 5 to 8 are views for explaining a method of manufacturing the semiconductor device 10 according to one embodiment of the method of the present invention. In order to manufacture the semiconductor device 10, first, a lead forming step for forming the lead frame 25 is performed. FIG.
Indicates a lead frame 25 formed by performing a lead portion forming step.

FIG. 5A is a plan view of a lead frame 25.
By performing an etching process on a flat substrate made of a lead frame material such as 2alloy or a Cu alloy, the lead portion 12 and the die pad 14 are formed into a predetermined shape shown in FIG. In this state, the lead portion 12 and the die pad 14 are integrated with the frame 26 and are held by the frame 26. The frame 26 has a positioning hole 27 for positioning. The broken line shown in FIG. 5A indicates the outer shape of the resin package 13 when the resin package 13 is provided. Therefore, the position inside the broken line is the portion sealed by the resin package 13.

Further, half-etched portions 28 are formed at predetermined positions of the plurality of lead portions 12 formed on the lead frame 25, respectively. This half-etched part 28
Are formed at positions where the protrusions 21 are formed. FIG.
5B is an enlarged perspective view showing the vicinity of the arrangement position of the half-etched portion 28, and FIG. 5C is a cross-sectional view taken along line BB in FIG. 5B. The formation of the half-etched portion 28 can be performed simultaneously when the lead frame 25 is etched into a predetermined shape. Generally, when the lead frame 25 is etched into a predetermined shape, an etching process is performed from both sides thereof. Specifically, first, a mask having a predetermined pattern is provided on both side surfaces of the flat base material so that the lead portion 12 (including the half-etched portion 28), the die pad 14, the frame body 26 and the like are not etched. For a predetermined time.

At this time, the mask is not provided on both sides at the formation position of the half-etched portion 28, but is provided only on one side. Thus, at the stage when the lead frame 25 having the shape shown in FIG. 5A is formed, a half-etched portion 28 having a smaller thickness than other portions is formed in the lead portion 12. This half etching part 2
The thickness h of the lead 8 is, for example, about h = 20 μm when the thickness H of the lead portion 12 is H = 70 μm (see FIGS. 5C and 4). The half-etched portion 28 is formed simply by disposing a mask on one side surface of the flat base material, and the other portions can be easily formed without any difference from a normal etching process.

By forming the half-etched portion 28 which is thinner than the other portions in this way, when plastic working is to be performed on the half-etched portion 28, plastic deformation occurs with a small working force. It is possible to do. Further, since the half-etched portion 28 is formed by the half-etching process, the half-etched portion 28 can be formed simultaneously in the lead portion forming step.

Assuming that a cutting process or the like is used to form the thin portion of the half-etched portion 28, the formation (etching process) of the lead frame 25 and the cutting process of the thin portion to be the half-etched portion 28 are performed as follows. It cannot be performed in the same step, and a new cutting step is required only for forming the half-etched portion 28. However, by forming the half-etched portion 28 by the half-etching process as described above, the half-etched portion 28 can be formed at the same time in the lead portion forming step, and the manufacturing process can be simplified.

In the above-described lead portion forming step, an example has been shown in which the lead frame 25 and the half-etched portion 28 are simultaneously formed by an etching process. It is also possible to simultaneously form the frame 25 and the thin portion (half-etched portion 28).

That is, in forming the lead portion 12 and the die pad 14, the plate-shaped base material is cut using a cutter to form the lead portion 12 and the die pad 14 having a predetermined shape, and the thin portion is formed by using a jig such as a punch. A thin portion (half-etched portion 28) is formed by performing a pressing process. Since the jigs such as the cutter and the punch can be simultaneously driven by the press device, the formation of the lead frame 25 and the formation of the thin portion (half-etched portion 28) can be performed simultaneously by using the press working. .

When the lead frame 25 is manufactured as described above, a semiconductor chip mounting step is subsequently performed. In the semiconductor chip mounting step, first, the semiconductor chip 11 is mounted and fixed on the die pad 14 formed on the lead frame 25 using the die attaching agent 15. Then, the semiconductor chip 1
The wire 19 is provided by performing a wire bonding process between the chip-side electrode 16 and the lead portion 12 provided on the upper part of the device 1. As described above, the chip-side electrode 16
When the wire 19 is disposed between the lead frame 12 and the lead portion 12, the lead frame 25 is subjected to a pressing process to form the lead portion 12 into a predetermined shape.

When the above-described semiconductor chip mounting step is completed, the lead frame 25 on which the semiconductor chip 11 is mounted
Is mounted on a mold 29 and a resin molding process is performed.

FIG. 6 shows a state where the lead frame 25 on which the semiconductor chip 11 is mounted is mounted on a mold 29. The mold 29 includes an upper mold 30 and a lower mold 31, and the lead frame 25 is held in the mold 29 in a configuration sandwiched between the upper mold 30 and the lower mold 31.

Further, a plurality of concave portions 32 are formed in the lower die 31. The formation position of the concave portion 32 is formed so as to correspond to the formation position of the half-etched portion 28 formed on the lead portion 12 in the above-described lead portion formation step, and the lead frame 25 is mounted on the mold 29. In FIG. 6, as shown in FIG.
Is configured to face the recess 32. Further, the shape of the concave portion 32 is a concave shape corresponding to the hemispherical shape of the protruding portion 21 described above. The upper mold 30 has a resin package.
Introduce the mold resin that becomes the die 13 into the cavity 33
Because the runner 34 are disposed.

When the lead frame 25 is mounted in the mold 29, the mold resin 13-1 (shown in satin) is introduced into the cavity 33 from the runner 34 as shown in FIG. By introducing the mold resin 13-1 into the cavity 33, the internal pressure in the cavity 33 increases,
This internal pressure is applied to the entire inner surface of the cavity 33.

Here, paying attention to the half-etched portion 28, as described above, the half-etched portion 28 has a thickness smaller than that of the other portions of the lead portion 12, so that the half-etched portion 28 is configured to be easily plastically deformed. In addition, a concave portion 32 is formed in the lower mold 31 facing the half-etched portion 28. Accordingly, the internal pressure generated in the cavity 33 due to the introduction of the mold resin 13-1 and the moving force of the mold resin 13-1 (hereinafter, referred to as the internal pressure F including the internal pressure and the moving force) move the half-etched portion 28 outside. The half-etched portion 28 is plastically deformed outward by the internal pressure F, whereby the protruding portion 21 is formed.

FIG. 7 shows a state in which the cavity 33 is completely filled with the mold resin 13-1 and the resin package 13 is formed. Thus, the resin package 1
In the state where 3 is formed, all of the half-etched portions 28 respectively formed on the plurality of lead portions 12 are plastically deformed outward to form the protruding portions 21. As described above, the formation of the protruding portion 21 is performed only by making a small change to the structure of the lower mold 31 of the mold 29, specifically, only by forming the concave portion 32 in the lower mold 29, and at the same time when the resin molding process is performed. Can be formed.

Further, since the shape of the projection 21 to be formed is determined by the shape of the recess 32, the shape of the plurality of recesses 32 formed in the lower mold 31 is formed with high precision, so that the mold 29 is formed. The protrusion amount and shape of the protrusion 21 formed by the above can be easily made uniform. In this way, the protrusion amount of the protrusion 21 is made uniform and the dispersion is eliminated, so that when the semiconductor device 10 described with reference to FIG. 1 is mounted on the mounting substrate 22, the floating between the protrusion 21 and the substrate-side electrode 23. Does not occur, and the joining (solder joining) between the protruding portion 21 and the board-side electrode 23 can be reliably performed, and the mountability of the semiconductor device 10 on the mounting board 22 can be improved.

It is conceivable that the mechanical strength of the projecting portion 21 may be reduced by reducing the thickness of the projecting portion 21 as described above. However, as shown in FIG. Since the structure is filled up to the inside of the protrusion 21 and functions as a reinforcing material for the protrusion 21, the protrusion 2
The mechanical strength of No. 1 is maintained.

When the resin package 13 is formed as described above, the lead frame 25 on which the resin package 13 is formed is released from the mold 29, and unnecessary portions such as the frame 26 are removed. 1 is formed. The manufacturing method of the semiconductor device 10 described above is not much different from the generally used semiconductor manufacturing method, and the semiconductor device 10 is manufactured by using the existing equipment and performing substantially the same process as the conventional semiconductor manufacturing process. Therefore, the semiconductor device 10 can be manufactured without increasing the product cost of the semiconductor device 10.

FIG. 9 shows a modification of the mold used in the resin molding process. The mold 35 shown in FIG.
Suction pipes 36 and 37 connected to a suction device 38 (for example, a vacuum pump or the like) are provided at the position where the concave portion 32 is formed, and the half-etched portion 28 is directed outward (to a lower mold) by the suction force generated by the suction device 38. (Aim).

By using the mold 35 having the above-described structure, as the force for plastically deforming the half-etched portion 28, the suction force f generated by the suction device 38 is added to the internal pressure F generated in the cavity 33. Since the half-etched portion 28 is pressed by the concave portion 32 with a strong force to act as an auxiliary force for plastic deformation, the shape of the formed protrusion 21 can be accurately formed according to the shape of the concave portion 32. It becomes possible. As a result, the formed protrusion 2
The protrusion height and the uniformity of the shape can be further improved, and the mountability on the mounting substrate 22 can be improved. Further, since the force required for the plastic deformation is increased, the time required for plastically deforming the protrusion 21 is reduced, and the protrusion 21 can be formed with high processing efficiency.

FIGS. 10 to 12 are views showing a modification of the method of forming the protrusion 21 in the resin molding step. In the above-described embodiment, the half-etched portion 2
The internal pressure F generated in the cavity 33 by introducing the mold resin 13-1 into the mold 25 was used to form the protruding portion 21 by plastically deforming 8. The present modification is characterized in that the half-etched portion 28 is directly plastically deformed by using a jig to form the projecting portion 21. Hereinafter, a specific method of forming the protrusion 21 will be described.

FIG. 10 shows a state where the lead frame 25 on which the semiconductor chip 11 is mounted is mounted on the mold 39. The mold 39 according to the present embodiment has a configuration in which a press rod 41 is disposed on an upper mold 40. The press rod 41 is configured to be movable in the vertical direction in the figure by a lifting device (not shown).

The lower end of the press rod 41 is formed in a hemispherical shape, and the shape is configured to correspond to the hemispherical shape of the concave portion 32 (that is, the shape of the projection 21 to be formed). This press rod 41 is
The upper die 40 is disposed so as to face the recess 32 formed in the upper die 40. When the lead frame 25 is mounted on the mold 39, each press rod 41 is configured to be at a position moved up as shown in FIG. 10 (hereinafter, this position is referred to as an initial position).

When the lead frame 25 is mounted on the mold 39, the press rod 41 is moved downward by the elevating device to come into contact with the half-etched portion 28, as shown in FIG. The half-etched portion 28 is pressed down to the concave portion 32 by moving downward. The half-etched portion 28 is plastically deformed by the pressing force of the press rod 41 pressing the half-etched portion 28 against the concave portion 32 to form the protrusion 21.

When the protrusion 21 is formed as described above,
The press rod 41 is moved upward by the lifting device and returns to the initial position again. In this state, the mold resin 13-1 is introduced into the cavity 33 via the runner 34, and the resin package 1
3 is manufactured (see FIG. 12). This mold resin 13
When -1 is introduced, since the press rod 41 has returned to the initial position, the press rod 41 does not hinder the production of the resin package 13.

Some resin molding apparatuses are provided with a release rod for releasing a molded resin product from a mold. This release rod is used in this modification. It has a configuration similar to the illustrated press rod 41, and is configured to move downward when releasing the mold, thereby pressing the resin product formed in the mold and releasing the resin product from the mold.
Therefore, the press rod 41 can be driven by using an elevating device for elevating and lowering the existing release rod.

As described above, in the present modification, the half-etched portion 28 is plastically deformed by the press rod 41 pressing the half-etched portion 28 toward the concave portion 32 to form the projecting portion 21. I have. Therefore, the working force applied to the half-etched portion 28 is more stable than in the above-described embodiment in which the half-etched portion 28 is plastically deformed using the internal pressure F. Can be accurately formed in accordance with the shape of the concave portion 32. Therefore, the uniformity of the protrusion height and the shape of the formed protrusion 21 can be further improved, and the mountability on the mounting board 22 can be improved.

Since the plastic working of the projecting portion 21 is formed by one raising and lowering operation of the press rod 41, the projecting portion 2
The time required to plastically deform 1 is short, and the protruding portion 21 can be formed with high processing efficiency.

The press rod 41 has the function of forming the protrusion 21 by plastically deforming the half-etched portion 28 as described above.
This can also be used as a release rod for releasing from the mold 39, and the press rod 41 can be made multifunctional. In each of the above-described embodiments, an example in which the lead frame 25 is processed and formed as the lead portion 12 is shown. However, the semiconductor device according to the present invention may use a TAB (Tape Automated Bonding) tape as the lead portion 12. It is. FIGS. 13 and 14 show an example in which a TAB tape 42 is used as the lead portion 12.

The TAB tape 42 has a structure in which a lead pattern 44 made of, for example, copper foil or the like is printed in a predetermined shape on the upper surface of a resin tape 43 made of polyimide or the like. The semiconductor chip 11 is mounted on the TAB tape 42 and is electrically connected to the lead pattern 44 using the wire 19 or a solder bump (FIGS. 13 and 14 show an example using the wire 19). ). still,
The thickness of the lead pattern 44 is generally about 30 to 40 μm.

FIG. 13 is a diagram showing a T having the semiconductor chip 11 mounted thereon.
The state where the AB tape 42 is mounted on the mold 29 is shown. The position where the projecting portion 21 of the resin tape 43 constituting the TAB tape 42 is formed has a configuration in which the resin tape 43 is removed over a predetermined range to form a hole 45. Therefore, the TAB tape 42 is The lead pattern 44 is in a state directly facing the concave portion 32 in a state where the lead pattern 44 is mounted. Further, as described above, the thickness of the lead pattern 44 is about 30 to 40 μm, and the thickness is such that it can be plastically deformed as it is. Not formed.

When the TAB tape 42 is mounted in the mold 29, the mold resin 13-1 (shown in satin) is introduced from the runner 34 into the cavity 33 as shown in FIG. Is done. At this time, the internal pressure F generated by introducing the mold resin 13-1 into the cavity 33 is applied to the entire upper surface of the TAB tape 42.

Here, paying attention to the formation position of the hole 45 of the TAB tape 42 (that is, the formation position of the protruding portion 21), as described above, the thickness of the lead pattern 44 is about 30 to
It is the 40μm and plastically deformable thickness, and holes 4
5 is formed so that the lead pattern 44 is exposed. Further, a recess 32 is formed in the lower mold 31 facing the exposed portion of the lead pattern 44. Accordingly, the lead pattern 44 is plastically deformed outward (toward the concave portion 32) by the internal pressure F generated by the introduction of the mold resin 13-1, whereby the projecting portion 21 is formed.

In the semiconductor device formed by the above-described manufacturing method, only the protrusion 21 projects from the bottom surface of the semiconductor device. However, in the step of forming the TAB tape 42, the portion where the protruding portion 21 is formed is projected outward by pressing or the like over an area larger than the area where the protruding portion 21 is formed in advance, and the bottom surface and the surface of the resin package 13 are formed. Formed to be one, this TAB
FIG. 1 shows a configuration in which the projecting portion 21 is formed on the connecting portion 20 flush with the bottom surface of the resin package 13 by mounting the tape 42 on the mold 29 and performing the above resin molding process. It is also possible to manufacture a semiconductor device having an equivalent shape to the semiconductor device 10.

As described above, even in the semiconductor device using the TAB tape 42, the same effect as the semiconductor device 10 using the lead frame 25 shown in FIG. 1 can be realized, and the number of components can be reduced. The manufacturing process can be simplified.

In each of the above-described embodiments, the protruding portion 21 has a hemispherical shape. However, the shape of the protruding portion 21 is not limited to this. The shape may be an elliptical shape, a rectangular shape, or the like as viewed from the viewpoint, and the overall shape may be a cone, a truncated cone, a pyramid, or the like. The shape of the protrusion 21 can be arbitrarily determined according to the mounting density, the arrangement pitch of the board-side electrodes 23 arranged on the mounting board 22, and the like.

Further, in the example described with reference to FIGS. 3 to 5 described above, the configuration in which the half-etched portion 28 is provided is shown as a configuration for facilitating the formation of the protrusion 21. However, the configuration is not particularly limited to the half-etched portion 28 as long as the width of the lead portion 12 can be reduced to facilitate plastic working. May be used to form a thin portion.

[0088]

As described above, according to the present invention, the following various effects can be realized.

According to the first aspect of the present invention, the connecting portion formed on the lead portion is formed with a protruding portion protruding outward from the outer surface of the resin package, so that this protruding portion is equivalent to a conventional solder ball. Function can be provided. Further, since the protruding portion is formed integrally with the lead portion, it is possible to eliminate the need for a solder ball which was required in a semiconductor device having a conventional configuration, thereby reducing the number of components and simplifying the manufacturing process. Can be planned.

Further, since the thickness of the protruding portion is made smaller than the thickness of the lead portion excluding the protruding portion,
The projection can be easily formed. In addition, it is possible to make the protruding portion protrude by the internal pressure generated in the mold when manufacturing the resin package, and it is possible to simplify the manufacturing process.

According to the second and ninth aspects of the present invention, the connecting portion is plastically deformed so that the protruding portion protrudes outward. Since processing cannot be performed with high accuracy compared to manufacturing with high accuracy so that the diameter dimension is uniform,
It is possible to easily equalize the amount of protrusion of a large number of protrusions.

[0092]

According to the fourth aspect of the present invention, the projecting portion forming step of forming the projecting portion by plastically deforming the connecting portion by the internal pressure generated when the resin is filled in the mold and projecting the connecting portion outward. Is performed at the same time when the resin molding process is performed, so that the semiconductor device according to claim 1 can be manufactured without changing a manufacturing process generally performed in a method of manufacturing a semiconductor device or adding a new process. it can. Therefore, the semiconductor device according to claim 1 can be manufactured at low cost.

According to the fifth aspect of the present invention, the portion where the protrusion is formed is made thinner than the other portions, so that the plastic portion is formed when the connection portion is protruded to form the protrusion. Processing can be performed with a small processing force,
The connection can be reliably plastically deformed by the internal pressure generated when the resin is filled in the mold. Further, since half-etching is used as a means for reducing the thickness of the portion where the protruding portion is formed with respect to other portions, the thin portion can be easily formed, and the lead portion is formed in the lead portion forming step. By using etching as a method for forming the thin portion, the formation of the thin portion and the formation of the lead portion can be performed collectively in the lead portion forming step.

According to the sixth aspect of the present invention, a concave portion corresponding to the shape of the projecting portion is formed in a portion opposed to the projecting portion forming position of the mold used for molding the resin package. Only by making a small change to the structure, the projecting portion forming step can be performed simultaneously with the resin molding step. In addition, since the shape of the protrusion formed is determined by the shape of the recess, by forming a plurality of recesses formed in the mold with high precision, the shape of the protrusion formed by this mold is reduced. It can be made uniform.

According to the seventh aspect of the present invention, a suction device is provided at a portion where the protrusion of the mold is formed to suction the connection portion outward, and the suction force generated by the suction device is used as an auxiliary force. By making the protruding part project outward,
Since the protrusion is formed by the suction force generated by the suction device in addition to the internal pressure force generated when the resin is filled in the mold, the protrusion can be formed reliably and efficiently.

According to the invention of claim 8, when the semiconductor chip is mounted, the chip mounting portion, the inner lead portion connected to the semiconductor chip, and the resin package when embedded in the resin package. In a lead frame including an outer lead portion having a connection portion exposed to the outside of the lead frame, by forming a protrusion on the connection portion, when the lead frame is mounted in a resin package, the protrusion is Since it protrudes outside the resin package, it can function as an external connection terminal.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a semiconductor device according to one embodiment of the present invention.

FIG. 2 is a perspective view showing a bottom surface of the semiconductor device according to one embodiment of the present invention;

FIG. 3 is an enlarged view illustrating one of a plurality of connection portions formed in the semiconductor device.

FIG. 4 is a sectional view taken along line AA in FIG. 3;

FIG. 5 is a plan view of a lead frame according to an embodiment of the present invention.

FIG. 6 is a view showing a state where a lead frame on which a semiconductor chip is mounted is mounted on a mold;

FIG. 7 is a diagram showing a state in which a cavity is filled with a mold resin.

FIG. 8 is a diagram showing a state in which a cavity is completely filled with a mold resin to form a resin package.

FIG. 9 is a view showing a modified example of a mold used in a resin molding step.

FIG. 10 is a view showing a modification of the method of forming a protruding portion in a resin molding step, and is a view showing a state where a lead frame on which a semiconductor chip is mounted is mounted on a mold.

FIG. 11 is a view showing a modified example of the method of forming the protruding portion in the resin molding step, and is a view showing a state in which the press rod is moved downward to plastically process the half-etched portion.

FIG. 12 is a view showing a modification of the method of forming the protruding portion in the resin molding step, and is a view showing a state where the resin package is formed.

FIG. 13 is a diagram showing a state in which a TAB tape on which a semiconductor chip is mounted is mounted on a mold.

FIG. 14 is a diagram showing a state in which a resin package is formed in a configuration using a TAB tape.

FIG. 15 is a cross-sectional view of a conventional semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Semiconductor device 11 Semiconductor chip 12 Lead part 13 Resin package 13a Bottom surface 13-1 Mold resin 16 Chip side electrode 17 Inner lead part 18 Outer lead part 19 Wire 20 Connection part 20a Surface 21 Projection part 22 Mounting board 23 Board side electrode 25 Lead Frame 26 Frame 27 Positioning hole 28 Half-etched part 29,35,39 Die 30,40 Upper die 31 Lower die 32 Concavity 33 Cavity 36,37 Suction pipe 38 Suction device 41 Press rod 42 TAB tape 43 Resin tape 44 Lead Pattern 45 holes

Claims (9)

(57) [Claims] A semiconductor chip and a lead portion connected to the semiconductor chip are provided in a resin package;
In a semiconductor device, a part of the lead portion is exposed to the outside of the resin package so that an exposed surface thereof is flush with an outer surface of the resin package and a connection portion is formed. A protrusion protruding outward from the outer surface is formed integrally with the lead, and the thickness (h) of the protrusion is formed thinner than the thickness (H) of the lead excluding the protrusion. and, the lead portion is configured to form a part of the lead frame, and the protrusion, characterized in that it is part by <br/> remote thin formation of the lead portion of the peripheral projecting portion Semiconductor device. 2. The semiconductor device according to claim 1, wherein said projecting portion projects outward by plastically deforming said connecting portion. 3. A resin tape having a lead pattern formed on a surface thereof, a semiconductor chip electrically connected to the lead pattern, and a hole provided at a predetermined position of the resin tape, wherein a width direction of the lead pattern is provided. A semiconductor device comprising: a protruding portion, a portion of which protrudes from the resin tape through the hole; and a resin package for sealing the surface of the lead pattern including the semiconductor chip and the protruding portion. 4. A lead part forming step of forming a lead part having a connection part connected to a semiconductor chip and connecting to an external terminal, a lead part formed in the lead part forming step, A semiconductor chip mounting step of electrically connecting the semiconductor chip to the semiconductor chip, and mounting a lead portion on which the semiconductor chip is mounted in a mold and filling the mold with resin to remove the semiconductor chip and the lead portion. A resin molding step of forming a resin package so as to be embedded in the resin and to expose a surface of a connection portion formed on a part of the lead portion so as to be flush with an outer surface of the resin; A projecting portion formed at the same time as the process is carried out, wherein the connecting portion is plastically deformed by an internal pressure (F) generated by filling the mold with the resin and is projected outward to form a projecting portion. And a method of manufacturing a semiconductor device. 5. In the lead portion forming step, half-etching is performed on a connecting portion formed on the lead portion, and a portion where the projecting portion is formed in a projecting portion forming step performed later is replaced with another portion. 5. The method for manufacturing a semiconductor device according to claim 4, wherein the thickness is reduced. 6. In the resin molding step, a concave portion corresponding to the shape of the projecting portion is formed in a portion of the mold used for molding the resin package, the portion facing the projecting portion forming position. 6. The method for manufacturing a semiconductor device according to claim 4, wherein 7. In the resin molding step, a suction device for sucking the connection portion outward is connected to a portion of the mold used for molding the resin package where the protrusion is formed, 7. The method of manufacturing a semiconductor device according to claim 4, wherein the protrusion is projected outward using a suction force generated by the suction device as an auxiliary force. 8. A chip mounting part on which a semiconductor chip is mounted, an inner lead part connected to the semiconductor chip,
An outer lead portion provided with a connection portion exposed to the outside of the resin package when embedded in the resin package, wherein a protrusion is formed at the connection portion; thin to form a thickness dimension of the projecting portion relative to the thickness dimension of the lead portion, and the protrusion protruding portion near the lead section site by <br/> remote thinly formed was that characteristic of And lead frame. 9. The lead frame according to claim 8, wherein said projecting portion projects outward by plastically deforming said connecting portion.