JPH0119458Y2 - - Google Patents

Info

Publication number

JPH0119458Y2

JPH0119458Y2 JP1982069695U JP6969582U JPH0119458Y2 JP H0119458 Y2 JPH0119458 Y2 JP H0119458Y2 JP 1982069695 U JP1982069695 U JP 1982069695U JP 6969582 U JP6969582 U JP 6969582U JP H0119458 Y2 JPH0119458 Y2 JP H0119458Y2

Authority

JP

Japan

Prior art keywords

bent

crystal diaphragm

holding structure

piezoelectric diaphragm

piezoelectric

Prior art date

1982-05-12

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 229910052751 metal Inorganic materials 0.000 claims description 28
• 239000002184 metal Substances 0.000 claims description 28
• 238000005452 bending Methods 0.000 claims description 13
• 239000012212 insulator Substances 0.000 claims 1
• 230000002093 peripheral effect Effects 0.000 claims 1
• 239000013078 crystal Substances 0.000 description 29
• 239000000853 adhesive Substances 0.000 description 14
• 230000001070 adhesive effect Effects 0.000 description 14
• 230000035939 shock Effects 0.000 description 5
• 229910000679 solder Inorganic materials 0.000 description 5
• 239000000463 material Substances 0.000 description 4
• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
• 239000000919 ceramic Substances 0.000 description 2
• 239000011521 glass Substances 0.000 description 2
• 239000011810 insulating material Substances 0.000 description 2
• 230000010355 oscillation Effects 0.000 description 2
• 239000010453 quartz Substances 0.000 description 2
• VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
• 229910000990 Ni alloy Inorganic materials 0.000 description 1
• 238000005219 brazing Methods 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 238000005520 cutting process Methods 0.000 description 1
• 230000006378 damage Effects 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000005530 etching Methods 0.000 description 1
• 230000005284 excitation Effects 0.000 description 1
• 238000000605 extraction Methods 0.000 description 1
• 229910052742 iron Inorganic materials 0.000 description 1
• 229910000833 kovar Inorganic materials 0.000 description 1
• 229910052744 lithium Inorganic materials 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
• 239000010956 nickel silver Substances 0.000 description 1
• 238000003825 pressing Methods 0.000 description 1
• 238000003466 welding Methods 0.000 description 1