JPH0119425Y2 - - Google Patents
Info
- Publication number
- JPH0119425Y2 JPH0119425Y2 JP3415983U JP3415983U JPH0119425Y2 JP H0119425 Y2 JPH0119425 Y2 JP H0119425Y2 JP 3415983 U JP3415983 U JP 3415983U JP 3415983 U JP3415983 U JP 3415983U JP H0119425 Y2 JPH0119425 Y2 JP H0119425Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit board
- terminal
- recess
- male
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3415983U JPS59140450U (ja) | 1983-03-11 | 1983-03-11 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3415983U JPS59140450U (ja) | 1983-03-11 | 1983-03-11 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59140450U JPS59140450U (ja) | 1984-09-19 |
| JPH0119425Y2 true JPH0119425Y2 (ar) | 1989-06-05 |
Family
ID=30164931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3415983U Granted JPS59140450U (ja) | 1983-03-11 | 1983-03-11 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59140450U (ar) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2745614B2 (ja) * | 1988-12-28 | 1998-04-28 | 松下電器産業株式会社 | コードリール装置 |
-
1983
- 1983-03-11 JP JP3415983U patent/JPS59140450U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59140450U (ja) | 1984-09-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6593840B2 (en) | Electronic packaging device with insertable leads and method of manufacturing | |
| US5438481A (en) | Molded-in lead frames | |
| JPH07297575A (ja) | パワーモジュール装置 | |
| EP0144343A1 (en) | Integrated circuit module and method of making same | |
| JPS63306651A (ja) | 電力用半導体装置とその製造方法 | |
| JPH0119425Y2 (ar) | ||
| JPH10242385A (ja) | 電力用混合集積回路装置 | |
| JPH0750618B2 (ja) | 樹脂封止プリント配線基板 | |
| JPH0749802Y2 (ja) | 半導体装置 | |
| JPS621748Y2 (ar) | ||
| JP2574605Y2 (ja) | 複合半導体装置 | |
| JPS635248Y2 (ar) | ||
| JPS6133613Y2 (ar) | ||
| JPH042478Y2 (ar) | ||
| JPS5934111Y2 (ja) | リ−ドレス電子部品の接続構造 | |
| JPH0132377Y2 (ar) | ||
| JPH07221419A (ja) | 混成集積回路装置 | |
| JPH0412665Y2 (ar) | ||
| JP2540426Y2 (ja) | 回路部品の実装構造 | |
| JPS642377Y2 (ar) | ||
| JP2858252B2 (ja) | 表面実装用電子部品の電極構造 | |
| KR100201397B1 (ko) | 반도체 패키지 장착용 패키지 | |
| JPS62179794A (ja) | 電気回路配線板 | |
| JPS6041744Y2 (ja) | リ−ドレス電子部品用回路基板 | |
| JPS62222Y2 (ar) |