JPH0119417Y2 - - Google Patents
Info
- Publication number
- JPH0119417Y2 JPH0119417Y2 JP2339783U JP2339783U JPH0119417Y2 JP H0119417 Y2 JPH0119417 Y2 JP H0119417Y2 JP 2339783 U JP2339783 U JP 2339783U JP 2339783 U JP2339783 U JP 2339783U JP H0119417 Y2 JPH0119417 Y2 JP H0119417Y2
- Authority
- JP
- Japan
- Prior art keywords
- probes
- support fitting
- circuit board
- board
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000523 sample Substances 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 230000002265 prevention Effects 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000000758 substrate Substances 0.000 description 16
- 239000011093 chipboard Substances 0.000 description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Arc Welding In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2339783U JPS60959U (ja) | 1983-02-19 | 1983-02-19 | 回路基板上における部品支持金具の溶断装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2339783U JPS60959U (ja) | 1983-02-19 | 1983-02-19 | 回路基板上における部品支持金具の溶断装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60959U JPS60959U (ja) | 1985-01-07 |
| JPH0119417Y2 true JPH0119417Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-06-05 |
Family
ID=30154482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2339783U Granted JPS60959U (ja) | 1983-02-19 | 1983-02-19 | 回路基板上における部品支持金具の溶断装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60959U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62139589U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1986-02-28 | 1987-09-03 |
-
1983
- 1983-02-19 JP JP2339783U patent/JPS60959U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60959U (ja) | 1985-01-07 |