JPH01189947A - Lead frame member composed of copper or copper alloy - Google Patents
Lead frame member composed of copper or copper alloyInfo
- Publication number
- JPH01189947A JPH01189947A JP1498388A JP1498388A JPH01189947A JP H01189947 A JPH01189947 A JP H01189947A JP 1498388 A JP1498388 A JP 1498388A JP 1498388 A JP1498388 A JP 1498388A JP H01189947 A JPH01189947 A JP H01189947A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- copper
- rolling
- wire
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 13
- 239000010949 copper Substances 0.000 title claims abstract description 13
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims abstract description 29
- 239000002244 precipitate Substances 0.000 claims description 19
- 238000005096 rolling process Methods 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052737 gold Inorganic materials 0.000 abstract description 5
- 239000010931 gold Substances 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 229910052726 zirconium Inorganic materials 0.000 abstract description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、集積回路素子の製造に使用されるリードフレ
ームの材料に係わり、特に、めっき層の介在なしにワイ
ヤを直接接合できるリードフレーム材に関する。DETAILED DESCRIPTION OF THE INVENTION "Industrial Application Field" The present invention relates to lead frame materials used in the manufacture of integrated circuit devices, and in particular to lead frame materials to which wires can be directly bonded without intervening plating layers. Regarding.
「従来の技術」
一般のリードフレームは、銅または銅合金からなる板材
を打抜成形し、さらに、ワイヤボンディングを行なう箇
所に金または銀めっきを施して製造されている。このよ
うに金（銀）めっきを施すのは、金属板から打ち抜き成
形したままの状態では、金または銅製のワイヤを十分な
強度で接合できないためである。"Prior Art" A general lead frame is manufactured by stamping a plate material made of copper or a copper alloy, and then plating the parts where wire bonding is to be performed with gold or silver. The reason why gold (silver) plating is applied in this manner is that gold or copper wires cannot be bonded with sufficient strength if they are punched and formed from a metal plate.
しかし、前記めっきの良否はワイヤボンディングに極め
て大きな影響を与えるため、リードフレーム材にめっき
を行なうに際しては極めて高い精度が要求され、生産性
が低いとともに、微小量ではあっても貴金属を用いるた
めコストが高いという欠点があった。However, since the quality of the plating has a very large effect on wire bonding, extremely high precision is required when plating lead frame materials, resulting in low productivity and high costs due to the use of precious metals, even if only in small amounts. It had the disadvantage of being high.
そこで、金（銀）めっきを施さずに、リードフレーム材
に直接ワイヤーボンディングができれば著しいコスト低
減が可能であるとの観点から、例えば特公昭６２−４６
０７１号公報においては、銅または調合金製のリードフ
レーム材の表面粗さを最大高さ（Ｒｗａｘ）で０．５μ
屓以下にするとともに、表面に現れる析出物や介在物等
の単一面積を３×１０−”１１ｘ”以下とすることによ
り、金ワイヤの直接接合が可能であるとの提案がなされ
ている。Therefore, from the viewpoint that it would be possible to significantly reduce costs if wire bonding could be performed directly to the lead frame material without gold (silver) plating, for example,
In Publication No. 071, the surface roughness of the lead frame material made of copper or prepared alloy is set to 0.5μ in maximum height (Rwax).
It has been proposed that direct bonding of gold wires is possible by reducing the thickness of the gold wire to less than 3×10−11× and by reducing the single area of precipitates, inclusions, etc. appearing on the surface to 3×10 − “11×” or less.
「発明が解決しようとする課題」
しかし、本発明者らが実際に実験を行なった結果、Ｒｍ
ａｘを０．５μ２以下、かつ表面に現れる析出物や介在
物等の単一面積を３ Ｘ ｌ Ｏ−”ｘｘ”以下として
も、ワイヤの接合が必ずしもうまくいかず、十分な接合
強度が得られない場合のあることが判明した。また、析
出物や介在物の単一面積を３×１０−６ｘｙｔ’以下に
まで微細化することは、前記公報では「圧延の加工度と
焼鈍条件を選択することにより可能」と記載されている
ものの、実際は予想以上に困難で、製造コストも高くつ
いてしまうことがわかった。なお、リードフレーム材の
表面に存在する析出物とは、ＦｅＰ等の金属間化合物が
主であり、他方、介在物とはＺｒ、Ｃｒ、Ｓｉ、Ａ１等
の酸化物が主である。"Problem to be solved by the invention" However, as a result of actual experiments conducted by the present inventors, Rm
Even if ax is 0.5μ2 or less and the single area of precipitates or inclusions appearing on the surface is 3XlO-"xx" or less, the wire bonding will not necessarily be successful and sufficient bonding strength will not be obtained. It turns out that there are cases where this is not the case. Furthermore, the above publication states that it is possible to refine the single area of precipitates and inclusions to 3 x 10-6xyt' or less by selecting the degree of rolling and annealing conditions. However, it turned out that it was actually more difficult than expected and the manufacturing costs were high. Note that the precipitates present on the surface of the lead frame material are mainly intermetallic compounds such as FeP, and the inclusions are mainly oxides such as Zr, Cr, Si, and A1.
そこで本発明者らは、これら析出物や介在物をさらに詳
細に調べ、前記従来品の欠点を補いうる、次のような全
く新たな知見を得るに至った。The present inventors investigated these precipitates and inclusions in more detail and came to the following completely new findings that can compensate for the drawbacks of the conventional products.
すなわち、前記公報のように析出物や介在物の単一面積
そのものを極端に微細化するのではなく、これら析出物
や介在物の単一面積が比較的大きい場合にも、これらを
酸処理等により溶解除去し、その跡に微細な凹部を多数
形成する。このようにリードフレーム材表面に多数の微
細な凹部を形成すると、ワイヤを周知の接合方法で圧接
した際に、ワイヤ接合部が凹部内にまで侵入して食い込
み、非常に高い接合強度が得られるのである。In other words, instead of making the single area of precipitates and inclusions extremely fine as in the above publication, even when the single area of these precipitates and inclusions is relatively large, they can be treated with acid, etc. It is removed by dissolving it, and many fine depressions are formed in its wake. By forming a large number of minute recesses on the surface of the lead frame material in this way, when wires are pressure-welded using a well-known joining method, the wire joints penetrate and bite into the recesses, resulting in extremely high joint strength. It is.
本発明者らは、さらに凹部の大きさについても子細な検
討を行ない、１〜３０００Ｘ１０−’ｚｘ”の場合に特
に良好な接合強度が得られることを突き止めた。なお、
この場合の上限面積である３００”ＯＸ １０−８ｍｍ
″という数値は、前記公報における面積上限の１０倍に
相当している。The inventors also conducted a detailed study on the size of the recess and found that particularly good bonding strength can be obtained when the size of the recess is 1 to 3000 x 10-'zx''.
In this case, the upper limit area is 300”OX 10-8mm
The numerical value '' corresponds to 10 times the upper limit of area in the above-mentioned publication.
「課題を解決するための手段」
本発明は上記知見に基づいてなされたもので、銅または
銅合金からなるリードフレーム材表面の中心線平均粗さ
（Ｒａ：ＪＩＳ規格）を０．１５μ次以下にするととも
に、表面に現れる析出物や介在物等を除去して１〜３０
００ Ｘ １０−”ｘ＊″の凹部を多数形成したことを
特徴とする。"Means for Solving the Problems" The present invention has been made based on the above findings, and it aims to reduce the centerline average roughness (Ra: JIS standard) of the surface of a lead frame material made of copper or copper alloy to 0.15μ or less. At the same time, remove precipitates and inclusions that appear on the surface.
It is characterized by forming a large number of recesses of 00 x 10-"x*".
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明に使用するリードフレーム材の材質としては、ジ
ルコン鋼、鉄人銅、錫入銅など従来同様のものが使用さ
れ、特に、Ｚｒ等の含有率が高く介在物を発生しゃすい
Ｃ１５０００，Ｃ１５１００や、ＦｅＰ等の析出物を発
生しゃすいＣ１９４００等が好適である（以上、いずれ
もＣＤＡ番号）。As for the lead frame material used in the present invention, conventional materials such as zircon steel, Tetsujin copper, and tinned copper are used, and in particular, C15000, C15100 and C15100, which have a high content of Zr and tend to generate inclusions, are used. , C19400, etc., which generate precipitates such as FeP, etc. are suitable (all of the above are CDA numbers).
そして、まずこの板材を通常の圧延加工により、例えば
厚さ０６３１程度に成形し、次いで通常の仕上圧延を施
して０．２６ｘｍ程度とした後、必要に応じてパフ研摩
等を施す。次に、表面が極手滑面とされた圧延ロールに
より、前記板材に軽荷重をかけて仕上軽圧延を施す。こ
の圧延ロールに要求される表面粗さはＲａ：０．１２μ
ｍ以下であり、また仕上軽圧延の際の荷重は、板材の変
形量が１〜５％程度となるように設定されることが望ま
しい。This plate material is first formed into a thickness of, for example, about 0.63 mm by ordinary rolling, and then subjected to ordinary finish rolling to a thickness of about 0.26 mm, and then subjected to puff polishing or the like as required. Next, a light load is applied to the plate material using a rolling roll having a very smooth surface to perform finish light rolling. The surface roughness required for this rolling roll is Ra: 0.12μ
m or less, and the load during finish light rolling is desirably set so that the amount of deformation of the plate material is about 1 to 5%.
圧延ロールの表面が前記値より粗かったり、板材の変形
量が前記範囲を外れると、所望の表面粗さが得られ難い
。If the surface of the rolling roll is rougher than the above-mentioned value or the amount of deformation of the plate material is out of the above-mentioned range, it will be difficult to obtain the desired surface roughness.
以上の仕上軽圧延により、リードフレーム材の中心線平
均粗さ（Ｒａ）を０．１５μ屓以下に平滑化する。この
値が０．１５μｍより大きいと、ワイヤの接合部とリー
ドフレーム表面との間に微小な隙間が生じやすく、接合
強度を低下させる。By the above finishing light rolling, the centerline average roughness (Ra) of the lead frame material is smoothed to 0.15 μm or less. When this value is larger than 0.15 μm, a minute gap is likely to be formed between the bonded portion of the wire and the surface of the lead frame, reducing the bonding strength.
次に、仕上軽圧延を終えた板材を処理液に浸漬し、その
表面に存在するＦｅＰ等の析出物、および各種金属の酸
化物等からなる介在物を溶解除去し、その跡に多数の四
部を形成する。前記処理液としては、塩化第二鉄等の塩
素系処理液や、フッ化水素酸等のフッ素系処理液等の溶
液が使用される。Next, the plate material that has undergone finish light rolling is immersed in a treatment solution to dissolve and remove precipitates such as FeP existing on the surface and inclusions made of oxides of various metals. form. As the treatment liquid, a solution such as a chlorine-based treatment liquid such as ferric chloride or a fluorine-based treatment liquid such as hydrofluoric acid is used.
また、前記凹部の個々の開口面積は、萌述の圧延条件を
選定することにより１〜３０００ ｘ １０−”■２と
される。凹部が前記範囲よりも小さいとワイヤ接合部が
噛み込むことができず、接合強度向上効果が得られない
。また、前記範囲より大きいと凹部へのワイヤ噛み込み
が安定せず、やはり接合強度が低下する。また、リード
フレーム材表面における凹部の分布密度は、５００〜１
００００個／Ｊ！１程度であることが望ましく、それよ
り少ないと噛み込みが不足して接合強度向上効果が得ら
れず、他方、多すぎると接合強度が安定しない。Further, the opening area of each of the recesses is set to 1 to 3000 x 10-''■2 by selecting the rolling conditions described in Moe's description.If the recesses are smaller than the above range, the wire joint may become jammed. If it is larger than the above range, the wire will not be stably caught in the recess, and the joint strength will also decrease.In addition, the distribution density of the recess on the surface of the lead frame material is 500-1
0000 pieces/J! It is desirable that the amount is about 1, and if it is less than that, there will be insufficient biting and the effect of improving the bonding strength will not be obtained.On the other hand, if it is too large, the bonding strength will not be stable.
さらに凹部の形状は、圧延条件等の選定により比較的深
い壷状とされることが望ましい。Furthermore, it is desirable that the shape of the recess is relatively deep and pot-shaped depending on the rolling conditions and the like.
以上の構成からなるリードフレーム材においては、その
表面に金または銅等のワイヤを周知の接合方法により接
合すると、ワイヤの接合部が、リードフレーム材表面に
形成された凹部の奥まで隙間なく噛み込んで、そのアン
カー効果により著しく高い接合強度が得られ、ワイヤ直
接接合の信頼性を格段に向上することができる。また、
従来品のように析出物や介在物の単一面積を極端に低減
する必要がないので、複雑な処理が要らず、その分、製
造コストが安く済むという利点も得られる。When a wire made of gold or copper is bonded to the surface of the lead frame material having the above structure using a well-known bonding method, the bonded portion of the wire will fit deep into the recess formed on the surface of the lead frame material without any gaps. In addition, due to the anchor effect, significantly high bonding strength can be obtained, and the reliability of direct wire bonding can be significantly improved. Also,
Unlike conventional products, it is not necessary to extremely reduce the single area of precipitates or inclusions, so there is no need for complicated processing, and the manufacturing cost can be reduced accordingly.
なお、上記実施例では、仕上軽圧延を行なってから析出
物や介在物の溶解処理を施していたが、その順序は逆で
あってもよいし、必要に応じてこれらの前後に他の処理
を加えてもよい。In the above example, the precipitates and inclusions were dissolved after finishing light rolling, but the order may be reversed, and other treatments may be performed before or after these if necessary. may be added.
「実施例」 次に実施例を挙げて、本発明の効果を実証する。"Example" Next, examples will be given to demonstrate the effects of the present invention.
Ｃ１５１００（ＣＤＡ番号）の銅合金板から通常の圧延
加工により０．２５５厚Ｘ ２５．４幅Ｘ ２００＋ｍ
長のリードフレーム材を６枚成形した。0.255 thickness x 25.4 width x 200+m by normal rolling process from C15100 (CDA number) copper alloy plate
Six long lead frame materials were molded.
淡いで、そのうち３枚に、表面粗さがＲａ：０．０？、
０．０９．０．１１μ肩の計３種の表面平滑化圧延ロー
ルによりそれぞれ変形ｆｆ１２％で仕上軽圧延を行なっ
た（順に実施例１．２．３とする）。さらにこれらを２
５℃の塩化第二鉄５ｗｔ％および塩酸１０ｖｔ％を含む
溶液に１分間浸漬し、表面に露出している析出物および
介在物を完全に溶解した。It's pale, and three of them have surface roughness Ra: 0.0? ,
Finish light rolling was performed using a total of three types of surface smoothing rolling rolls with shoulders of 0.09 and 0.11μ, each with a deformation ff of 12% (these are referred to as Examples 1.2.3). Furthermore, these 2
It was immersed for 1 minute in a solution containing 5 wt % ferric chloride and 10 vt % hydrochloric acid at 5° C. to completely dissolve precipitates and inclusions exposed on the surface.
一方、比較例として、Ｒａ：Ｏ，１２であるが析出物や
介在物を除去していないもの（比較例１）、析出物や介
在物を除去しているがＲａが本発明の条件を満たさない
もの（比較例２）、Ｒａ：０．３４で析出物除去も行っ
ていないもの（比較例３）を用意した。On the other hand, as comparative examples, there are cases in which Ra: O, 12 but precipitates and inclusions are not removed (Comparative Example 1), and cases in which precipitates and inclusions are removed but Ra does not satisfy the conditions of the present invention. One without (Comparative Example 2) and the other with Ra: 0.34 and without precipitate removal (Comparative Example 3) were prepared.
そして、以上全てのリードフレーム材の表面粗さを表面
粗さ計等により測定するとともに、表面の凹部の大きさ
や、分布密度、凹部形状を走査顕微鏡を用いｔ計測した
。Then, the surface roughness of all the lead frame materials mentioned above was measured using a surface roughness meter or the like, and the size, distribution density, and shape of the recesses on the surface were measured using a scanning microscope.
次に、これらのリードフレーム材を自動ワイヤ接合装置
にセットし、実際にワイヤボンディングを行なった。そ
の条件を以下に示す。Next, these lead frame materials were set in an automatic wire bonding device, and wire bonding was actually performed. The conditions are shown below.
接合方法：サーモソニック法 ワイヤ材質二金 ワイヤ直径＝２５μ肩 リードフレーム温度＝ ２２５°Ｃ 接合荷重：４０ｇ 超音波用カニ０．２５Ｗ 超音波発生時間： ２０ ｘｓｅｃ。Joining method: Thermosonic method Wire material 2 gold Wire diameter = 25μ shoulder Lead frame temperature = 225°C Bonding load: 40g Ultrasonic Crab 0.25W Ultrasonic generation time: 20xsec.
その後、接合し終えたワイヤをフックにより引き上げて
、ワイヤを切断するのに要する引上荷重を測定した。併
せて、接合強度の評価も行なった。Thereafter, the wires that had been joined were pulled up using a hook, and the lifting load required to cut the wires was measured. At the same time, the bonding strength was also evaluated.
この評価は、接合部がワイヤ引上荷重に耐えてワイヤ切
断に至るまで何の変化も見られない場合が「○」、接合
部が一部剥離した後ワイヤが切断したものが「△」、完
全に剥離したものが「×」である。This evaluation is ``○'' when the joint part withstands the wire pulling load and no change is observed until the wire breaks, and ``△'' when the wire breaks after the joint part has partially peeled off. Completely peeled off is marked "×".
その結果を次表に示す。なお表中、実１〜３は実施例、
比１〜３は比較例である。The results are shown in the table below. In addition, in the table, Examples 1 to 3 are examples,
Ratios 1 to 3 are comparative examples.
（以下、余白）
上表から明らかなように、各実施例のリードフレーム材
では、実際の使用に耐えうろ高い接合強度が得られた。(Hereinafter, blank space) As is clear from the table above, the lead frame materials of each example had a very high bonding strength that could withstand actual use.
「発明の効果」
以上説明したように、本発明に係わる銅または銅合金か
らなるリードフレーム材は、表面の中心線平均粗さ（Ｒ
ａ）を０．１５μ屑以下にするとともに、表面に現れる
析出物や介在物等を除去して１〜３０００ Ｘ １０−
”ｘｘ”の凹部を多数形成したものなので、その表面に
金属ワイヤを接合すると、ワイヤ接合部が前記凹部の奥
まで略隙間なく噛み込んで、そのアンカー効果により著
しく高い接合強度を得ることができ、ワイヤ直接接合の
信頼性を格段に向上することが可能である。また、析出
物や介在物の単一面積を極端に低減する必要がないので
、複雑な処理が要らず、その分、製造コストが安く済む
という利点もある。"Effects of the Invention" As explained above, the lead frame material made of copper or copper alloy according to the present invention has a center line average roughness (R
a) to 0.15μ or less, and remove precipitates and inclusions that appear on the surface to 1 to 3000 x 10-
Since it has a large number of "xx" recesses, when a metal wire is bonded to its surface, the wire joint will fit deep into the recesses with almost no gaps, and its anchor effect will provide significantly high bonding strength. , it is possible to significantly improve the reliability of direct wire bonding. Furthermore, since there is no need to extremely reduce the single area of precipitates or inclusions, there is also the advantage that no complicated processing is required and the manufacturing cost is reduced accordingly.
Claims (1)
するとともに、その表面に現れる析出物や介在物等を除
去して１〜３０００×１０＾−＾８ｍｍ＾２の凹部を多
数形成したことを特徴とする銅または銅合金からなるリ
ードフレーム材。The center line average roughness (Ra) of the surface was set to 0.15 μm or less, and precipitates and inclusions appearing on the surface were removed to form a large number of recesses of 1 to 3000 x 10^-^8 mm^2. A lead frame material made of copper or copper alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63014983A JPH0775252B2 (en) | 1988-01-26 | 1988-01-26 | Lead frame material manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63014983A JPH0775252B2 (en) | 1988-01-26 | 1988-01-26 | Lead frame material manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01189947A true JPH01189947A (en) | 1989-07-31 |
| JPH0775252B2 JPH0775252B2 (en) | 1995-08-09 |
Family
ID=11876197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63014983A Expired - Lifetime JPH0775252B2 (en) | 1988-01-26 | 1988-01-26 | Lead frame material manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0775252B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5210441A (en) * | 1990-12-20 | 1993-05-11 | Kabushiki Kaisha Toshiba | Lead frame formed of a copper-zirconium alloy |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61218149A (en) * | 1985-03-25 | 1986-09-27 | Hitachi Ltd | Semiconductor device |
-
1988
- 1988-01-26 JP JP63014983A patent/JPH0775252B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61218149A (en) * | 1985-03-25 | 1986-09-27 | Hitachi Ltd | Semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5210441A (en) * | 1990-12-20 | 1993-05-11 | Kabushiki Kaisha Toshiba | Lead frame formed of a copper-zirconium alloy |
| US5341025A (en) * | 1990-12-20 | 1994-08-23 | Kabushiki Kaisha Toshiba | IC package and LSI package using a lead frame formed of a copper-zirconium alloy |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0775252B2 (en) | 1995-08-09 |
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