JPH01188693A - Electroplating method - Google Patents

Abstract

PURPOSE:To make the thickness of films formed by plating uniform by closely holding plural bodies having planes so that one plane is formed and electroplating the bodies. CONSTITUTION:When plural bodies 4a-4c having planes are plated, they are closely held in a plating soln. 2 so that one plane is formed. The bodies 4a-4c are connected to a power source with cords 5b1-5b3 and electroplated as if they are one body to be plated. The thickness of films formed by electroplating can be made nearly uniform.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for making the thickness of a plated metal film uniform in the work of plating a flat surface by an electrolytic method.

[Conventional technology]

BACKGROUND ART Conventionally, electrolytic plating has been put into practical use as a processing method for metal surfaces, and the plating work is performed by suspending objects to be plated one by one in a plating bath.

[Problem that the invention seeks to solve]

In the conventional plating method described above, the objects to be plated are individually suspended in a plating tank and plated, so when plating a flat surface, the thickness of the deposited plating is small at the periphery and center of the flat surface. There was a big difference.

FIG. 2 shows the positional relationship between a plating electrode and a flat object to be plated in a plating tank in a conventional electrolytic plating method. The plating solution, plating tank, plating electrode, and object to be plated are in the state shown in FIG. 2(B). A plating solution 2 is contained in a plating bath 1, and a plating electrode 3 and a flat object to be plated 4 are set below the liquid level.

The plating electrode 3 and the object to be plated 4 are connected to a power cord 5a.

It is connected to the power supply by 5b. As shown in Fig. 2 (A), the plating electrode 3 or the object to be plated 4 and the electrode cord are electrically connected by a clip-shaped jig fixed to the tip of the power cord for ease of operation. ing. Usually, the composition of the plating solution is controlled and it is confirmed that it is in an appropriate state before it is set to the state shown in Figure 2 (B), and the plated surface of the object 4 to be plated is well plated. Usually, it goes through an appropriate cleaning process to achieve this. Next, the conditions shown in Figure 2 (B) are set, and the plating operation is continued at an appropriate current value until it is estimated that the target plating thickness has been reached, and then post-plating cleaning is performed. Plating work is completed. Figure 2 (A) and (
An example of the thickness of plating in the plating work shown in B) is shown. The graph is A shown in Fig. 2 (A) of the object to be plated 3.
- Shown along A'. In normal plating work, variations in plating thickness are also affected by the shape of the object to be plated, so it has always been thought that a certain range of variation is required.

While the conventional plating method described above plates planar objects one by one, the present invention has a difference in that a large number of objects to be plated are plated as one adherend.

[Means for solving problems]

A feature of the present invention is that by treating a large number of objects to be plated as one object to be plated, uniformity of the thickness of the plated film can be obtained.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the present invention, showing only the side of the object to be plated in a state corresponding to (A) of the conventional example shown in FIG. In FIG. 1(A), objects to be plated 4a, 4b, and 4c are held in plating solution 2 in close proximity to each other, and power cords 5b+ and 5 are connected to each other, respectively.
It is connected to the power source through b2 and 5b3, and is worked on as if it were one object to be plated. In the embodiment shown in FIG. 1(A), three objects to be plated are treated as one object to be plated at the same time, but it is also possible to treat a larger number of objects to be plated in the same manner.

FIG. 1(B) is a perspective view showing a second embodiment of the present invention.

What corresponds to FIG. 2(A) of the conventional example is the same as the first embodiment, but in this embodiment, the sizes of the objects to be plated 4a, 4c and the object to be plated 4b are different, and the objects to be plated are different in size. 4a,
4c is later discarded and only 1b is treated as an actual object to be plated, and the variation in plating thickness of this is extremely small.

〔Effect of the invention〕

As explained above, the present invention minimizes variations in the plated thickness by holding a plurality of objects to be plated as if they were one object during plating work on a flat object to be plated. It has the effect of

[Brief explanation of the drawing]

1A and 1B are perspective views showing a method of plating a flat surface according to the present invention, and FIG. 2 is a diagram showing a plating method according to a conventional example and a diagram showing the thickness of a plated film. be. 2 is a plating tank, 2 is a plating solution, 3 is a plating electrode, 4 is a body to be plated, and 5a and 5b are power cords. −Representative Patent Attorney Susumu Uchihara

Claims (1)

[Claims] An electrolytic plating method characterized by performing electrolytic plating on an object to be plated which has a plurality of planes while being held close to each other so that each plane becomes one plane.