JPS62108563A - Plating treater - Google Patents

Plating treater

Info

Publication number
JPS62108563A
JPS62108563A JP24961485A JP24961485A JPS62108563A JP S62108563 A JPS62108563 A JP S62108563A JP 24961485 A JP24961485 A JP 24961485A JP 24961485 A JP24961485 A JP 24961485A JP S62108563 A JPS62108563 A JP S62108563A
Authority
JP
Japan
Prior art keywords
roller
plating
rollers
lead frame
plating treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24961485A
Other languages
Japanese (ja)
Inventor
Ikuo Sasaki
佐々木　育夫
Katsuji Kawaguchi
川口　克二
Yoshitaka Takemoto
好孝 竹本
Toshinobu Banjo
番條　敏信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP24961485A priority Critical patent/JPS62108563A/en
Publication of JPS62108563A publication Critical patent/JPS62108563A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To automate a plating treatment process completely by sandwitching a lead frame fitted faced oppositely to first rollers by the first rollers and mounting second rollers, which takes a semiconductor device into and out of a plating liquid from an opening section. CONSTITUTION:Semiconductor devices 11 are positioned in sections constituted only of third rollers 20 on the outside of a plating treatment tank 14, fed into the plating treatment tank 14 with the revolution of the third rollers 20, and carried in a shape that the semiconductor devices are held by first rollers 18 and second rollers 19. Metallic disks 23 of the first rollers 18 are conducted through shafts 21 at that time, a DC power supply is fed from the outside among cathode electrodes consisting of the metallic disks 23 for the first rollers and a soluble anode metallic plate 16, and plating is started to the surfaces of lead frames 13 after the lead frames 13 fed into the plating tank 14 are brought into contact with the first rollers 18 as cathodes. The semiconductor devices 11 discharged from the plating treatment tank 14 are forwarded to the next process. Accordingly, a plating treatment process is automated completely, thus improving productivity.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 ″この発明はめつき処理装置に係り、特に半導体装置の
リードフレームを電気めっきする際の自動化を図ったも
のである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] ``The present invention relates to a plating processing apparatus, and is particularly intended to automate electroplating of lead frames of semiconductor devices.

〔従来の技術〕[Conventional technology]

一般に半導体装置のリードフレームには耐食性。 Generally, lead frames of semiconductor devices are corrosion resistant.

はんだ付は性等を目的として、はんだ、錫、銀。Soldering uses solder, tin, and silver for purposes such as sex.

金などの表面被覆処理が施されている。Surface coating treatment such as gold is applied.

この表面処理の方法としては、主に電気めつき方式と、
溶融はんだ浸漬方式が用いられているが、製品の安定性
、ｆ！に産性等の理由により電気めっき方式が主流とな
っている。The main methods for this surface treatment are electroplating,
Although the molten solder dipping method is used, product stability and f! Electroplating is the mainstream method due to productivity and other reasons.

この様な電気めっき方式を利用した従来のめつき処理装
置の一例を第３図ないし第５図を用いて以下に説明する
。An example of a conventional plating processing apparatus using such an electroplating method will be described below with reference to FIGS. 3 to 5.

第３図において、（１）は電気めっきを施すためのめつ
き槽でこのめつき槽（１）の内部にはめっき液（２）が
満たされ、めつき槽（１）内部の両サイドには可溶性陽
極としての金属板（３）が設置されている。In Fig. 3, (1) is a plating tank for electroplating, and the inside of this plating tank (1) is filled with plating solution (2), and both sides of the inside of the plating tank (1) are filled with plating solution (2). A metal plate (3) is installed as a soluble anode.

第４図及び第５図に於て、（４）はめつき槽（１）の中
でめっき処理を施す場合に半導体素子封止体（５）が１
列に多数設けられたリードフレーム（６）をつるすラッ
クで、このラック（４）には複数枚のリードフレーム（
６）がいちどに処理できる。ようラック（４）にり一ド
フレーム（６）を引っかけるための多数のフック（７）
がついている。めっき中のリードフレーム（６）にはこ
のフック（７）を通じて陰極として導通がとられる。In FIGS. 4 and 5, (4) when performing plating treatment in the plating tank (1), the semiconductor element sealed body (5) is
A rack for hanging a large number of lead frames (6) arranged in a row.
6) can be processed at once. Numerous hooks (7) for hanging racks (4) and frame (6)
is attached. Electricity is established through this hook (7) as a cathode to the lead frame (6) during plating.

めっきの実施は、めっき槽（１）中の可溶性金属板（３
）を陽極、ラック（４）側を陰極とし、めっき槽（１）
中にリードフレーム（６）を引っかけたラック（４）を
浸漬し、両極の間に直流電流を流すことにより行なわれ
る。Plating is carried out by placing a soluble metal plate (3) in a plating tank (1).
) is the anode, the rack (4) side is the cathode, and the plating tank (1)
This is done by immersing the rack (4) into which the lead frame (6) is hooked, and passing a direct current between the two poles.

一定時゛間のめっきを完了したラック（４）はめっき槽
（１）より取り出され、水洗・乾燥を施される。After completing plating for a certain period of time, the rack (4) is taken out from the plating tank (1), washed with water and dried.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来のめつき処理装置は以上の様に構成されているので
リードフレーム（６）のラック（４）からの着脱は人手
によらなければならず半導体組立装置のほとんどが自動
化されている中にあって数少ない人手の介在する装置の
ため、前後のプロセスを含む処理装置を連結し一貫自動
化ラインとすることができないという問題点があった。Since conventional plating processing equipment is configured as described above, the attachment and detachment of the lead frame (6) from the rack (4) must be done manually, which is difficult to do even though most semiconductor assembly equipment is automated. Since there are only a few machines that require human intervention, there was a problem in that it was not possible to connect the processing equipment including the pre- and post-processes to form an integrated automated line.

この発明は上記のような問題点を解決するためになされ
たもので、めっき処理工程が完全に自動化できるめっき
処理装置を得ることを目的とする。This invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a plating processing apparatus that can completely automate the plating process.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係るめっき処理装置は、電極が備えられ、こ
の電極がめつき液内に浸された第１ローラと、この第１
ローラに対向して設けられた第２ローラとを有し、これ
ら第１ローラと第２ローラとでリードフレームを挾持し
て、半導体装置をめっき液内に出入れすると共に、上記
第１ローラに備えられた電極を用いてめっき処理を行う
ようにしたものである。The plating processing apparatus according to the present invention includes a first roller provided with an electrode and immersed in a plating solution;
The lead frame is sandwiched between the first roller and the second roller, and the semiconductor device is put in and out of the plating solution, and the semiconductor device is moved into and out of the plating solution. The plating process is performed using the provided electrodes.

〔作用〕[Effect]

この発明に於ては、第１ローラと第２ローラとを設けて
、これら第１ローラと第２ローラとにより、半導体装置
をめっき液の中へ出入れするようにしているから、従来
のような人手によるリードフレームのラックへの着脱及
びラックのめっき液内への出入が不要となる。In this invention, a first roller and a second roller are provided, and the semiconductor device is moved in and out of the plating solution by the first roller and the second roller, so it is different from the conventional method. This eliminates the need to manually attach and detach the lead frame to and from the rack and to move the rack into and out of the plating solution.

〔実施例〕〔Example〕

以下、この発明の一実施例を第１図及び第２図に基づい
て説明する。第１図に於て、ａηは半導体素子封止体（
至）とリードフレーム（至）とが一体化している半導体
装置で、この半導体装置αυでは、半導体素子封止体（
至）が１列に多数備えられているものである。α◆は上
記半導体装Ｗ（ロ）をめっき液（至）内へ出入するため
のスリット状の開口部（１６ａ）（１６ｂ）を対向する
側面に各々１個ずつ有しためっき処理槽、αηは上記め
っき液（至）内に浸された可溶性の陽極金属板、（至）
は陰極電極がめつき液（至）内に浸された第１ローラ、
α場はこの第１ローラ（至）に対向して設けられて、上
記リードフレーム（至）を上記第１ローラ（至）とで挾
持して上記半導体装置（ロ）を上記開口部（１６ａ）か
らめっき液（ハ）を経て開口部（１６ｂ）へ出入する第
２ローラで、これら第１及び第２ローラ０ＪｌＧＱｌは
各々１個ずつを対として、めっき処理槽ａ４内に等間隔
で４対設けられているものである。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. In FIG. 1, aη is the semiconductor element sealed body (
This is a semiconductor device in which a lead frame (to) and a lead frame (to) are integrated.
) are provided in one row. α◆ is a plating tank having one slit-shaped opening (16a) and one (16b) on opposite sides for allowing the semiconductor device W (b) to enter and exit the plating solution (to), and αη is Soluble anode metal plate immersed in the above plating solution (to)
is the first roller whose cathode electrode is immersed in the plating solution;
The α field is provided opposite to the first roller (to), and the lead frame (to) is held between the first roller (to) and the semiconductor device (b) is placed in the opening (16a). The second roller enters and exits the opening (16b) through the plating solution (c), and four pairs of the first and second rollers 0JlGQl are provided at equal intervals in the plating tank a4, one each as a pair. This is what is being done.

更に勾はめつき処理槽ａ＜外の開口部（１６ａ）（１６
ｂ）付近に設けられた上記第２ローラＱ９と同一形状の
第３ローラで、この第３ローラ翰は複数配列されてめっ
き処理の前後の工程の製造装置に及んでいるものである
。Ｑ心は上記第１．第２．第３ローラ（Ｌ［９０’ｌ（
ホ）に回転を伝える表面がシールされた金属性のシャフ
トである。上記第１及び第２ローラ（ト）（２）につい
て第２図に基づき、更に詳細に説明する。Furthermore, the angle-fitting treatment tank a<outer opening (16a) (16
b) A third roller provided nearby and having the same shape as the second roller Q9, and a plurality of third roller wings are arranged and extend to manufacturing equipment for processes before and after the plating process. Q-Mind is the first thing above. Second. Third roller (L[90'l(
It is a metal shaft with a sealed surface that transmits rotation to (e). The first and second rollers (2) will be explained in more detail with reference to FIG. 2.

第ｌローラ（ト）は図に示す様に円柱形状の塩化ビニル
からなる中心部■とこの中心部（２）の両端に設けられ
た上記中心部（ホ）の半径よりも半導体素子封止体（２
）の厚さの半分以上半径が大きい金属円板□□□とによ
って構成され、この金属円板四部分を陰極電極とすると
ともに、この金属円板四部分にてリードフレーム（至）
の端部を挾持するものである。一方、第２ローラ翰は、
全体が塩化ビニルで構されており円柱形状の中心部（財
）と、この中心部（ハ）の両端に設けられた上記中心部
（財）の半径よりも半導体素子封止体（２）の厚さの半
分以上半径が大きい円板形状のリードフレーム（至）の
挾持部に）と、第２ローラ０鑓の最端部に位置し、挾持
部（ハ）から端部に向かって末広がる円錐台形状のガイ
ド部（ホ）とによって構成されるものである。As shown in the figure, the first roller (G) has a center part (2) made of cylindrical vinyl chloride and a semiconductor element encapsulated body that is larger than the radius of the center part (E) provided at both ends of this center part (2). (2
), the four parts of this metal disc serve as cathode electrodes, and the four parts of this metal disc serve as a lead frame (to).
It is used to hold the ends of the On the other hand, the second roller
The entire structure is made of vinyl chloride, and has a cylindrical center (item) and a semiconductor element encapsulated body (2) that is larger than the radius of the center (item) provided at both ends of this center (c). It is located at the gripping part of the disc-shaped lead frame (to) whose radius is more than half the thickness, and at the extreme end of the second roller 0, and spreads out from the gripping part (c) to the end. It is composed of a truncated cone-shaped guide portion (E).

次に以上の様に構成されためっき処理装置の動作につい
て説明する。Next, the operation of the plating processing apparatus configured as above will be explained.

めっき処理される半導体装置（ロ）はめっき処理槽α◆
外の第３ローラーだけで構成された部分におかれ、第３
ローラ翰の回転に従ってめっき処理槽α４内に送り込ま
れ、めっき処理槽Ｑ４内では第１ローラ（至）と第２ロ
ーラａすにはさまれた形で搬送される。Semiconductor devices to be plated (b) are placed in the plating tank α◆
Placed in the part consisting only of the outer third roller,
It is fed into the plating tank α4 according to the rotation of the roller handle, and is conveyed in the plating tank Q4 while being sandwiched between the first roller (to) and the second roller a.

このとき第１ローラ（２）の金属円板磐にはシャフト（
２）を通じて導通が取られているから第１ローラの金属
円板（ホ）からなる陰極電極と可溶性陽極金属板（ｌと
の間には外部より直流電源が供給されめっき槽α４内に
送り込まれたリードフレーム（至）は陰極としての第１
ローラ（至）に接した時からリードフレーム（至）の表
面にめっきが開始される。めっき処理槽α荀を出た半導
体装置（６）は第３ローラ（１）により次の工程に送ら
れる。At this time, the metal disk of the first roller (2) has a shaft (
Since conduction is established through 2), DC power is supplied from the outside between the cathode electrode consisting of the metal disc (E) of the first roller and the soluble anode metal plate (L), and the plating tank α4 is fed into the plating tank α4. The lead frame (to) serves as the first cathode.
Plating begins on the surface of the lead frame when it comes into contact with the roller. The semiconductor device (6) that has left the plating tank α is sent to the next step by the third roller (1).

以上の様なめつき処理装置においては、第１ローラ（至
）と第２ローラＱ９とを設けてこれら第１ローラ（ト）
と第２ローラα優とにより、半導体装置（ロ）をめっき
液（至）の中へ出入れするようにしているから、従来装
置のような人手によるリードフレーム（６）のラック（
４）への着脱及びラック（４）のめっき液（至）内への
出入が不要となる。また、第２ローラαりにはガイド部
（ハ）が設けであるから、半導体装置Ｑｌ）を転送する
際横ずれすることはない。更には、第１ローラ（至）に
設けられた金属円板からなる電極（２）と第２ローラＱ
ｌの挾持部（財）とによってリードフレーム（至）を挾
持し転送するようにしているからリードフレーム（至）
と電極（２）とが完全に密着し電極（財）からリードフ
レーム（至）への電気の導通をスムーズにするものであ
る。In the above-mentioned plating processing apparatus, the first roller (to) and the second roller Q9 are provided, and these first rollers (to)
Since the semiconductor device (b) is moved in and out of the plating solution (to) by the second roller α and the second roller α, there is no need to manually rack the lead frame (6) as in conventional equipment.
There is no need to attach or detach the rack (4) to or from the plating solution (to). Further, since the second roller α is provided with a guide portion (c), the semiconductor device Ql) will not shift laterally when being transferred. Furthermore, an electrode (2) made of a metal disc provided on the first roller (to) and a second roller Q
Since the lead frame (to) is held and transferred by the clamping part (of l), the lead frame (to) is transferred.
and the electrode (2) are in complete contact with each other to ensure smooth conduction of electricity from the electrode (material) to the lead frame (toward).

なお、上記実施例に於ては、第ｌローラ（至）と第２ロ
ーラ０．１との対を４個設けたがこれに限られるもので
はなく、処理能力を増加させる為には、更に増加しても
良い。In the above embodiment, four pairs of the first roller (to) and the second roller 0.1 are provided, but the number is not limited to this, and in order to increase the processing capacity, further May be increased.

また、上記実施例に於ては、第１ローラ（ト）と大２ロ
ーラｑ９に中心部四を設けたが必ずしも設は必要はなく
、第１ローラ（至）の金属円板（イ）及び第２ローラ０
１の挾持部（ハ）及びガイド部（イ）を何らかの手段で
固定する様にしても良い。In addition, in the above embodiment, the first roller (G) and the second large roller q9 are provided with a central portion 4, but it is not necessary to provide the center portion 4, and the metal disc (A) of the first roller (To) and the center portion 4 are provided. 2nd roller 0
The holding portion (c) and the guide portion (a) of No. 1 may be fixed by some means.

更には、上記実施例に於ては複数の第２ローラα場は各
々独立していたが、挾持部（財）にのみかかるベルトを
複数の第２ローラＱ１間に設けてもよい。Furthermore, in the above embodiment, the plurality of second rollers α fields were each independent, but a belt that extends only over the clamping portion (goods) may be provided between the plurality of second rollers Q1.

〔発明の効果〕〔Effect of the invention〕

この発明は以上説明した様に、第１ローラと第２ローラ
とを設けて、これら第１ローラと第２ローラとにより、
半導体装置をめっき液の中へ出入れするようにしている
から、従来のような人手によるリードフレームのラック
への着脱及びラックのめつき液内への出入が不要となり
、これによってめっき処理工程の完全自動化が図れ、生
産性が向上するという効果がある。As explained above, this invention includes a first roller and a second roller, and these first rollers and second rollers
Since the semiconductor device is moved in and out of the plating solution, it is no longer necessary to manually attach and detach the lead frame to and from the rack and to move the rack in and out of the plating solution, which was required in the past. This has the effect of achieving complete automation and improving productivity.

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの発明の一実施例を示すめっき処理装置の断
面図、第２図は第１図のローラ部分の拡大正面図、第３
図は従来のめつき処理装置の断面図、第４図は従来のめ
つき処理装置に用いられるラックの斜視図、第５図は従
来のラックに半導体装置を掛けた時の断面図である。 図に於て、（ロ）は半導体装置、（６）は半導体素子封
圧体、（２）はリードフレーム、Ｑ４はめつき処理槽、
（至）はめつき液、（１６ａ）（１６ｂ）は開口部、α
ηは金属電極、（至）は第１ローラ、Ｑｌは第２ローラ
、轍は第１ローラの電極である。 なお、各図中同一符号は同−又は相当部分を示すもので
ある。FIG. 1 is a sectional view of a plating processing apparatus showing an embodiment of the present invention, FIG. 2 is an enlarged front view of the roller portion of FIG. 1, and FIG.
4 is a perspective view of a rack used in the conventional plating processing apparatus, and FIG. 5 is a sectional view of a conventional rack with semiconductor devices hung thereon. In the figure, (b) is a semiconductor device, (6) is a semiconductor element sealing body, (2) is a lead frame, Q4 is a plating processing tank,
(To) Fitting liquid, (16a) (16b) are openings, α
η is a metal electrode, (to) is the first roller, Ql is the second roller, and ruts are the electrodes of the first roller. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (5)

【特許請求の範囲】[Claims] （１）半導体素子封止体とリードフレームとが一体化し
ている半導体装置をめつき液内へ出入するための開口部
を有しためつき処理槽、このめつき処理槽内に貯蔵され
ためつき液内に浸された金属電極、この金属電極と反対
極性の電極を上記リードフレームに接する位置に有し、
この電極が上記めつき液内に浸された第１ローラ、この
第１ローラに対向して設けられて上記リードフレームを
上記第１ローラによつて挾持して上記半導体装置を上記
開口部からめつき液内へ出入れする第２ローラを備えた
ことを特徴とするめつき処理装置。(1) A plating treatment tank having an opening for entering and exiting a semiconductor device in which a semiconductor element encapsulation body and a lead frame are integrated into a plating solution, and a plating treatment tank that stores plating in this plating treatment tank. A metal electrode immersed in the liquid, an electrode having an opposite polarity to the metal electrode at a position in contact with the lead frame,
The electrode is provided with a first roller immersed in the plating solution, and the semiconductor device is plated from the opening by sandwiching the lead frame between the first roller and the first roller. A plating processing device comprising a second roller that moves in and out of the liquid. （２）第１ローラまたは第２ローラに於るリードフレー
ム挾持部分の少なくとも一方は金属電極であることを特
徴とする特許請求の範囲第４項記載のめつき処理装置。(2) The plating processing apparatus according to claim 4, wherein at least one of the lead frame clamping portions of the first roller or the second roller is a metal electrode. （３）第１ローラまたは第２ローラは、リードフレーム
を第１ローラと第２ローラとで挾持する部分に導くガイ
ド部を有していることを特徴とする特許請求の範囲第１
項または第２項記載のめつき処理装置。(3) The first roller or the second roller has a guide portion that guides the lead frame to a portion where the first roller and the second roller sandwich the lead frame.
3. The plating processing apparatus according to item 1 or 2. （４）ガイド部は、ローラの最端部に位置し、端部に向
かつて末広がる円錐台形状のものであることを特徴とす
る特許請求の範囲第３項記載のめつき処理装置。(4) The plating processing apparatus according to claim 3, wherein the guide portion is located at the extreme end of the roller and has a truncated conical shape that widens toward the end. （５）半導体装置は第１ローラと第２ローラとの対向す
る部分にて移動されるものであり、第１ローラ及び第２
ローラの回転軸を中心とする半径は、リードフレーム挾
持部分にて大きく、半導体素子封止体の通過部にて小さ
いことを特徴とする特許請求の範囲第１項ないし第４項
の何れかに記載のめつき処理装置。(5) The semiconductor device is moved at a portion where the first roller and the second roller face each other.
According to any one of claims 1 to 4, the radius of the roller around the rotational axis is large at the lead frame holding portion and small at the passage portion of the semiconductor element sealing body. The plating processing device described.
JP24961485A 1985-11-06 1985-11-06 Plating treater Pending JPS62108563A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24961485A JPS62108563A (en) 1985-11-06 1985-11-06 Plating treater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24961485A JPS62108563A (en) 1985-11-06 1985-11-06 Plating treater

Publications (1)

Publication Number Publication Date
JPS62108563A true JPS62108563A (en) 1987-05-19

Family

ID=17195645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24961485A Pending JPS62108563A (en) 1985-11-06 1985-11-06 Plating treater

Country Status (1)

Country Link
JP (1) JPS62108563A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008028394A (en) * 2006-07-19 2008-02-07 Hoellmueller Maschinenbau Gmbh Apparatus for treating flat and delicate substrates

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54148379A (en) * 1978-05-12 1979-11-20 Nec Corp Plating method of base ribbon for semiconductor device
JPS574150A (en) * 1980-06-09 1982-01-09 Mitsubishi Electric Corp Outer plating process for semiconductor device
JPS5881997A (en) * 1981-11-07 1983-05-17 Hideo Tsubaki Horizontally conveying type automatic plating apparatus
JPS5896759A (en) * 1981-12-04 1983-06-08 Mitsubishi Electric Corp Plating device of lead frame for semiconductor device
JPS5950553A (en) * 1982-09-16 1984-03-23 Fuji Plant Kogyo Kk Mechanism for carrying depressed type lead frame

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54148379A (en) * 1978-05-12 1979-11-20 Nec Corp Plating method of base ribbon for semiconductor device
JPS574150A (en) * 1980-06-09 1982-01-09 Mitsubishi Electric Corp Outer plating process for semiconductor device
JPS5881997A (en) * 1981-11-07 1983-05-17 Hideo Tsubaki Horizontally conveying type automatic plating apparatus
JPS5896759A (en) * 1981-12-04 1983-06-08 Mitsubishi Electric Corp Plating device of lead frame for semiconductor device
JPS5950553A (en) * 1982-09-16 1984-03-23 Fuji Plant Kogyo Kk Mechanism for carrying depressed type lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008028394A (en) * 2006-07-19 2008-02-07 Hoellmueller Maschinenbau Gmbh Apparatus for treating flat and delicate substrates

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