JPH0723553B2 - Method for plating three-dimensional network structure - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method for plating a non-conductive three-dimensional network structure having conductivity by electroless plating or carbon coating.

<Prior art and its problems> Unlike plating on general plates and wires, plating on a three-dimensional net-like structure requires uniform electrodeposition in the holes, which is a major problem.

This is because the current density varies between the surface layer and the inner layer of the three-dimensional network structure.Therefore, the larger the specific resistance of the conductive layer applied to the surface of the three-dimensional network structure, the greater the three-dimensional network structure. The voltage drop in the body layer portion becomes large, and thus the current density in the surface layer portion of the three-dimensional network structure becomes large.
That is, a large amount of electrodeposited metal ions are consumed in the surface layer of the three-dimensional network structure, and a deficiency state of metal ions occurs in the layer of the three-dimensional network structure. This phenomenon is caused not only by the influence of the conductive treatment layer, but also by the difference in the liquid resistance, which generally comes from the difference in the distance between the electrodes, and the polarization phenomenon at the solid-liquid interface between the cathode and the liquid. This is caused by the difficulty of rotation of the ions.

In the case of plating on a three-dimensional network structure, if the current density is increased, the current density of the surface layer of the three-dimensional network structure becomes excessive, and the polarization increases too much, so that the metal ions in the inner layer of the three-dimensional network structure become Deficiency occurs.

For this reason, the non-conductive three-dimensional network structure can be plated with only one tenth to one-hundredth of the current density normally used for plating general plates and wires. .

Conventionally, considering the difficulty of plating on such a three-dimensional network structure, as a plating method, a tape-shaped three-dimensional network structure 11 having conductivity is preliminarily plated as shown in FIG.
After increasing the conductivity by dipping while one surface is closely attached to the cathode power supply roll 13 in 12 and thinly plating on the surface of the other surface, plating is performed in the main plating tank 14 to the planned electrodeposition amount. However, in this method, since the plating electrodeposition amount on both surfaces of the tape-shaped three-dimensional network structure in the pre-plating, that is, A surface and B surface is uneven, the final plated three-dimensional network structure after the main plating is finished. Even in body products, the amount of electrodeposition of plating on surfaces A and B is non-uniform.

That is, as a result of the non-uniformity that the amount of electrodeposited metal by plating is large on the A side and small on the B side, there is a strength difference between the A side and the B side, and when bending or heating / cooling, the B side is There are drawbacks such as cracking and warping.

<Means for Solving the Problem> The present invention has been made as a result of studies to solve the drawbacks of the above-mentioned conventional method in plating on a three-dimensional network structure.

That is, the method for plating a three-dimensional network structure of the present invention is a method for continuously electroplating a tape-shaped three-dimensional network structure having conductivity, in which the cathode power supply roll rotating in the plating bath is used. When supplying power to the three-dimensional network structure by moving while closely contacting the surface and one surface of the tape-shaped three-dimensional network structure, a plurality of the cathode power supply rolls are provided, at least one of which is provided. The tape-shaped three-dimensional net-like structure is formed by first-stage plating in which one side of the tape-like three-dimensional net-like structure is adhered and half of the total plating amount is electroplated. It is characterized in that the second-stage plating is performed in which the remaining half of the plating amount is electroplated so as to be in close contact with the other surface of the body.

<Operation> The present invention will be described in more detail with reference to FIG. 1. In the present invention, the preliminary plating tank according to the conventional method is the first plating tank 1,
The second plating tank 2 and the second plating tank 2 are installed. In the first plating tank 1, one surface of the tape-shaped three-dimensional network structure 3 having conductivity, that is, the A surface is the outside and the B surface is the inside. 1) The cathode power supply roll 4 in the plating tank 1 is brought into close contact with the surface A to plate about half of the planned weight, and then the second plating tank 2
Contrary to the case in the first plating tank 1, the tape-shaped three-dimensional network structure 3 is adhered to the cathode feeding roll 5 in the second plating tank with the surface B as the outside and the surface A as the inside, and the remaining surface on the surface B remains. The weight is plated.

According to such a plating method, the electrodeposition amount of the metal by (A) plating is symmetrical with respect to the thickness center,
Since the surface sides have the same strength, (1) there is no difference in strength between the A surface and the B surface, and cracks due to bending do not occur.

(2) Warping or cracking due to internal stress during heating and cooling does not occur.

(B) The amount of metal adhered by the outer peripheral plating in the drum plating is larger than that in the inner peripheral side, but the A side is the first drum and the B side is the second drum.
Since the drums have outer circumferences, respectively, and the amount of electrodeposition is large and the mechanical strength is large, the strength of both the A side and the B side is larger than that of the inside, and there is an effect that surface scratches are likely to occur. Of.

Thus, the distribution of the plating electrodeposition amount in the thickness direction of the tape-shaped three-dimensional network structure uniformly plated is as shown in FIG. 3, and after the second plating, a substantially uniform plating thickness is obtained on both sides of A and B. In the conventional method shown in FIG. 4, a metal three-dimensional net-like structure having an excellent effect can be obtained as compared with the unevenness of the plating thickness after the pre-plating as it appears even in the product after the main plating. Was recognized.

[Brief description of drawings]

FIG. 1 is a process explanatory diagram for carrying out the method of the present invention, FIG. 2 is an explanatory diagram of a conventional method, FIG. 3 is a diagram showing a plating electrodeposition distribution by the method of the present invention, and FIG. 4 is a conventional method. 5 is a diagram showing a distribution of plating electrodeposition amount according to FIG. 1 ... 1st plating tank, 2 ... 2nd plating tank 3 ... Tape-shaped three-dimensional net-like structure 4, 5 ... Cathode power supply roll

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tetsuya Nishi 10-2, Nagure Noe, Shinminato City, Toyama Prefecture, Sumitomo Electric Industries, Ltd., Toyama Electronic Materials Factory (56) References JP 60-30753 (JP, B2) )

Claims (1)

[Claims] 1. A method for continuously electroplating a tape-shaped three-dimensional network structure having electrical conductivity, the surface of a cathode feeding roll rotating in a plating bath, and the tape-shaped three-dimensional network structure. When feeding power to the three-dimensional network structure by moving while closely contacting with one surface of the three-dimensional network structure, a plurality of cathode power supply rolls are provided, at least one of which is one of the tape-shaped three-dimensional network structure. First-stage plating is performed, in which the tape-like three-dimensional net-like structure is in close contact with the other surface of the tape-like three-dimensional network structure by performing the first-stage plating in which one half of the total plating amount is electroplated. And a second stage plating in which the remaining half of the plating amount is electroplated.