JPH01184104A - Dicing of wafer - Google Patents

Abstract

PURPOSE:To make it possible to make a groove without crack and with high accuracy, by cutting a wafer surface while a rotating blade for cutting the wafer surface is rotated and a vibration is given by means of a ultrasonic wave and thereby carrying out a treatment depressing resistance and internal stress. CONSTITUTION:A spindle 3 on which a blade 1 is attached is rotated with high speed and a vibration is added to a ultrasonic vibrator 11 by means of a ultrasonic generator 12 to generate a ultrasonic vibration on the blade 1. Under this condition, a chack 5 on which a wafer 2 is fixed is horizontally moved by means of a horizontally forwarding mechanism 7 and a relative movement between the blade 1 and the wafer to form a groove on the surface of the wafer 2. Grooves are formed corresponding to a pattern 10 by pitch- forwarding the blade 1 by means of a pitch forwarding mechanism 4. As cutting is carried out like this while a ultrasonic vibration is given to a shaft on which the rotating blade is fixed, when the wafer is cut, a treatment depressing drag and internal stress can be done and a groove-making without crack and with high accuracy can be done.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a dicing method for dicing a wafer.

[Conventional technology]

The conventional method will be explained with reference to Fig. 2. In the figure, (1) shows the surface of a plate-like object (hereinafter referred to as wafer) (2) patterned (
(3) is the spindle μ to which this rotary blade (1) is attached, (4) is the pitch at which this spindle tv (3) is fed according to the pattern of the wafer (2). The feeding mechanism (5) is the wafer (2
), (6) is an indexing mechanism that rotates and indexes this chuck (5) in a horizontal plane, and (7) is a feed mechanism that feeds the rotary blade (1) tangentially in the horizontal direction. Note that the spindle (3) is moved up and down by a not-shown up-and-down feed mechanism. (8) is a table, and (9) is a spindle p holder for composing spindle (3).

Next, the operation will be explained. Place the wafer (
2) is attached, and the pitch index according to the pattern (lO) of the wafer (2) is spun/l using the pitch feeding mechanism (4).
/ (3), and spindo /L' (3) is given high-speed rotational motion to rotate the blade (1) attached to spindo /L/ (3). While rotating the spindle (3), when the table (8) supporting the chuck (5) with the wafer (2) attached thereto is fed horizontally through the mechanism (7), the wafer (2) is moved by the blade (1). ) is cut to form a groove. The spindle (3) is pitch-feeded by the pitch-feeding mechanism (4) until a single groove is cut, and the cutting is repeated. When grooving is completed in one direction of the wafer (2), the indexing mechanism (6) rotates the chuck (5) by 90 degrees to perform grooving on the other side in the same manner, completing the dicing process. let

c) Problems to be Solved by the Invention] The conventional method is as described above, and when processing a wafer made of brittle material, cracks are likely to occur in the groove portion.
There was a problem in that it caused many product defects.

This invention was made to solve the above-mentioned problems, and an object thereof is to provide a wafer dicing method that can eliminate cracks in the groove portion.

[Means to solve the problem]

The wafer dicing method according to the present invention involves cutting the surface of the wafer by applying vibrations using ultrasonic waves while rotating a rotary blade that cuts the surface of the wafer.

C Effect 1 In the wafer dicing method of the present invention, when ultrasonic vibration is applied to the rotating blade, processing efficiency is improved even for hard and brittle work materials, and the resistance and temperature generated during cutting can be suppressed.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, (11) is an ultrasonic vibrator that applies ultrasonic vibration to the blade (1), and (12) is an ultrasonic generator.

Next, the operation will be explained. The spindle (3) to which the blade (1) is attached is rotated at high speed, and the ultrasonic transducer (u) K I! is sent from the ultrasonic generator (12) IC.
motion is applied to generate ultrasonic vibrations in the blade (1).

In this state, the chuck (5) with the wafer (2) attached is moved horizontally by the horizontal feed mechanism (7)K, and the blade (1)
) to cause a relative movement between the wafer (2) surface KI
Form two grooves. And the blade (1) is pitch-fed by the pitch feeding mechanism (4) to form the pattern (10).
Cut grooves are formed at positions according to iC.

[Effects of the Invention] As described above, according to this IJK, ultrasonic vibration is applied to the rotary blade mounting shaft for cutting, so when cutting a wafer, it is possible to perform processing with reduced resistance and internal stress, thereby preventing cracks. This has the effect of providing highly accurate groove machining without any scratches.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a dicing method according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional method. In the figure, (1) is a blade, (2) is a wafer, (11) is an ultrasonic vibration t, and (12) is an ultrasonic generator. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] A method for dicing a wafer, wherein the wafer is diced by relatively moving a rotating blade along a dicing line of the wafer, characterized in that dicing is performed while generating ultrasonic vibrations in the rotating blade.