JPH05116139A - Method for cutting hard fragile material by outer peripheral edge - Google Patents
Method for cutting hard fragile material by outer peripheral edgeInfo
- Publication number
- JPH05116139A JPH05116139A JP20980291A JP20980291A JPH05116139A JP H05116139 A JPH05116139 A JP H05116139A JP 20980291 A JP20980291 A JP 20980291A JP 20980291 A JP20980291 A JP 20980291A JP H05116139 A JPH05116139 A JP H05116139A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- work
- blade
- vibration
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、単結晶インゴットや
セラミックス等の硬質脆性材料をディスク状ブレードの
外周刃で切断する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a hard and brittle material such as a single crystal ingot or ceramics with an outer peripheral edge of a disk-shaped blade.
【0002】[0002]
【従来の技術】硬質脆性材料の切断方法として回転する
円盤状ブレードの外周刃で切断する方法と中空円盤状ブ
レードの内周刃で切断する方法が知られている。外周刃
切断方法は、切断反力によりブレードが撓んで切り曲が
りが起こり易く、刃厚を厚くしなければならないので材
料損失が大きく、切断精度が低いという欠点がある。そ
のため現在は、材料損失が少なく精度の高い内周刃切断
方法が主流で、外周刃切断方法は、インゴッドの両端の
切断やブロック切断などの粗加工にしか使用されていな
い。2. Description of the Related Art As a method of cutting a hard brittle material, a method of cutting with a peripheral blade of a rotating disc-shaped blade and a method of cutting with an inner peripheral blade of a hollow disc-shaped blade are known. The peripheral blade cutting method has drawbacks in that the blade is easily bent due to a cutting reaction force to cause bending, and the blade thickness must be increased, resulting in large material loss and low cutting accuracy. Therefore, at present, the inner peripheral blade cutting method with low material loss and high accuracy is mainly used, and the outer peripheral blade cutting method is used only for roughing such as cutting both ends of the ingot and block cutting.
【0003】[0003]
【発明が解決しようとする課題】しかし、外周刃切断方
法は、加工装置の構造が簡単であり、操作性も良く、価
格が安いという特徴を持っている。従って刃厚を薄く、
切断精度を高めることができれば、硬質脆性材料の切断
に適した外周刃切断装置を提供することができる。However, the peripheral blade cutting method is characterized in that the structure of the processing device is simple, the operability is good, and the price is low. Therefore, reduce the blade thickness,
If the cutting accuracy can be improved, it is possible to provide a peripheral blade cutting device suitable for cutting a hard brittle material.
【0004】本発明は、切断時にブレードにかかる切断
抵抗を低くして加工精度を高め、刃先の偏磨耗による切
り曲がりも防止できる外周刃切断方法を提供しようとす
るものである。An object of the present invention is to provide a peripheral blade cutting method capable of reducing the cutting resistance applied to the blade at the time of cutting to improve the processing accuracy and preventing the bending due to the uneven wear of the cutting edge.
【0005】[0005]
【課題を解決するための手段】この発明のワークの切断
方法は、定位置で回転する可撓性を備えた円盤状ブレー
ド10の外周にワーク9をその切断方向と同方向ないし
直交する方向に低周波領域の振動を与えながら送って切
断することを特徴とするものである。According to the method for cutting a work of the present invention, a work 9 is provided on the outer periphery of a disk-shaped blade 10 having flexibility that rotates at a fixed position in the same direction as or orthogonal to the cutting direction. It is characterized by sending and cutting while applying vibration in the low frequency region.
【0006】[0006]
【作用】従来の外周刃切断方法では、切断抵抗が大きい
ので、外周刃の刃厚を厚くして抵抗力を持たせていた
が、外周刃が偏摩耗を起こし、ワークを直線的に切断す
ることができず、切断面にうねりが起き、加工精度が低
下していた。In the conventional outer peripheral blade cutting method, since the cutting resistance is large, the outer peripheral blade is made thicker so as to have resistance, but the outer peripheral blade causes uneven wear and cuts the work linearly. It was not possible to do this, and waviness occurred on the cut surface, and the processing accuracy was reduced.
【0007】本発明の方法では、ワークの振動により、
外周刃とワークとの間に切り込みと分離とが交互に繰り
返され、切断抵抗が減少する。またワークに振動を加え
ることにより、外周刃に偏磨耗が生じたときにも切り曲
がりを生ずることがなく、精度の高い直線切断が可能に
なることが実験結果により判明した。In the method of the present invention, the vibration of the work causes
Cutting and separation are alternately repeated between the outer peripheral blade and the work, and the cutting resistance is reduced. Further, it has been proved by the experimental results that by applying vibration to the work, even if the outer peripheral blade is unevenly worn, the bending does not occur and a highly accurate linear cutting can be performed.
【0008】切断時に作用させる振動数が高くなればな
るほど、また振幅が大きければ大きいほど、切断抵抗の
減少量は大きい。なお超音波領域では切粉が飛んで種々
の弊害が出るので、低周波領域内に止めておくのが良
い。The higher the frequency of vibration applied during cutting and the larger the amplitude, the greater the reduction in cutting resistance. It should be noted that the chips are blown in the ultrasonic range to cause various problems, so it is preferable to keep the chips in the low frequency range.
【0009】なお、リジッドな砥石やバイトにおける切
削加工において、切削抵抗を低くする方法として振動切
削法が知られている。しかし、ダイヤモンドブレードの
ような可撓性のある切削工具に対して振動切削法を用い
た例は知られておらず、またこれによってブレードが偏
磨耗したときにも加工面のうねりが少なくなるというこ
とは、リジッドな工具を用いた振動切削からは予測でき
ないことである。A vibration cutting method is known as a method for reducing the cutting resistance in the cutting process using a rigid grindstone or a cutting tool. However, there is no known example of using a vibration cutting method for a flexible cutting tool such as a diamond blade, and this also reduces waviness of the machined surface even when the blade is unevenly worn. That is not predictable from vibration cutting with rigid tools.
【0010】[0010]
【実施例】図6ないし図8は、本発明の実施に適した外
周刃切断装置を示したものである。図中、1は基台、2
は基台1の上面に固着された固定台、3は固定台2に図
6の前後方向に摺動可能に設けられた第1移動台、4は
第1移動台3の位置を設定する第1ハンドル、5は第1
移動台3の上に図6の左右方向に摺動可能に設けられた
第2移動台、6は第2移動台5の位置を設定する第2ハ
ンドル、7は第2移動台5に送りを与えるモータ、8は
第2移動台5の上に搭載された加振装置、9は加振装置
8の上に固定されたワーク、10はワーク9の上方に回
転自在に設けられた切断ブレード、11は切断ブレード
の主軸、12は加振装置8、ワーク9および切断ブレー
ド10を被うように第2移動台5に装着された防水カバ
ー、13は図示しない歯車列を介して主軸11を駆動す
るモータ、14は主軸11およびモータ13を搭載する
昇降枠、15は昇降枠の位置を設定する第3ハンドル、
16は切断ブレード10に加工液を供給する加工液ノズ
ル、17は加工液ノズル16に加工液を送る給水ポン
プ、18は加工液を貯蔵しているタンク、19は加振装
置のコントローラ、20は操作盤である。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 6 to 8 show an outer peripheral blade cutting device suitable for carrying out the present invention. In the figure, 1 is a base, 2
Is a fixed base fixed to the upper surface of the base 1, 3 is a first movable base provided on the fixed base 2 so as to be slidable in the front-back direction of FIG. 6, and 4 is a first movable base for setting the position of the first movable base 3. 1 handle, 5 is the first
A second movable base provided on the movable base 3 so as to be slidable in the left-right direction in FIG. 6, 6 is a second handle for setting the position of the second movable base 5, and 7 is a feed to the second movable base 5. A motor for giving, 8 is a vibrating device mounted on the second moving table 5, 9 is a work fixed on the vibrating device 8, 10 is a cutting blade rotatably provided above the work 9, Reference numeral 11 is a spindle of a cutting blade, 12 is a waterproof cover mounted on the second moving table 5 so as to cover the vibrating device 8, the work 9 and the cutting blade 10, and 13 drives the spindle 11 via a gear train (not shown). Motor, 14 is an elevating frame on which the spindle 11 and the motor 13 are mounted, 15 is a third handle for setting the position of the elevating frame,
16 is a machining fluid nozzle that supplies the machining fluid to the cutting blade 10, 17 is a water supply pump that delivers the machining fluid to the machining fluid nozzle 16, 18 is a tank that stores the machining fluid, 19 is a controller of the vibration device, and 20 is It is an operation panel.
【0011】加振装置の詳細は図8に示されている。ベ
ース23上に立設された支持枠24に図上左右方向に摺
動自在に振動台25が装着されており、振動台25の上
面にワーク9を固定する加工台26が固定されている。
振動台25の左端はモータ27で駆動されるエキセンホ
イール28にクランクロッド32を介して連結されてお
り、その右端は位相反転器29を介してバランス錘30
に連結されている。位相反転器29は、垂直方向の支点
ピン33で中心を揺動自在に支持された左右等長の揺動
レバーからなり、その両端に連結リンク34、35で振
動台25及びバランス錘30を連結している。Details of the vibration device are shown in FIG. A vibrating table 25 is mounted on a support frame 24 erected on the base 23 so as to be slidable in the left-right direction in the figure, and a processing table 26 for fixing the work 9 is fixed to the upper surface of the vibrating table 25.
The left end of the vibrating table 25 is connected to an eccentric wheel 28 driven by a motor 27 via a crank rod 32, and its right end is connected to a balance weight 30 via a phase inverter 29.
Is linked to. The phase inverter 29 is composed of a rocking lever of equal length on the left and right, which is supported by a vertical fulcrum pin 33 so as to be rockable about its center, and the vibrating table 25 and the balance weight 30 are connected to both ends thereof by connecting links 34 and 35. is doing.
【0012】モータ27の回転力は、タイミングベルト
31を介してエキセンホイール28に伝えられ、偏心し
たセンタホイールによって近似的な調和振動となって振
動台25に伝達され、これによりワーク9に振動が与え
られる。振動台25の振動は、位相反転器29で位相を
180度ずらしてバランス錘30を振動させ、これによ
り振動が他の部材に与える悪影響を防止している。The rotational force of the motor 27 is transmitted to the eccentric wheel 28 via the timing belt 31, and the eccentric center wheel produces an approximate harmonic vibration, which is transmitted to the vibrating table 25. Given. The phase shifter 29 shifts the phase of the vibration of the vibrating table 25 by 180 degrees to vibrate the balance weight 30, thereby preventing the vibration from adversely affecting other members.
【0013】次に上記装置を用いて本発明方法を詳説す
る。Next, the method of the present invention will be described in detail by using the above apparatus.
【0014】ワーク9として50×60×10mmのソ
ーダガラスを、切断ブレード10として直径125×1
mm、SD#200のダイヤモンドブレードを用い、ダ
イヤモンドブレードの周速を1915mm/minと
し、ソーダガラスに20〜80mm/minの送り速度
を与えて切り込み量11mmまで切断した。ソーダガラ
スに与えられた振動数は0〜28Hzで、振幅は0〜
0.6mmである。A soda glass of 50 × 60 × 10 mm is used as the work 9 and a diameter of 125 × 1 is used as the cutting blade 10.
mm, SD # 200 diamond blade was used, the peripheral speed of the diamond blade was set to 1915 mm / min, the soda glass was fed at a feed rate of 20 to 80 mm / min, and cut to a cut amount of 11 mm. The frequency given to soda glass is 0 to 28 Hz, and the amplitude is 0 to
It is 0.6 mm.
【0015】図1ないし図5にその結果を示す。The results are shown in FIGS. 1 to 5.
【0016】図1にワークに与えた振動数と主軸駆動モ
ータ13に流れる電流値の関係を示す。同図に示すよう
に、振動数が高くなるにつれて電流値が下がり、切断抵
抗が小さくなる。振動を付加するとダイヤモンドブレー
ドのワークに対する切り込みと分離が交互に起こり、振
動数を高くするとその周期が早くなり、振動1サイクル
当たりの切り込み量が少なくなるため、切断抵抗が小さ
くなるものと考えられる。FIG. 1 shows the relationship between the frequency applied to the work and the value of the current flowing through the spindle drive motor 13. As shown in the figure, as the frequency increases, the current value decreases and the cutting resistance decreases. It is considered that when vibration is applied, cutting and separation of the diamond blade with respect to the work alternately occur, and when the frequency is increased, the cycle is shortened and the cutting amount per one cycle of vibration is reduced, so that the cutting resistance is reduced.
【0017】図2は振幅と電流値の関係を示す。同図に
示すように振幅を大きくするにつれて電流値が下がって
いる。これは振幅が大きくなるとダイヤモンドブレード
の被加工物に対する振動1サイクル当たりの分離量が大
となり、1回の切削時間が短くなるためと考えられる。
またダイヤモンドブレードが後退したとき切り屑の排出
がしやすくなり、研削液も侵入し易くなるので切断抵抗
も低くなると考えられる。FIG. 2 shows the relationship between the amplitude and the current value. As shown in the figure, the current value decreases as the amplitude increases. It is considered that this is because when the amplitude becomes large, the amount of separation of the diamond blade per one cycle of vibration with respect to the workpiece becomes large and the cutting time for one cutting becomes short.
Further, it is considered that when the diamond blade retracts, chips are easily discharged and a grinding liquid is easily introduced, and thus cutting resistance is reduced.
【0018】次にブレードの刃先の磨耗と切断抵抗およ
びうねりとの関係を調べるために、新しいブレードと刃
先が偏磨耗したブレードとを用いて試験を行った。図9
は加工溝の先端部の断面を示した図で、(a)は新しい
ブレードを用いた場合、(b)は偏磨耗したブレードを
用いた場合の溝形状であり、この溝形状が試験に用いた
ブレードの刃先の断面形状を示している。Next, in order to investigate the relationship between the wear of the cutting edge of the blade and the cutting resistance and waviness, a test was carried out using a new blade and a blade having a partially worn cutting edge. Figure 9
Is a diagram showing the cross section of the tip of the processed groove, (a) shows the groove shape when a new blade is used, and (b) shows the groove shape when an unevenly worn blade is used. This groove shape is used for the test. The cross-sectional shape of the blade edge of the existing blade is shown.
【0019】図3は偏摩耗したブレードでの振動数と電
流値の関係を示した図である。同図に示すように、無振
動切断時にはブレード送り速度が80mm/minの時
0.22Aの電流値を示しているが、振動を付加すると
最大0.10Aまで減少する。他の送り速度の場合でも
同様に最大50%程度まで電流値が減少した。FIG. 3 is a diagram showing the relationship between the frequency and the current value of a blade that is unevenly worn. As shown in the figure, the current value of 0.22 A is shown when the blade feed speed is 80 mm / min during the non-vibration cutting, but it decreases to a maximum of 0.10 A when vibration is added. Similarly, at other feed rates, the current value decreased to about 50% at the maximum.
【0020】図4に振動数と表面うねりの関係を示す。
同図に示すように無振動切断時の新しいブレードでは表
面うねりが5.7mmであったのに対し、偏摩耗したブ
レードでは横方向へのブレード変形量が大きくなるため
に27μmの表面うねりを生じた。また、新しいブレー
ドに振動を付加すると表面うねりは若干減少する傾向が
得られるのみであった。これに対して偏摩耗したブレー
ドに振動を付加した場合には、14μm近くまで表面う
ねりが減少した。FIG. 4 shows the relationship between frequency and surface waviness.
As shown in the figure, the surface waviness was 5.7 mm with the new blade at the time of non-vibration cutting, while the unevenly worn blade had a large amount of blade deformation in the lateral direction, resulting in a surface waviness of 27 μm. It was Moreover, when vibration was applied to the new blade, the surface waviness tended to slightly decrease. On the other hand, when vibration was applied to the blade that was unevenly worn, the surface waviness was reduced to nearly 14 μm.
【0021】図5は振動数と加工溝幅の関係を示した図
である。新しいブレード、偏摩耗したブレード共、ワー
クに振動を与えることによって加工溝幅が小さくなって
いる。新しいブレードでは振動を与えるとカーフロスは
若干減少するのに対し、偏摩耗したブレードでは、無振
動切断時にカーフロスは大きくなるが振動を与えるとか
なり減少し、振動の効果が明確に表れる。これは、振動
数が高くなると、図3に示したように、切断抵抗が少な
くなり、切断時にブレードの外周に作用する荷重が少な
くなるため、ブレードの偏摩耗による横方向への撓みが
少なくなるためだと考えられる。FIG. 5 is a diagram showing the relationship between the frequency and the width of the processed groove. Both new blades and partially worn blades reduce the groove width by giving vibration to the work. With the new blade, the kerf loss is slightly reduced when the vibration is applied, whereas with the unevenly worn blade, the kerf loss is increased at the time of vibration-free cutting, but when the vibration is applied, the kerf loss is considerably reduced, and the effect of the vibration is clearly shown. This is because, as the frequency increases, the cutting resistance decreases as shown in FIG. 3, and the load acting on the outer circumference of the blade during cutting decreases, so the lateral bending due to uneven wear of the blade decreases. It is thought to be because of it.
【0022】[0022]
【発明の効果】以上のように、本発明によれば、外周刃
にかかる切断抵抗を減少させることができ、切断時の溝
幅も小さくなり、切断端面における表面うねりを減少さ
せることができる。従って、同じ加工精度でよいのであ
れば、より薄いブレードを用いて加工を行うことも可能
になる。特に偏磨耗したブレードを用いた場合、切断抵
抗がおよそ半分程度に減少すると共に、切断面の表面う
ねりを大幅に減少させることができ、切断加工の加工精
度を大きく向上させることができる。As described above, according to the present invention, the cutting resistance applied to the outer peripheral blade can be reduced, the groove width at the time of cutting can be reduced, and the surface waviness at the cutting end face can be reduced. Therefore, if the same processing accuracy is required, it is possible to perform processing using a thinner blade. In particular, when a blade that is unevenly worn is used, the cutting resistance can be reduced to about half and the surface waviness of the cut surface can be significantly reduced, so that the cutting accuracy of the cutting process can be greatly improved.
【図1】振動数と主軸モータの消費電流との関係を示す
図FIG. 1 is a diagram showing a relationship between a frequency and a current consumption of a spindle motor.
【図2】振幅と電流値との関係を示す図FIG. 2 is a diagram showing a relationship between amplitude and current value.
【図3】偏磨耗したブレートでの振動数と電流値の関係
を示す図FIG. 3 is a diagram showing a relationship between a frequency and a current value in a plate with uneven wear.
【図4】振動数と表面うねりの関係を示す図FIG. 4 is a diagram showing a relationship between frequency and surface waviness.
【図5】振動数と加工溝幅の関係を示す図FIG. 5 is a diagram showing a relationship between a frequency and a machining groove width.
【図6】外周刃切断装置の正面図FIG. 6 is a front view of a peripheral blade cutting device.
【図7】外周刃切断装置の側面図FIG. 7 is a side view of a peripheral blade cutting device.
【図8】加振装置の斜視図FIG. 8 is a perspective view of the vibration device.
【図9】加工溝の先端部の拡大断面図FIG. 9 is an enlarged cross-sectional view of the tip of the processed groove.
9 ワーク 10 切断ブレード 9 Work 10 Cutting blade
───────────────────────────────────────────────────── フロントページの続き (72)発明者 北川 武彦 石川県石川郡野々市町扇が丘7の1 金沢 工業大学内 (72)発明者 内田 貴久 石川県石川郡野々市町扇が丘7の1 金沢 工業大学内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Takehiko Kitagawa, 1-7 Ogigaoka, Nonoichi-cho, Ishikawa-gun Ishikawa Prefecture, Kanazawa Institute of Technology (72) Takahisa Uchida 1-7, Ogaigaoka, Nonoichi-cho, Ishikawa-gun, Kanazawa Institute of Technology
Claims (1)
ブレード(10)の外周にワーク(9) をその切断方向と同方
向ないし直交する方向に低周波領域の振動を与えながら
送って切断することを特徴とする、外周刃による硬質脆
性材料の切断方法。1. A work (9) is fed to the outer periphery of a flexible disk-shaped blade (10) that rotates in a fixed position while vibrating in a low-frequency region in the same direction or a direction orthogonal to the cutting direction. A method of cutting a hard brittle material with a peripheral blade, which comprises cutting with a peripheral edge.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3209802A JPH0818328B2 (en) | 1991-07-26 | 1991-07-26 | Cutting method of hard brittle material with peripheral blade |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3209802A JPH0818328B2 (en) | 1991-07-26 | 1991-07-26 | Cutting method of hard brittle material with peripheral blade |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05116139A true JPH05116139A (en) | 1993-05-14 |
JPH0818328B2 JPH0818328B2 (en) | 1996-02-28 |
Family
ID=16578841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3209802A Expired - Fee Related JPH0818328B2 (en) | 1991-07-26 | 1991-07-26 | Cutting method of hard brittle material with peripheral blade |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0818328B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000046630A1 (en) * | 1999-02-04 | 2000-08-10 | Matsushita Electric Industrial Co., Ltd. | Multichannel optical modulation element |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01184104A (en) * | 1988-01-18 | 1989-07-21 | Mitsubishi Electric Corp | Dicing of wafer |
JPH02133307U (en) * | 1989-04-11 | 1990-11-06 |
-
1991
- 1991-07-26 JP JP3209802A patent/JPH0818328B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01184104A (en) * | 1988-01-18 | 1989-07-21 | Mitsubishi Electric Corp | Dicing of wafer |
JPH02133307U (en) * | 1989-04-11 | 1990-11-06 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000046630A1 (en) * | 1999-02-04 | 2000-08-10 | Matsushita Electric Industrial Co., Ltd. | Multichannel optical modulation element |
JP2000221460A (en) * | 1999-02-04 | 2000-08-11 | Matsushita Electric Ind Co Ltd | Multichannel optical modulation element |
US6449083B1 (en) | 1999-02-04 | 2002-09-10 | Matsushita Electric Industrial Co., Ltd. | Multi-channel optical modulator |
Also Published As
Publication number | Publication date |
---|---|
JPH0818328B2 (en) | 1996-02-28 |
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