JPH01180675U - - Google Patents
Info
- Publication number
- JPH01180675U JPH01180675U JP7241388U JP7241388U JPH01180675U JP H01180675 U JPH01180675 U JP H01180675U JP 7241388 U JP7241388 U JP 7241388U JP 7241388 U JP7241388 U JP 7241388U JP H01180675 U JPH01180675 U JP H01180675U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- testing
- chips
- cutting
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7241388U JPH01180675U (en, 2012) | 1988-05-31 | 1988-05-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7241388U JPH01180675U (en, 2012) | 1988-05-31 | 1988-05-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01180675U true JPH01180675U (en, 2012) | 1989-12-26 |
Family
ID=31297580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7241388U Pending JPH01180675U (en, 2012) | 1988-05-31 | 1988-05-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01180675U (en, 2012) |
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1988
- 1988-05-31 JP JP7241388U patent/JPH01180675U/ja active Pending