JPH01179770A - 金属とセラミックスとの接合方法 - Google Patents

金属とセラミックスとの接合方法

Info

Publication number
JPH01179770A
JPH01179770A JP313788A JP313788A JPH01179770A JP H01179770 A JPH01179770 A JP H01179770A JP 313788 A JP313788 A JP 313788A JP 313788 A JP313788 A JP 313788A JP H01179770 A JPH01179770 A JP H01179770A
Authority
JP
Japan
Prior art keywords
metal
ceramic
temp
fluctuating pressure
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP313788A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0471865B2 (OSRAM
Inventor
Kazunori Sasaki
笹木　一憲
Takeshi Miura
毅 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HIROSHIMA DENKI GAKUEN
Japan Steel Works Ltd
Original Assignee
HIROSHIMA DENKI GAKUEN
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HIROSHIMA DENKI GAKUEN, Japan Steel Works Ltd filed Critical HIROSHIMA DENKI GAKUEN
Priority to JP313788A priority Critical patent/JPH01179770A/ja
Publication of JPH01179770A publication Critical patent/JPH01179770A/ja
Publication of JPH0471865B2 publication Critical patent/JPH0471865B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP313788A 1988-01-12 1988-01-12 金属とセラミックスとの接合方法 Granted JPH01179770A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP313788A JPH01179770A (ja) 1988-01-12 1988-01-12 金属とセラミックスとの接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP313788A JPH01179770A (ja) 1988-01-12 1988-01-12 金属とセラミックスとの接合方法

Publications (2)

Publication Number Publication Date
JPH01179770A true JPH01179770A (ja) 1989-07-17
JPH0471865B2 JPH0471865B2 (OSRAM) 1992-11-16

Family

ID=11548964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP313788A Granted JPH01179770A (ja) 1988-01-12 1988-01-12 金属とセラミックスとの接合方法

Country Status (1)

Country Link
JP (1) JPH01179770A (OSRAM)

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100893871B1 (ko) * 2004-10-13 2009-04-20 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판의 스크라이브 방법 및 스크라이브 장치및 취성재료 기판의 절단 시스템
JP2015059080A (ja) * 2013-09-20 2015-03-30 株式会社デンソー 接合体の製造方法
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
US10144093B2 (en) 2013-12-17 2018-12-04 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10173916B2 (en) 2013-12-17 2019-01-08 Corning Incorporated Edge chamfering by mechanically processing laser cut glass
US10179748B2 (en) 2013-12-17 2019-01-15 Corning Incorporated Laser processing of sapphire substrate and related applications
US10233112B2 (en) 2013-12-17 2019-03-19 Corning Incorporated Laser processing of slots and holes
US10252931B2 (en) 2015-01-12 2019-04-09 Corning Incorporated Laser cutting of thermally tempered substrates
US10280108B2 (en) 2013-03-21 2019-05-07 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
US10525657B2 (en) 2015-03-27 2020-01-07 Corning Incorporated Gas permeable window and method of fabricating the same
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US11028003B2 (en) 2013-01-15 2021-06-08 Corning Laser Technologies GmbH Method and device for laser-based machining of flat substrates
US11062986B2 (en) 2017-05-25 2021-07-13 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
US11111170B2 (en) 2016-05-06 2021-09-07 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
US11697178B2 (en) 2014-07-08 2023-07-11 Corning Incorporated Methods and apparatuses for laser processing materials
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100893871B1 (ko) * 2004-10-13 2009-04-20 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판의 스크라이브 방법 및 스크라이브 장치및 취성재료 기판의 절단 시스템
US11345625B2 (en) 2013-01-15 2022-05-31 Corning Laser Technologies GmbH Method and device for the laser-based machining of sheet-like substrates
US11028003B2 (en) 2013-01-15 2021-06-08 Corning Laser Technologies GmbH Method and device for laser-based machining of flat substrates
US11713271B2 (en) 2013-03-21 2023-08-01 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
US10280108B2 (en) 2013-03-21 2019-05-07 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
JP2015059080A (ja) * 2013-09-20 2015-03-30 株式会社デンソー 接合体の製造方法
US10173916B2 (en) 2013-12-17 2019-01-08 Corning Incorporated Edge chamfering by mechanically processing laser cut glass
US10233112B2 (en) 2013-12-17 2019-03-19 Corning Incorporated Laser processing of slots and holes
US10179748B2 (en) 2013-12-17 2019-01-15 Corning Incorporated Laser processing of sapphire substrate and related applications
US10144093B2 (en) 2013-12-17 2018-12-04 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11148225B2 (en) 2013-12-17 2021-10-19 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US10597321B2 (en) 2013-12-17 2020-03-24 Corning Incorporated Edge chamfering methods
US10611668B2 (en) 2013-12-17 2020-04-07 Corning Incorporated Laser cut composite glass article and method of cutting
US10183885B2 (en) 2013-12-17 2019-01-22 Corning Incorporated Laser cut composite glass article and method of cutting
US11697178B2 (en) 2014-07-08 2023-07-11 Corning Incorporated Methods and apparatuses for laser processing materials
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
US10252931B2 (en) 2015-01-12 2019-04-09 Corning Incorporated Laser cutting of thermally tempered substrates
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
US10525657B2 (en) 2015-03-27 2020-01-07 Corning Incorporated Gas permeable window and method of fabricating the same
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
US11111170B2 (en) 2016-05-06 2021-09-07 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes
US11130701B2 (en) 2016-09-30 2021-09-28 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11062986B2 (en) 2017-05-25 2021-07-13 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11972993B2 (en) 2017-05-25 2024-04-30 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness

Also Published As

Publication number Publication date
JPH0471865B2 (OSRAM) 1992-11-16

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