JPH01179352A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To improve an electrical characteristic by a method wherein a pellet accommodating window part and a trimming-element accommodating window part are installed independently of each other in a package body and a pellet and a trimming element are accommodated in the respective accommodating window parts. CONSTITUTION:Two recessed parts are formed in a ceramic package body 1; one is constituted as a pellet accommodating window part 2 and the other as a trimming-element accommodating window part 3. A pellet 11 is mounted inside the pellet accommodating window part 2 and is connected to inner leads 4 arranged at the periphery of this window part 2 by using bonding wires 5. Trimming elements 12 which have been connected to individual electrodes 6 are mounted inside the trimming-element accommodating window 3. Through this constitution, the pellet 11 is accommodated inside the pellet accommodating window part 2 and is connected electrically; the pellet accommodating window part 2 is then sealed by using a cap; after that, the trimming elements 12 which have been accommodated inside the trimming-element accommodating window part 3 are trimmed. By this setup, a device can be made small-sized; a trimming operation can be executed properly; an electrical characteristic can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit device, and particularly to a semiconductor integrated circuit device with an improved package.

[Conventional technology]

The package in a conventional semiconductor integrated circuit device is
As shown in the plan view and front view of FIGS.
Bonding wire 2
It is electrically connected by 5. This pellet storage window 22 is sealed with a cap (not shown).

On the other hand, in this type of semiconductor integrated circuit device, if it is necessary to trim the resistance value and capacitance value connected to the semiconductor integrated circuit device due to circuit configuration requirements, external parts are used to trim the capacitance value. It was constructed on a printed circuit board on which a semiconductor integrated circuit device was mounted.

[Problem that the invention seeks to solve]

The conventional semiconductor integrated circuit device described above has a resistance value.

When trimming the capacitance value, etc.,
Since it is necessary to use external parts to configure the semiconductor integrated circuit device on the printed circuit board, the area of the printed circuit board becomes large. It is difficult to perform trimming while the capacitor is in the same condition, and it is difficult to improve the characteristics.Furthermore, if an arbitrary temperature coefficient is required for the resistance value and the capacitance value of the capacitor, it is difficult to construct it on a pellet. There is still the problem that it must be constructed on a printed circuit board.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor integrated circuit device in which resistors, capacitors, etc. can be integrated into the device, thereby improving characteristics and downsizing the device.

[Means for solving problems]

In the semiconductor integrated circuit device of the present invention, a pellet accommodating window and a trimming element accommodating window are independently provided in the package body, a pellet is mounted in the pellet accommodating window, electrical connection is made to an external lead, and trimming is performed. Trimmable elements such as resistors and capacitors are mounted inside the element housing window and are electrically connected to the pellet and external leads, respectively.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

Figure 1 shows an example in which the present invention is applied to a ceramic flat package.
b) is a front view. In the figure, a package body 1 made of ceramic has two recesses, one of which is a pellet storage window 2. The other side is configured as a trimming element accommodating window 3.

A pellet 11 is mounted inside the pellet housing window 2 and connected to an internal lead 4 disposed around the window 2 by a bonding wire 5.

Furthermore, trimming elements 12 such as resistors and capacitors each connected to the electrodes 6 are mounted in the trimming element accommodating portion 3 . These trimming elements 12 are constructed, for example, on the ceramic body 1 by thick film printing technology or thin film technology.

Note that the internal lead 4 is electrically connected to an external lead 7 protruding from the side surface of the package body 1, or to an electrode 6 of the trimming element accommodating portion 3. Further, this electrode 6 is also electrically connected to an external lead 7.

According to this configuration, the pellets 1 are stored in the pellet storage window 2.
After accommodating the pellets 1 and making electrical connections, the pellet accommodating window 2 is sealed with a cap (not shown). After that, the trimming element 12 accommodated in the trimming element accommodation window 3
Perform trimming.

Since this trimming work is performed after the pellet 11 is assembled, the functional trimming can be performed while the pellet 11 is electrically operated. Further, during the trimming operation, since the pellet storage window 2 is sealed with a cap, the pellets 11 will not be damaged even if a method such as trimming or sandblasting trimming is used.

By using these techniques, it is possible to give an arbitrary temperature coefficient to the resistance value and the capacitance value of the capacitor. Further, after performing this trimming work, the trimming element housing window 3 is sealed with a cap or the like.

As a result, with this package for semiconductor integrated circuit devices, it is possible to make the device smaller compared to the case where the same function is achieved using external components, and it is also possible to perform trimming appropriately. It becomes possible to improve electrical characteristics.

FIG. 2 shows another embodiment of the present invention, in which FIG. 2(a) is a plan view and FIG. 2(b) is a front view. Note that the same parts as in FIGS. 1(a) and 1(b) are given the same reference numerals.

In this embodiment, two trimming element accommodating windows 3, 3 are provided on both sides of the pellet accommodating window 2, and a trimming element 12 is housed in each. In this embodiment, the same effect as the embodiment shown in FIG. This has the effect of reducing the length of the wiring with the lead 7 and preventing deterioration of the characteristics of the semiconductor integrated circuit device.

〔Effect of the invention〕

As explained above, in the present invention, the pellet housing window and the trimming element housing window are provided independently in the package body, and the pellets and trimming element are stored in the respective housing windows, so that it is possible to seal the berent. Later, when the pellet is electrically operated, it becomes possible to perform functional trimming of the trimming element, which improves the electrical characteristics and reduces the cost compared to when the same function is achieved using external components. This has the effect of making the device more compact.

[Brief explanation of the drawing]

FIGS. 1(a) and (b) are a plan view and a front view of one embodiment of the present invention, FIGS. 2(a) and (b) are a plan view and a front view of another embodiment of the present invention, FIGS. 3(a) and 3(b) are a plan view and a front view of a conventional semiconductor integrated circuit device. 1.21... Package body, 2.22... Pellet accommodation window, 3... Trimming element accommodation window, 4゜24... Internal lead, 5, 25... Bonding wire, 6. ... Electrode, 7, 27 ... External lead, 11
... Pellet, 12... Trimming element. Figure 1 Figure 2 Figure 3 (b)

Claims (1)

[Claims] (1) A pellet accommodating window and a trimming element accommodating window are provided independently in the package body from which external leads are formed protrudingly, and a pellet is mounted inside the pellet accommodating window and electrically connected to the external lead, and trimming is performed. A semiconductor integrated circuit device, characterized in that trimmable elements such as resistors and capacitors are mounted in the element housing window and electrically connected to the pellet and external leads, respectively.