JPH01178378A - 電子部品の導電片用異種金属の接合方法 - Google Patents
電子部品の導電片用異種金属の接合方法Info
- Publication number
- JPH01178378A JPH01178378A JP33420987A JP33420987A JPH01178378A JP H01178378 A JPH01178378 A JP H01178378A JP 33420987 A JP33420987 A JP 33420987A JP 33420987 A JP33420987 A JP 33420987A JP H01178378 A JPH01178378 A JP H01178378A
- Authority
- JP
- Japan
- Prior art keywords
- electrode chip
- conductive piece
- tip
- plating layer
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 30
- 239000002184 metal Substances 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims description 17
- 238000005304 joining Methods 0.000 title claims description 11
- 238000007747 plating Methods 0.000 claims abstract description 41
- 239000000463 material Substances 0.000 claims abstract description 22
- 229910000679 solder Inorganic materials 0.000 claims abstract description 22
- 150000002739 metals Chemical class 0.000 claims abstract description 20
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 7
- 239000010937 tungsten Substances 0.000 claims abstract description 7
- 238000002844 melting Methods 0.000 claims abstract description 6
- 230000008018 melting Effects 0.000 claims abstract description 6
- UYKQQBUWKSHMIM-UHFFFAOYSA-N silver tungsten Chemical compound [Ag][W][W] UYKQQBUWKSHMIM-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims description 30
- 229910052718 tin Inorganic materials 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 13
- 229910052802 copper Inorganic materials 0.000 abstract description 13
- 239000010949 copper Substances 0.000 abstract description 13
- 229910000990 Ni alloy Inorganic materials 0.000 abstract description 12
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract 1
- 238000005266 casting Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 11
- 239000000956 alloy Substances 0.000 description 8
- 238000003825 pressing Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000669 Chrome steel Inorganic materials 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/16—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Coating With Molten Metal (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33420987A JPH01178378A (ja) | 1987-12-29 | 1987-12-29 | 電子部品の導電片用異種金属の接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33420987A JPH01178378A (ja) | 1987-12-29 | 1987-12-29 | 電子部品の導電片用異種金属の接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01178378A true JPH01178378A (ja) | 1989-07-14 |
| JPH0516950B2 JPH0516950B2 (enrdf_load_stackoverflow) | 1993-03-05 |
Family
ID=18274761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33420987A Granted JPH01178378A (ja) | 1987-12-29 | 1987-12-29 | 電子部品の導電片用異種金属の接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01178378A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003025381A (ja) * | 2001-07-17 | 2003-01-29 | Ricoh Co Ltd | 成形用金型装置 |
| JP2008137033A (ja) * | 2006-11-30 | 2008-06-19 | Yazaki Corp | 抵抗溶接方法及び導体ユニット |
| JP2014208377A (ja) * | 2013-03-29 | 2014-11-06 | シロキ工業株式会社 | メッキ鋼板と生鋼板の溶接方法及び車両用ドアサッシュの溶接方法 |
| CN112338322A (zh) * | 2020-10-27 | 2021-02-09 | 丽智电子（南通）有限公司 | 一种新型电极制备装置及制备方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MXPA05001662A (es) | 2002-08-13 | 2005-10-19 | Medical Instill Tech Inc | Ensamble de contenedor y valvula para almacenar y surtir substancias, y metodo relacionado. |
| WO2011140508A1 (en) | 2010-05-07 | 2011-11-10 | Alps, Llc | Dispensing machine valve and method |
-
1987
- 1987-12-29 JP JP33420987A patent/JPH01178378A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003025381A (ja) * | 2001-07-17 | 2003-01-29 | Ricoh Co Ltd | 成形用金型装置 |
| JP2008137033A (ja) * | 2006-11-30 | 2008-06-19 | Yazaki Corp | 抵抗溶接方法及び導体ユニット |
| JP2014208377A (ja) * | 2013-03-29 | 2014-11-06 | シロキ工業株式会社 | メッキ鋼板と生鋼板の溶接方法及び車両用ドアサッシュの溶接方法 |
| CN112338322A (zh) * | 2020-10-27 | 2021-02-09 | 丽智电子（南通）有限公司 | 一种新型电极制备装置及制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0516950B2 (enrdf_load_stackoverflow) | 1993-03-05 |
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