JPH01176954U - - Google Patents

Info

Publication number
JPH01176954U
JPH01176954U JP1988073281U JP7328188U JPH01176954U JP H01176954 U JPH01176954 U JP H01176954U JP 1988073281 U JP1988073281 U JP 1988073281U JP 7328188 U JP7328188 U JP 7328188U JP H01176954 U JPH01176954 U JP H01176954U
Authority
JP
Japan
Prior art keywords
conversion element
photoelectric conversion
package
cover
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988073281U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988073281U priority Critical patent/JPH01176954U/ja
Publication of JPH01176954U publication Critical patent/JPH01176954U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の実施例のパツケージの断面
図であり、第２図は第１図の上面図であり、第３
図は異る実施例のパツケージの断面図であり、第
４図は従来の技術によるパツケージの断面図であ
る。 １…半導体集積回路素子、１ａ…周辺回路、２
…光電変換素子、３…パツケージ側壁部、４…パ
ツケージベース、９，９１，９６…光、１１…透
し窓、１２…不透明カバー、１４…透明薄膜、３
１…透明な合成樹脂体。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 光電変換素子とその周辺回路とからなる半
    導体集積回路素子を固着したパツケージベースと
    、このパツケージベースに固着され、ケースを構
    成するパツケージ側壁部と、前記ケースの開口部
    を蓋するカバーとからなり、このカバーは前記光
    電変換素子に対応した位置に透し窓を持つ不透明
    カバーとこの不透明カバーに接合された透明薄膜
    とよりなることを特徴とする光電変換素子のパツ
    ケージ容器。 (2) 光電変換素子とその周辺回路とからなる半
    導体集積回路素子を固着したパツケージベースと
    、前記半導体集積回路素子をモールドした透明な
    合成樹脂体と、この透明な合成樹脂体の表面の前
    記光電変換素子に対応した位置に接合された透し
    窓を持つ不透明カバーとよりなることを特徴とす
    る光電変換素子のパツケージ容器。
JP1988073281U 1988-06-01 1988-06-01 Pending JPH01176954U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988073281U JPH01176954U (ja) 1988-06-01 1988-06-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988073281U JPH01176954U (ja) 1988-06-01 1988-06-01

Publications (1)

Publication Number Publication Date
JPH01176954U true JPH01176954U (ja) 1989-12-18

Family

ID=31298427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988073281U Pending JPH01176954U (ja) 1988-06-01 1988-06-01

Country Status (1)

Country Link
JP (1) JPH01176954U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007100037A1 (ja) * 2006-03-02 2007-09-07 Sony Chemical & Information Device Corporation 機能素子実装モジュール及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5690568A (en) * 1979-12-21 1981-07-22 Fuji Photo Film Co Ltd Semiconductor device for photoelectric transducer
JPS56103483A (en) * 1980-01-21 1981-08-18 Fuji Photo Film Co Ltd Manufacture of semiconductor device for photoelectric conversion
JPS60136254A (ja) * 1983-12-23 1985-07-19 Toshiba Corp 固体撮像装置およびその製造方法
JPS62108677A (ja) * 1985-11-06 1987-05-19 Nec Corp 固体化画像装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5690568A (en) * 1979-12-21 1981-07-22 Fuji Photo Film Co Ltd Semiconductor device for photoelectric transducer
JPS56103483A (en) * 1980-01-21 1981-08-18 Fuji Photo Film Co Ltd Manufacture of semiconductor device for photoelectric conversion
JPS60136254A (ja) * 1983-12-23 1985-07-19 Toshiba Corp 固体撮像装置およびその製造方法
JPS62108677A (ja) * 1985-11-06 1987-05-19 Nec Corp 固体化画像装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007100037A1 (ja) * 2006-03-02 2007-09-07 Sony Chemical & Information Device Corporation 機能素子実装モジュール及びその製造方法

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