JPH0178054U - - Google Patents
Info
- Publication number
- JPH0178054U JPH0178054U JP17339587U JP17339587U JPH0178054U JP H0178054 U JPH0178054 U JP H0178054U JP 17339587 U JP17339587 U JP 17339587U JP 17339587 U JP17339587 U JP 17339587U JP H0178054 U JPH0178054 U JP H0178054U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- optical coupling
- coupling device
- sealed
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図、は本考案の平面型光結合素子における
断面図、第２図は対向型光結合素子における断面
図である。また第３図、第４図は従来の光結合素
子の断面図である。 １１，２１，３１，４１……リードフレーム、
１２，２２……非透光性塗料、１３，２３……透
光性樹脂、１４，２４，３５，４５……発光半導
体素子、１５，２５，３６，４４……受光半導体
素子、３２，４２……外装樹脂、３３，４３……
内部樹脂、３４……透明内部樹脂。
断面図、第２図は対向型光結合素子における断面
図である。また第３図、第４図は従来の光結合素
子の断面図である。 １１，２１，３１，４１……リードフレーム、
１２，２２……非透光性塗料、１３，２３……透
光性樹脂、１４，２４，３５，４５……発光半導
体素子、１５，２５，３６，４４……受光半導体
素子、３２，４２……外装樹脂、３３，４３……
内部樹脂、３４……透明内部樹脂。
Claims (1)
- 樹脂封止構造が１層でかつ該封止樹脂表面全面
を、非透光性の塗料で覆つたことを特徴とする樹
脂封止型光結合素子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17339587U JPH0178054U (ja) | 1987-11-13 | 1987-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17339587U JPH0178054U (ja) | 1987-11-13 | 1987-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0178054U true JPH0178054U (ja) | 1989-05-25 |
Family
ID=31465304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17339587U Pending JPH0178054U (ja) | 1987-11-13 | 1987-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0178054U (ja) |
-
1987
- 1987-11-13 JP JP17339587U patent/JPH0178054U/ja active Pending