JPS64347U - - Google Patents
Info
- Publication number
- JPS64347U JPS64347U JP9493387U JP9493387U JPS64347U JP S64347 U JPS64347 U JP S64347U JP 9493387 U JP9493387 U JP 9493387U JP 9493387 U JP9493387 U JP 9493387U JP S64347 U JPS64347 U JP S64347U
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving element
- filter glass
- translucent
- element chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Description
第１図は本考案による受光素子のパツケージ構
造の一例を示す断面図、第２図は同実施例の製造
時の様子を示す斜視図、第３図及び第４図は夫々
異なる従来例の受光素子のパツケージ構造を示す
断面図である。 １……リードフレーム、２……受光素子チツプ
、２ａ……有効受光面、３……フイルターガラス
、４……透光性・可撓性を有する樹脂、５……透
光性樹脂。
造の一例を示す断面図、第２図は同実施例の製造
時の様子を示す斜視図、第３図及び第４図は夫々
異なる従来例の受光素子のパツケージ構造を示す
断面図である。 １……リードフレーム、２……受光素子チツプ
、２ａ……有効受光面、３……フイルターガラス
、４……透光性・可撓性を有する樹脂、５……透
光性樹脂。
Claims (1)
- 受光素子チツプの有効受光面上にフイルターガ
ラスを設け、透光性・可撓性を有する樹脂により
前記フイルターガラスの周囲を覆うとともに該フ
イルターガラスと前記受光素子チツプ間を接着固
定し、さらに全体を透光性樹脂でモールドしてな
ることを特徴とする受光素子のパツケージ構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9493387U JPS64347U (ja) | 1987-06-18 | 1987-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9493387U JPS64347U (ja) | 1987-06-18 | 1987-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS64347U true JPS64347U (ja) | 1989-01-05 |
Family
ID=30958898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9493387U Pending JPS64347U (ja) | 1987-06-18 | 1987-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS64347U (ja) |
-
1987
- 1987-06-18 JP JP9493387U patent/JPS64347U/ja active Pending