JPH01176511A - 柱状体材料の切断方法及び装置 - Google Patents

柱状体材料の切断方法及び装置

Info

Publication number
JPH01176511A
JPH01176511A JP63001052A JP105288A JPH01176511A JP H01176511 A JPH01176511 A JP H01176511A JP 63001052 A JP63001052 A JP 63001052A JP 105288 A JP105288 A JP 105288A JP H01176511 A JPH01176511 A JP H01176511A
Authority
JP
Japan
Prior art keywords
cutting
columnar material
piston
end surface
cylinders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63001052A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0478084B2 (enrdf_load_html_response
Inventor
Katsuo Honda
本田　勝男
Shuichi Tsukada
修一 塚田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP63001052A priority Critical patent/JPH01176511A/ja
Priority to US07/156,748 priority patent/US4903681A/en
Priority to DE88102589T priority patent/DE3883804T2/de
Priority to EP19880102589 priority patent/EP0280245B1/en
Priority to KR1019880001932A priority patent/KR930005466B1/ko
Publication of JPH01176511A publication Critical patent/JPH01176511A/ja
Publication of JPH0478084B2 publication Critical patent/JPH0478084B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP63001052A 1987-02-24 1988-01-06 柱状体材料の切断方法及び装置 Granted JPH01176511A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP63001052A JPH01176511A (ja) 1988-01-06 1988-01-06 柱状体材料の切断方法及び装置
US07/156,748 US4903681A (en) 1987-02-24 1988-02-18 Method and apparatus for cutting a cylindrical material
DE88102589T DE3883804T2 (de) 1987-02-24 1988-02-22 Verfahren und Vorrichtung für das Schneiden eines zylindrischen Materials.
EP19880102589 EP0280245B1 (en) 1987-02-24 1988-02-22 Method and apparatus for cutting a cylindrical material
KR1019880001932A KR930005466B1 (ko) 1987-02-24 1988-02-24 원통형재료의 절단방법 및 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63001052A JPH01176511A (ja) 1988-01-06 1988-01-06 柱状体材料の切断方法及び装置

Publications (2)

Publication Number Publication Date
JPH01176511A true JPH01176511A (ja) 1989-07-12
JPH0478084B2 JPH0478084B2 (enrdf_load_html_response) 1992-12-10

Family

ID=11490776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63001052A Granted JPH01176511A (ja) 1987-02-24 1988-01-06 柱状体材料の切断方法及び装置

Country Status (1)

Country Link
JP (1) JPH01176511A (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPH0478084B2 (enrdf_load_html_response) 1992-12-10

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