JPH01173775A - Thick film circuit board - Google Patents
Thick film circuit boardInfo
- Publication number
- JPH01173775A JPH01173775A JP33193187A JP33193187A JPH01173775A JP H01173775 A JPH01173775 A JP H01173775A JP 33193187 A JP33193187 A JP 33193187A JP 33193187 A JP33193187 A JP 33193187A JP H01173775 A JPH01173775 A JP H01173775A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- thick film
- solder
- circuit board
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 24
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 230000001681 protective effect Effects 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は導体配線パターンおよび電子回路部品等の電子
回路が配置される厚膜回路基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a thick film circuit board on which conductive wiring patterns and electronic circuits such as electronic circuit components are arranged.
従来の技術 第３図なしい第５図に従来の半田接続電極を示す。Conventional technology FIG. 5 without FIG. 3 shows a conventional solder connection electrode.
第３図は円形電極を、又第５図は長方形電極をそれぞれ
示し、各電極は二分割して一定間隔設けて導体保護膜を
電極と同一形状に形成して半田接続電極としたものであ
る。Figure 3 shows a circular electrode, and Figure 5 shows a rectangular electrode. Each electrode is divided into two parts, spaced apart at regular intervals, and a conductor protective film is formed in the same shape as the electrodes to serve as solder connection electrodes. .
発明が解決しようとする問題点
しかしながら、このような半田接続電極では耐熱衝撃に
弱く、加熱、冷却サイクルにおいて接続した半田の応力
により電極が基材より剥離するという問題がある。例え
ば熱衝撃試験（−４０℃〜１００℃各３０分）５０サイ
クルで剥離が発生する。本発明はこのような従来の問題
点を解消するものであり、簡単な構成で電極が剥離され
ることのない優れた厚膜回路基板を提供するものである
。Problems to be Solved by the Invention However, such solder-connected electrodes have a problem in that they are weak in thermal shock resistance, and the electrodes may peel off from the base material due to the stress of the connected solder during heating and cooling cycles. For example, peeling occurs after 50 cycles of a thermal shock test (-40°C to 100°C for 30 minutes each). The present invention solves these conventional problems, and provides an excellent thick film circuit board with a simple structure in which electrodes do not peel off.
問題点を解決するための手段
本発明の厚膜回路基板は、厚膜導体回路パターンの必要
部位を半田接続して閉回路を形成する半田接続電極の形
状を、相対する一対の電極の長手方向の一部に電極幅よ
りも狭（なるように導体保護膜を形成したものである。Means for Solving the Problems In the thick film circuit board of the present invention, the shape of the solder connection electrode, which forms a closed circuit by soldering the necessary parts of the thick film conductor circuit pattern, is adjusted in the longitudinal direction of a pair of opposing electrodes. A conductor protective film is formed on a part of the electrode so that it is narrower than the electrode width.
作 用
本発明の厚膜回路基板は、回路パターンの８姿部位を半
田接続して閉回路を形成する半田接続電極の形状を相対
する一対の電極の長手方向の一部に電極幅よりも狭くな
るように導体保護膜が形成されていることにより、半田
の応力が分散して電極が剥離することが全くなくなるも
のである。Function: In the thick film circuit board of the present invention, the shape of the solder connection electrode, which forms a closed circuit by soldering the eight parts of the circuit pattern, is narrower than the electrode width in a part of the longitudinal direction of a pair of opposing electrodes. By forming the conductor protective film in such a manner, the stress of the solder is dispersed and peeling of the electrodes is completely eliminated.
実 施 例
本発明の一実施例の厚膜回路基板を図面を参照して説明
する。Embodiment A thick film circuit board according to an embodiment of the present invention will be described with reference to the drawings.
第１図及び第２図は本発明の一実施例における厚膜回路
基板の半田接続電極の平面図及び半田で接続された後の
半田接続電極断面図である。FIGS. 1 and 2 are a plan view of a solder connection electrode of a thick film circuit board and a sectional view of the solder connection electrode after being connected by solder in one embodiment of the present invention.
第１図及び第２図において、１は厚膜導体印刷により形
成された半田接続電極、２は導体保護膜、３は絶縁基材
、４は電極間接続用半田である。In FIGS. 1 and 2, 1 is a solder connection electrode formed by thick film conductor printing, 2 is a conductor protective film, 3 is an insulating base material, and 4 is solder for connection between electrodes.
以上のように構成された本実施例の厚膜回路基板では、
半田接続電極の形状を相対する一対の電極の長子方向の
一部に電極幅よりも狭くなるように導体保護膜を形成し
たことにより、加熱、冷却の熱衝動時に発生する、接続
した半田の応力による電極剥離が全くなくなり、信頼性
の高い電気的接続を実現している。In the thick film circuit board of this embodiment configured as described above,
By forming a conductor protective film on a part of the longitudinal direction of a pair of opposing electrodes so that the shape is narrower than the electrode width, stress in the connected solder that occurs during thermal impulses of heating and cooling can be reduced. There is no electrode peeling caused by this process, and a highly reliable electrical connection is achieved.
発明の効果
以上の説明から明らかなように本発明は、回路パターン
の必要部位を半田接続して閉回路を形成する半田接続電
極の形状を相対する一対の電極の長手方向の一部に電極
幅よりも狭くなるように導体保護膜を形成した構成とな
っているので、加熱、冷却の熱衝撃時に発生する、接続
した半田の応力を分散させることができるので電極が基
材より剥離することが全（なくなり半田による電極間の
電気的接続の信頼性が向上するという効果が得られる。Effects of the Invention As is clear from the above explanation, the present invention has the advantage that the shape of the solder connection electrode, which forms a closed circuit by soldering the necessary parts of the circuit pattern, is such that the electrode width is formed in a part of the longitudinal direction of a pair of electrodes facing each other. Since the conductor protective film is formed to be narrower than the conductor, it is possible to disperse the stress of the connected solder that occurs during thermal shock during heating and cooling, thereby preventing the electrode from peeling off from the base material. The effect is that the reliability of the electrical connection between the electrodes due to solder is improved.
第１図は本発明の一実施例における厚膜回路基板の半田
接続電極を示す平面図、第２図は同じ（半田で接続され
た後の半田接続電極の断面図、第３図、第４図、第５図
、第６図は従来の厚膜回路基板の半田接続電極を示す平
面図及び半田で接続された後の半田接続電極の断面図で
ある。
１・・・・・・半田接続電極、１′・・・・・・厚膜導
体パターン、２・・・・・・導体保護膜、３・・・・・
・絶縁基材、４・・・・・・電極接続半田。 ゛
代理人の氏名 弁理士 中尾敏男 はが１名／−−−キ
ｖＨ糞粛１【陽
ｌ′−−一λ１凝導剃９３−ン
２−導体保護膜
１２ 図FIG. 1 is a plan view showing a solder connection electrode of a thick film circuit board according to an embodiment of the present invention, and FIG. 5 and 6 are a plan view showing solder connection electrodes of a conventional thick film circuit board, and a sectional view of the solder connection electrodes after being connected by solder. 1...Solder connection Electrode, 1'...Thick film conductor pattern, 2...Conductor protective film, 3...
- Insulating base material, 4... Electrode connection solder.゛Name of agent: Patent attorney Toshio Nakao 1 person/--Ki vH removal 1
Claims (1)
を形成する半田接続電極を備え、この半田接続電極は相
対する一対の電極の長手方向の一部に電極幅よりも狭く
なるように導体保護膜を形成して事を特徴とする厚膜回
路基板。It is equipped with a solder connection electrode that connects necessary parts of the thick film conductor circuit pattern with solder to form a closed circuit. A thick film circuit board characterized by forming a conductor protective film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62331931A JP2502644B2 (en) | 1987-12-28 | 1987-12-28 | Thick film circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62331931A JP2502644B2 (en) | 1987-12-28 | 1987-12-28 | Thick film circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01173775A true JPH01173775A (en) | 1989-07-10 |
| JP2502644B2 JP2502644B2 (en) | 1996-05-29 |
Family
ID=18249240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62331931A Expired - Fee Related JP2502644B2 (en) | 1987-12-28 | 1987-12-28 | Thick film circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2502644B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55181368U (en) * | 1979-06-14 | 1980-12-26 | ||
| JPS5853880A (en) * | 1981-09-25 | 1983-03-30 | 松下電器産業株式会社 | Printed circuit board |
-
1987
- 1987-12-28 JP JP62331931A patent/JP2502644B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55181368U (en) * | 1979-06-14 | 1980-12-26 | ||
| JPS5853880A (en) * | 1981-09-25 | 1983-03-30 | 松下電器産業株式会社 | Printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2502644B2 (en) | 1996-05-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |