JPS5944900A - Circuit board device - Google Patents
Circuit board deviceInfo
- Publication number
- JPS5944900A JPS5944900A JP15603282A JP15603282A JPS5944900A JP S5944900 A JPS5944900 A JP S5944900A JP 15603282 A JP15603282 A JP 15603282A JP 15603282 A JP15603282 A JP 15603282A JP S5944900 A JPS5944900 A JP S5944900A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electronic component
- board
- layer
- board device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明はテレビジョン受像機等に使用される配線基板装
置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a wiring board device used in television receivers and the like.
従来例の構成とその問題点
第１図は従来例における配線基板装置を示すものであり
、基板１の脚挿入孔２に電子部品３の脚４を挿入し、基
板１の裏面の導電体６に脚４を半田６によシ固定する。Structure of a conventional example and its problems FIG. 1 shows a wiring board device in a conventional example, in which the legs 4 of an electronic component 3 are inserted into the leg insertion holes 2 of a board 1, and the conductor 6 on the back side of the board 1 is inserted into the leg insertion hole 2 of the board 1. Fix the legs 4 with solder 6.
このように取付けられた電子部品３を基板１から取外す
ためには、半田６を溶融し、電子部品３を引き抜く必要
がある。電子部品３の脚４の数が多い場合には、すべて
の半田を一度に溶融するのが困難であり、部品３の取外
しに手間を要する欠点がある。In order to remove the electronic component 3 attached in this manner from the board 1, it is necessary to melt the solder 6 and pull out the electronic component 3. When the number of legs 4 of the electronic component 3 is large, it is difficult to melt all the solder at once, and there is a disadvantage that removing the component 3 requires time and effort.
発明の目的
本発明は上記欠点を除去し、容易に半田を溶剤ｔして電
子部品を取外すことができるようにしようとするもので
ある。OBJECTS OF THE INVENTION The present invention aims to eliminate the above-mentioned drawbacks and to make it possible to easily remove solder by dissolving the solder into a solvent and removing electronic components.
発明の構成
本発明は基板の脚挿入孔の周囲に抵抗体層を設け、その
上に絶縁体層を介して半田付可能な導電体層を設けたも
のであり、抵抗体層に電流を流すことによって発熱させ
、半田を溶融するようにしたものである。Structure of the Invention The present invention provides a resistor layer around the leg insertion hole of a board, and a solderable conductor layer is provided on the resistor layer through an insulator layer, and current is passed through the resistor layer. This generates heat and melts the solder.
実施例の説明
以下本発明の一実施例について図面を参ｌ＠シて説明す
る。第２図〜第４図に示すように樹月旨あるいはセラミ
ック等で構成された基板７に電子￥！ｉ１品の脚Ｉ諏入
孔８を設ける。基板７の裏面に訃ける脚挿入孔８の周囲
に抵抗体層９を焼成によって設ける。この抵抗体層９に
は導電体１０ａ、１０ｂを介して端子１１ａ、１１ｂが
接続されている。抵抗体層９の上には絶縁層１２を介し
て半田付可能な導電層１３を設けて赴く。この導電層１
３の上ｖＣｉｌ−１Ｉあらかじめ半田１４を溶着してお
く。電子部品１６の脚１６を脚挿入孔８に挿入した状態
で、抵抗体層９に電流を流し、半田１４を溶融し７、脚
１６を導電体１３に接続し、固定する。電子部品１６を
基板７よシ取外す場合には抵抗体９に電流を流し、半田
１４を溶融し、脚１６を半田１４より引き抜けばよい。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. As shown in FIGS. 2 to 4, the electronic ¥! A leg I entry hole 8 is provided for the I1 product. A resistor layer 9 is provided around the leg insertion hole 8 on the back surface of the substrate 7 by firing. Terminals 11a and 11b are connected to this resistor layer 9 via conductors 10a and 10b. A solderable conductive layer 13 is provided on the resistor layer 9 via an insulating layer 12. This conductive layer 1
3. Solder 14 is welded on vCil-1I in advance. With the leg 16 of the electronic component 16 inserted into the leg insertion hole 8, a current is applied to the resistor layer 9 to melt the solder 14 7, and the leg 16 is connected to the conductor 13 and fixed. In order to remove the electronic component 16 from the board 7, a current may be applied to the resistor 9 to melt the solder 14, and the legs 16 may be pulled out from the solder 14.
電子部品１６の脚１６が多い場合でも、すべての半田を
一度に溶融することができるので、取外しはきわめて容
易に行うことができる。Even if the electronic component 16 has many legs 16, all the solder can be melted at once, so removal can be performed extremely easily.
発明の効果
以上のように本発明によれば、半田を一度に溶融するこ
とができるので電子部品の取外しをきわめて容易に行う
ことができるものである。Effects of the Invention As described above, according to the present invention, since the solder can be melted at once, it is possible to remove the electronic component extremely easily.
【図面の簡単な説明】
第１図は従来例における配線基板装置の断正面図、第２
図は本発明の一実施例における配線基板装置の断正面図
、第３図は同装置の一部分の拡大断面、第４図は同装置
の平面図である。
了・・・・・・基板、８・・・・・・脚挿入孔、９・・
・・・・抵抗体層、１０ａ、１０ｂ・・・・・・導電体
、１１ａ、１１ｂ・・・・・・端子、１２・・・・・・
絶縁層、１３・・・・・・導電層、１４・・・・・・半
田、１５・・・・・・電子部品、１６・・・・・・脚。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第２図
第３図
第４図[Brief explanation of the drawings] Figure 1 is a cross-sectional front view of a conventional wiring board device;
The figure is a sectional front view of a wiring board device according to an embodiment of the present invention, FIG. 3 is an enlarged sectional view of a portion of the device, and FIG. 4 is a plan view of the device. Completed... Board, 8... Leg insertion hole, 9...
...Resistor layer, 10a, 10b...Conductor, 11a, 11b...Terminal, 12...
Insulating layer, 13... Conductive layer, 14... Solder, 15... Electronic component, 16... Leg. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3 Figure 4
Claims (1)
おける上記脚挿入孔周囲に抵抗体層を設け、この抵抗体
の上に絶縁層を介して半田付可能な導電体層を形成し、
上記抵抗体に電流を流す導電体を設けた配線基板装置。A leg insertion hole for an electronic component is formed in the board, a resistor layer is provided around the leg insertion hole on the back side of the board, and a conductive layer that can be soldered is formed on the resistor via an insulating layer. ,
A wiring board device provided with a conductor that allows current to flow through the resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15603282A JPS5944900A (en) | 1982-09-08 | 1982-09-08 | Circuit board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15603282A JPS5944900A (en) | 1982-09-08 | 1982-09-08 | Circuit board device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5944900A true JPS5944900A (en) | 1984-03-13 |
Family
ID=15618818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15603282A Pending JPS5944900A (en) | 1982-09-08 | 1982-09-08 | Circuit board device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5944900A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5542520A (en) * | 1978-09-18 | 1980-03-25 | Okamura Shokuhin Kogyo:Kk | Overall tasty nourishing food |
| JPS5764990A (en) * | 1980-10-09 | 1982-04-20 | Hitachi Ltd | Method of exchanging circuit element in wired substrate unit |
-
1982
- 1982-09-08 JP JP15603282A patent/JPS5944900A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5542520A (en) * | 1978-09-18 | 1980-03-25 | Okamura Shokuhin Kogyo:Kk | Overall tasty nourishing food |
| JPS5764990A (en) * | 1980-10-09 | 1982-04-20 | Hitachi Ltd | Method of exchanging circuit element in wired substrate unit |
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