JPH0371572A - Chip type parts with jumper conductor - Google Patents

Abstract

PURPOSE:To simplify the manufacturing process of a substrate by forming a jumper conductor wound around the circumferential face of a parts body between the electrodes of both ends of the parts body such that the terminals of the jumper conductor are opposed to each other on the back of the parts body. CONSTITUTION:The terminals 14a, 14b of the jumper conductor 14 on the back of chip type parts 11 are respectively formed with a length of about 1/3 of a length l in the cross direction, e.g. from the end of the side of a parts body 11a. To mount the chip type parts on a substrate, the electrodes 12, 13 of the chip type parts 11 and the terminals 14a, 14b of the conductor 14 are made to correspond to the electrodes 12', 13' and a conductor pattern 14' printed on the substrate and fixed by soldering to form a circuit. So, it is possible to pass other conductor patterns under the chip type parts 11 without providing any special processes to the conductor pattern of the substrate and simplify the manufacturing process of the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip component having two electrodes at both ends electrically connected to electrodes on a substrate.

[Prior art] Hybrid) In IC boards, etc., conductor patterns may cross each other due to high-density mounting, so a fourth method is proposed in which the conductor patterns are crossed so that they do not touch each other.
As shown in FIG.

Figure 4 shows a case where through holes are used. In the figure, 4 is a surface pattern printed on the front surface, 5 is a through hole made on both sides of the surface pattern 4, and 6 is a pattern on the back side that connects the through holes 5. By inserting a bottle or the like (not shown) into the through hole 5 using the back layer pattern printed on the back layer pattern, the surface conductor pattern (not shown) connected to the through hole 5 can be connected without coming into contact with the surface layer pattern 4. It turns out.

Also, Figure 5 shows a structure using jumper wires (a)
(1) shows the case where through holes are used, and (1)) shows the case where no through holes are used.

In (a), 7 is a substrate, and through holes 9 are formed on both sides of a conductive pattern 8. A jumper wire IO is inserted into this through hole 9 so as to straddle the conductor pattern and soldered.

(b), the legs of the jumper wire 10 are bent and soldered to the electrodes provided on both sides of the conductor pattern 8 on the substrate 7 to facilitate soldering.

(aL (b) Both use jumper wires to straddle the conductor patterns to prevent contact with each other.

Furthermore, in order to further increase the density of the substrate, a substrate may be formed under the chip component through which a conductor passes in addition to its own electrodes. In this case, when mounting the chip component on the board, the electrodes may be temporarily fixed by adhesive or the like before being soldered, so it is necessary to protect the conductor pattern under the chip component by some method.

FIG. 3 is a plan view showing a conventional example, in which reference numeral 1 indicates two electrodes on which chip components are mounted, and reference numeral 2 indicates a conductor pattern printed so as to pass between the electrodes 1.

When the conductor pattern 2 is formed as described above,
As shown by the two-dot chain line, when the chip component is mounted, the conductor pattern 2 comes into contact with the bottom surface of the chip component, so in order to protect the conductor pattern 2, a protective film 3 formed of an insulator is attached to the conductor pattern. Print on 2.

After forming the conductor pattern 2 as described above, a circuit is formed by temporarily fixing the chip components with adhesive or the like so that the electrodes of the chip components and electrodes 1 are in contact with each other, and fixing each electrode with soldering. To go.

[Problems to be Solved by the Invention] However, the above-described conventional method of passing a conductor pattern under a chip component has the following problems.

In other words, if there is a conductor pattern under the chip component as shown in Figure 3, it is necessary to first print the conductor pattern on the board and then print a protective film over it, which increases the number of printing steps. There is.

The present invention was made to solve such problems, and an object of the present invention is to provide a chip component that can simplify the manufacturing process of a board by providing a jumper conductor on the chip component side.

[Means for Solving the Problems] In order to achieve this object, the present invention has two electrodes at both ends of the component body that electrically contact the electrodes on the substrate, and between these two electrodes, The jumper conductor that wraps around the peripheral surface of the component body is formed so that its terminals face each other on the back surface of the component body.

[Function] In the present invention having the above-described configuration, a jumper conductor is provided on the chip component in addition to the original electrode.

Therefore, according to this, another conductor pattern can be passed under the chip component without performing any special treatment on the conductor pattern of the board.

〔Example 〕

Examples will be described below with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the present invention, in which 11 is a chip component mounted on a board, and (a) is a chip component 1.
1 shows the front side, and (b) shows the back side.

The chip component 11 has a component body 11a formed with original connection electrodes 12 and 13 for electrodes to be described later on a substrate (not shown) so as to surround each end surface.

14 is a jumper conductor formed by wrapping the peripheral surface of the component body 11a between the connection electrodes 12 and 13, and on the back side of the component body 11a, the jumper conductor 14 is connected to a conductor pattern to be described later on a substrate (not shown). Each terminal 14a becomes.

14b are formed facing each other.

Each of the terminals 14a and 14b has a length l of 17 in the lateral direction of the component body 11a, for example, from the side edge of the component body 11a.
Each part is formed with a length of about a, and the part body 11
As will be described later, an adhesive may be used in mounting the chip component 11 in the central portion of a, so that no conductor is present.

On a substrate (not shown) on which the chip component 11 is mounted, electrodes 12', 13' and two conductor patterns 14' as shown in FIG. 2 are printed facing each other in four directions.

In order to mount the chip component 11 on a substrate (not shown), the electrodes 12 and 13 of the chip component 11 are connected to the electrodes 12' and 13''.
The chip component 11 is temporarily fixed to a substrate (not shown) by adhesive or the like so that the terminals 14a and 14b of the jumper conductor 14 correspond to the two conductor patterns 14', respectively.

Thereafter, a circuit is formed by fixing the electrodes and the conductor patterns and terminals by soldering.

〔Effect of the invention 〕

As explained above, the present invention has two electrodes at both ends of the component body that electrically contact electrodes on the substrate, and a jumper conductor that wraps around the peripheral surface of the component body between these two electrodes. ,
The terminals are formed so as to face each other on the back surface of the component body.

Therefore, according to this, there is no need to print a protective film on the conductive pattern, and the printing process can be reduced.

Furthermore, other conductor patterns can be easily passed under the chip components, so if the conductor patterns cross where there are no chip components, it is possible to form a board in which the conductor patterns can pass under the chip components. This also has the effect of further increasing the density of the substrate.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a plan view of a conductor pattern on which chip components are mounted in the embodiment,
FIG. 3 is a plan view showing a conventional example, FIG. 4 is a plan view showing a first method of crossing conductor patterns, and FIG. 5 is a side view showing a second method of crossing conductor patterns. . 11... Chip component 12... Connection electrode 13... Connection electrode 14... Jumper conductor

Claims (1)

[Claims] (1) There are two electrodes at both ends of the component body that electrically contact the electrodes on the board, and between these two electrodes, a jumper conductor is wound around the circumference of the component body, and its terminal is connected to the component body. A chip component with jumper conductors, characterized in that the jumper conductors are formed so as to face each other on the back side.