JPH07154050A - Printed board mounting system - Google Patents

Abstract

PURPOSE:To increase the mounting density by inserting an electronic device, provided with electrodes at the opposite ends thereof with a lead wire insertion hole being made at one end of each electrode, into fixing holes of a printed board comprising an insulator applied with wiring patterns on the opposite sides thereof and then soldering each electrode to each wiring pattern on the printed board. CONSTITUTION:An electronic device 4 provided, at the opposite ends thereof, with electrodes 21, 22 each having a lead wire insertion hole 5 at one end thereof is inserted into fixing holes 3 in a printed board 2 comprising an insulator 1 applied with wiring patterns 12a, 12b on the opposite sides thereof. The electrodes 21, 22 are then soldered to the wiring patterns 12a, 12b on the printed board 2, respectively. An electronic device 4, e.g. a capacitor, having an insertion hole 5 made in the electrode 21 at one end thereof is inserted with the lead wire 101 of a device 10 with leads and soldered simultaneously. Since an identical fixing hole can be employed, the fixing space can be eliminated and high density mounting is achieved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a printed circuit board mounting system.

[0002]

2. Description of the Related Art Conventionally, when mounting on a printed circuit board by soldering, as shown in FIG. 3, the mounting holes and through holes of the printed circuit board 2 are used to insert the lead wires of the electronic parts 10 and 11 and then solder. I was making a connection. (For example, Japanese Utility Model Publication No. 62-145301, Japanese Utility Model Publication No. 62-
(See Japanese Patent No. 158862)

In the printed circuit board mounting method described above, one lead is usually inserted into one mounting hole of the printed circuit board and soldered. Therefore, for example, two or more printed circuit boards are mounted on the printed circuit board. When inserting and mounting the lead wire, it is necessary to prepare two or more mounting holes and a component space, and there is a drawback that the size of the printed circuit board increases in proportion to the mounted component.

[0003]

According to the printed circuit board mounting method of the present invention, electrodes are provided at both ends of a mounting hole of a printed circuit board having wiring patterns on both sides of an insulator, and a lead wire insertion hole is provided at one end of the electrode. The electronic component is inserted and each of the electrodes and each of the wiring patterns of the printed circuit board are connected by soldering.

[0004]

The present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is an equivalent circuit diagram of FIG.

In FIG. 1, a printed circuit board 2 having wiring patterns 12a and 12b on both sides of an insulator 1 is provided with a mounting hole 3 in a state of vertically penetrating the wiring pattern. The component 4 inserted and mounted in the mounting hole 3 has electrodes 21 and 22 at both ends. An insertion hole 5 for inserting the lead wire 101 of the leaded component 10 is provided at one end of the both-end electrode.
The lead wire 101 and the holed electrode 21 are fixed by soldering.

In the wiring pattern 12a of the printed circuit board 2, the electrode with hole 21 and the leaded component 101 inserted into the insertion hole 5 of the electrode with hole 21 are inserted, and simultaneously soldered and connected. On the other hand, the wiring pattern 12b is soldered to the other electrode 22 of the component 4.

According to the present invention, since the same mounting hole can be used, a mounting space is not required, and high density mounting is possible.

[0009]

According to the printed circuit board mounting method of the present invention, a plurality of parts can be used in the printed circuit board hole by inserting and mounting a component having a holed electrode utilizing the printed circuit board hole and the insertion hole. This has the effect of improving the packaging density.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is an equivalent circuit diagram of FIG.

FIG. 3 is a cross-sectional view showing a conventional example.

[Explanation of symbols]

 1 Insulator 2 Printed Circuit Board 3 Mounting Hole 4 Component 5 Insertion Hole 6 Soldering 10, 11 Leaded Parts 12a, 12b Wiring Pattern 21 Holeed Electrode 22 Electrode 101 Lead Wire

Claims (2)

[Claims] 1. An electronic component having electrodes at both ends and a lead wire insertion hole at one end of the electrode is inserted into a mounting hole of a printed circuit board having wiring patterns on both sides of an insulator, and each of the electrodes is connected to the both electrodes. A printed circuit board mounting method, wherein each of the wiring patterns of the printed circuit board is connected by soldering. 2. The printed circuit board mounting method according to claim 1, wherein a capacitor is used as the electronic component.