JPH01171291A - Printed resistor board and manufacture thereof - Google Patents
Printed resistor board and manufacture thereofInfo
- Publication number
- JPH01171291A JPH01171291A JP32838687A JP32838687A JPH01171291A JP H01171291 A JPH01171291 A JP H01171291A JP 32838687 A JP32838687 A JP 32838687A JP 32838687 A JP32838687 A JP 32838687A JP H01171291 A JPH01171291 A JP H01171291A
- Authority
- JP
- Japan
- Prior art keywords
- resistance
- printed
- resistor
- electrodes
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000007747 plating Methods 0.000 claims abstract description 19
- 239000004020 conductor Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 13
- 238000007639 printing Methods 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 14
- 229910052802 copper Inorganic materials 0.000 abstract description 14
- 239000010949 copper Substances 0.000 abstract description 14
- 239000000853 adhesive Substances 0.000 abstract description 10
- 230000001070 adhesive effect Effects 0.000 abstract description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052709 silver Inorganic materials 0.000 abstract description 9
- 239000004332 silver Substances 0.000 abstract description 9
- 239000004593 Epoxy Substances 0.000 abstract description 7
- 239000011521 glass Substances 0.000 abstract description 6
- 239000003054 catalyst Substances 0.000 abstract description 4
- 239000012790 adhesive layer Substances 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 239000005011 phenolic resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- KPVWDKBJLIDKEP-UHFFFAOYSA-L dihydroxy(dioxo)chromium;sulfuric acid Chemical compound OS(O)(=O)=O.O[Cr](O)(=O)=O KPVWDKBJLIDKEP-UHFFFAOYSA-L 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 229920006332 epoxy adhesive Polymers 0.000 abstract 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はＶＴＲ、ラジオ、テレビジョン等の電子機器に
用いられる印刷抵抗体を備えた回路基板およびその製法
に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a circuit board equipped with a printed resistor used in electronic devices such as VTRs, radios, and televisions, and a method for manufacturing the same.
従来、印刷抵抗体を形成する回路基板、例えば銅抵抗電
極が設けられたガラスエポキシ基板、においては、印刷
抵抗体端部を付着させる銅抵抗電極極は厚く、ガラスエ
ポキシ基板面に対して、５ＯＩｉｊ程高くなっていた。Conventionally, in a circuit board on which a printed resistor is formed, for example, a glass epoxy substrate provided with a copper resistive electrode, the copper resistive electrode electrode to which the end of the printed resistor is attached is thick, and has a thickness of 50Iij with respect to the surface of the glass epoxy board. It had become moderately high.
この銅抵抗電極と基板との高さの差を縮めるため、印刷
抵抗体を形成する基板面上に、非固体状材料を用いスク
リーン印刷で、アンダーコートを塗布することも行なわ
れていたが、こうした場合でも、精度等の点で、はなは
だ不十分なものであった。In order to reduce the difference in height between the copper resistance electrode and the substrate, an undercoat has been applied by screen printing using a non-solid material on the surface of the substrate on which the printed resistor will be formed. Even in these cases, the accuracy was still extremely inadequate.
アンダーコートをしていない従来例の印刷抵抗基板を第
２図に示す。図のように、銅抵抗電Ｆｉ２は、基板１か
ら約５０ｕ＋厚で形成され、これに対して、印刷抵抗体
４の厚みは約１５ｕ１程度にスクリーン印刷される。銅
抵抗電極２上には、銅抵抗電極２のエツジから印刷抵抗
体４に対して発生するクラックを防止するため、また、
接触抵抗を小さくするために、銀電極３を形成する場合
が多い。FIG. 2 shows a conventional printed resistor substrate without an undercoat. As shown in the figure, the copper resistor Fi2 is formed from the substrate 1 to a thickness of about 50u+, whereas the printed resistor 4 is screen printed to a thickness of about 15u1. On the copper resistance electrode 2, in order to prevent cracks from occurring from the edges of the copper resistance electrode 2 to the printed resistor 4,
In order to reduce contact resistance, silver electrodes 3 are often formed.
しかしながら、銅抵抗電極２の厚みが５０μ程であるた
め、印刷性が悪く、銀ペーストおよび抵抗ペーストの印
刷時に、にじみや印刷ズレ等が発生し、高密度な印刷が
できないだけでなく、生産性も低いものであった。However, since the thickness of the copper resistance electrode 2 is approximately 50 μm, printability is poor, and bleeding and printing misalignment occur when printing silver paste and resistance paste, which not only makes high-density printing impossible but also reduces productivity. was also low.
さらには、印刷抵抗Ｒは
Ｒ＝ρＬ／ＷＴ
ρ：固有抵抗 Ｌ：抵抗長さ（抵抗電極間の距離）
Ｗ：抵抗幅 Ｔ：抵抗厚み
によって定まるが、印刷抵抗体４の印刷ずれが生したり
、銀ペーストかにじんだりすると、抵抗長さＬが変化す
るだけでなく、抵抗電極と基板のギャップから印刷抵抗
体４の厚さＴが不安定になり、抵抗のバラつきが大きく
なる。Furthermore, the printed resistance R is determined by R=ρL/WT ρ: Specific resistance L: Resistance length (distance between resistance electrodes) W: Resistance width T: Resistance thickness, but printing misalignment of the printed resistor 4 occurs. If the silver paste bleeds, not only will the resistor length L change, but also the thickness T of the printed resistor 4 will become unstable due to the gap between the resistor electrode and the substrate, increasing the variation in resistance.
本発明の目的はこれらの問題点を解決しうる印刷抵抗基
板およびその製法を提供することにある。An object of the present invention is to provide a printed resistance board and a method for manufacturing the same that can solve these problems.
〔問題点を解決するための手段および作用〕上記目的達
成可能な本発明は、絶縁基板上に、導体パターンとそれ
に連通する抵抗電極とが配設され、少なくとも抵抗電極
同士の間隙にはめっきレジストが設けられ、抵抗電極同
士に架橋するように印刷抵抗が、その抵抗電極上および
その間にあるめっきレジスト上に、形成されていること
を特徴とする印刷抵抗基板、およびその製法、即ち、基
板上に、めっきレジストを形成した後、そのレジストが
ない部分に、めっきによって、導体パターンとそれに連
通ずる抵抗電極とを形成する工程と、抵抗電極同士を架
橋するように、印刷抵抗体を、抵抗電極上およびめっき
レジスト上に形成する工程を有することを特徴とする印
刷抵抗基板の製造方法である。[Means and effects for solving the problems] The present invention, which can achieve the above-mentioned objects, comprises a conductor pattern and resistance electrodes communicating with the conductor pattern disposed on an insulating substrate, and a plating resist formed at least in the gaps between the resistance electrodes. A printed resistor substrate is provided with a printed resistor, and a printed resistor is formed on the resistive electrode and on a plating resist between the resistive electrodes so as to bridge the resistive electrodes, and a method for manufacturing the same, namely, on the substrate. After forming a plating resist, there is a step of forming a conductor pattern and a resistance electrode communicating with it by plating on the part where the resist is not present, and a process of forming a printed resistor and a resistance electrode so as to bridge the resistance electrodes. This is a method for manufacturing a printed resistor substrate, characterized by comprising a step of forming the printed resistor substrate on top and on a plating resist.
本発明においては、印刷抵抗体の被印刷面全体が平滑化
されているので、印刷抵抗体形成用の抵抗ペーストの印
刷性が大幅に向上し、それと共に、抵抗電極のエツジに
より発生しやすい印刷抵抗体のクラックが防止できる。In the present invention, since the entire printing surface of the printed resistor is smoothed, the printability of the resistance paste for forming the printed resistor is greatly improved, and at the same time, the printing that is likely to occur due to the edges of the resistive electrode Cracks in the resistor can be prevented.
さらには、本発明では、抵抗ペースト等のにじみや印刷
ずれがないため、抵抗長さを精度良く、制御でき、抵抗
値のバラツキを飛躍的に小さくでき、また抵抗電極と基
板とのギャップを小さくできる。Furthermore, in the present invention, there is no bleeding or printing misalignment of the resistor paste, etc., so the resistor length can be controlled with high precision, the variation in resistance value can be dramatically reduced, and the gap between the resistor electrode and the substrate can be reduced. can.
さらに、めっきレジストを感光性樹脂で形成すれば、抵
抗電極の形状を設計値通りにすることができるので、そ
こに付着する印刷抵抗体も設計値通りに形成でき、印刷
抵抗体の抵抗値ばらつきを小さくすることができる。Furthermore, if the plating resist is made of photosensitive resin, the shape of the resistive electrode can be made as per the designed value, and the printed resistor attached thereto can also be formed as designed, resulting in variations in the resistance value of the printed resistor. can be made smaller.
上記の種々の利点をもつ印刷抵抗回路基板がアディティ
ブ法を利用して簡便に製造できる。A printed resistor circuit board having the various advantages described above can be easily manufactured using the additive method.
本発明の印刷抵抗回路基板の一態様を第１図に示す。こ
の印刷抵抗回路基板では、ガラスエポキシ基板ｌ上に、
接着層６を介して銅抵抗電極２と導体パターン（不図示
）とが設けられ、この銅抵抗電極２や導体パターンの間
隙にはめっきレジスト５で埋められている。そして、印
刷抵抗体４は、銀電極３を介して銅抵抗電極２上および
感光性レジスト５上に形成されている。One embodiment of the printed resistance circuit board of the present invention is shown in FIG. In this printed resistance circuit board, on the glass epoxy substrate l,
A copper resistance electrode 2 and a conductor pattern (not shown) are provided with an adhesive layer 6 in between, and a gap between the copper resistance electrode 2 and the conductor pattern is filled with a plating resist 5. The printed resistor 4 is formed on the copper resistance electrode 2 and the photosensitive resist 5 via the silver electrode 3.
銀電極３は接触抵抗を軽減させるためのものであり、か
ならずしも必要ではない。The silver electrode 3 is provided to reduce contact resistance and is not necessarily required.
第１図と、従来例を示す第２図との比較によって明らか
なように、本発明によれば、電極と絶縁部の高さを充分
そろえるができるので、上述したような作用が発揮でき
る。As is clear from a comparison between FIG. 1 and FIG. 2 showing the conventional example, according to the present invention, the heights of the electrode and the insulating portion can be made sufficiently equal, so that the above-described effects can be exerted.
本発明の印刷抵抗回路基板の製法を、第１図の回路基板
を作製する場合を例にとって、説明する。The method for manufacturing a printed resistor circuit board of the present invention will be explained by taking as an example the case of manufacturing the circuit board shown in FIG.
まず、ガラスエポキシ基板ｌ上に、Ｎ０Ｒ−フェノール
樹脂系接着剤、ＮＢＲ−エポキシ樹脂系接着剤Ｎｎｌ１
−フェノール樹脂−エポキシ樹脂系接着剤のような接着
剤を塗布し、クロム酸−硫酸混液等で接着層６を粗化し
た後、触媒処理を行なう。触媒処理は、パラジウム系触
媒等を利用する。First, apply N0R-phenol resin adhesive, NBR-epoxy resin adhesive Nnl1 on the glass epoxy substrate l.
- An adhesive such as a phenol resin-epoxy resin adhesive is applied, and after roughening the adhesive layer 6 with a chromic acid-sulfuric acid mixture or the like, a catalyst treatment is performed. Catalytic treatment uses a palladium-based catalyst or the like.
次いで、メツキレジストを所望のパターンに形成する。Next, a plating resist is formed into a desired pattern.
次に、このメツキレジストが形成された基板に、無電解
メツキ処理を施すことによフて、銅抵抗電極と導体パタ
ーンを形成し、基板表面を全体的にほぼ平滑にする。Next, the substrate on which the plating resist has been formed is subjected to an electroless plating process to form a copper resistance electrode and a conductor pattern, thereby making the entire surface of the substrate substantially smooth.
次に、銀ペースト、抵抗ペーストを印刷して、印刷抵抗
体４を形成し、第１図に示した印刷抵抗回路基板とする
。Next, a silver paste and a resistance paste are printed to form a printed resistor 4, resulting in the printed resistor circuit board shown in FIG.
［実施例コ
以下、本発明を、実施例に基づいて具体的に説明するが
、これに限定されるものではに。[Examples] The present invention will be specifically explained below based on Examples, but is not limited thereto.
実施例１
次のようにして、第１図に示した印刷抵抗回路基板を作
製した。Example 1 The printed resistance circuit board shown in FIG. 1 was manufactured in the following manner.
ガラスエポキシ板１上にＮＢＲ−フェノール樹脂系接着
剤を３０ＩｉｊＩ塗布した基板に対し、穴空けしてスル
ーホールを形成した。その後、接着剤をクロム酸−硫酸
混酸で粗化した後、パラジウム触媒処理（日立化成社製
Ｈ５ＩＯＩＢ ）を施し、続いて、感光性フィルム（日
立化成社製ＳＲ−：１０００の３５μ厚）によって、め
っきレジストを形成した。A through hole was formed in a glass epoxy plate 1 coated with 30 IijI of NBR-phenol resin adhesive. After that, the adhesive was roughened with a mixed acid of chromic acid and sulfuric acid, and then subjected to palladium catalyst treatment (H5IOIB manufactured by Hitachi Chemical Co., Ltd.), followed by a photosensitive film (SR-: 1000 manufactured by Hitachi Chemical Co., Ltd., 35μ thick). A plating resist was formed.
次に、この基板に無電解メツキ処理を施し、約３５鱗の
銅を析出させ、基板表面がほぼ平滑な印刷抵抗用基板を
得た。Next, this substrate was subjected to an electroless plating process to deposit about 35 scales of copper, thereby obtaining a printed resistor substrate with a substantially smooth substrate surface.
次いで、銀ペーストを形成した後、抵抗ペーストを印刷
して抵抗体を形成した。Next, after forming a silver paste, the resistor paste was printed to form a resistor.
この工程によって、印刷性が大幅に向上し、高密度な印
刷が可能であった。抵抗体長さも精度良く、制御され、
抵抗値の精度も高かった。This process significantly improved printability and enabled high-density printing. The resistor length is also precisely controlled,
The accuracy of resistance values was also high.
（発明の効果〕
以上詳細に説明したように、本発明によれば、印刷性が
改良され、高密度に抵抗体を形成することが可能になっ
たばかりでなく、抵抗値も設計値に対して精度良く制御
でき、また製造の操作に関しても簡便である。(Effects of the Invention) As explained in detail above, according to the present invention, not only the printability is improved and resistors can be formed with high density, but the resistance value is also lower than the design value. It can be controlled with high precision, and manufacturing operations are also simple.
さらに、電極のエツジにより発生しやすい印刷抵抗体の
クラックが防止できる。Furthermore, cracks in the printed resistor that are likely to occur due to the edges of the electrodes can be prevented.
第１図は本発明の印刷抵抗基板の一実施例を示す断面図
、第２図は従来の印刷抵抗基板の断面図である。
１ニガラスエポキシ基板 ２：銅抵抗電極３：銀電極
４：印刷抵抗体
５：アデティブ用めっきレジスト
６：アデテイブ用接着剤FIG. 1 is a sectional view showing an embodiment of the printed resistance board of the present invention, and FIG. 2 is a sectional view of a conventional printed resistance board. 1 Niglass epoxy board 2: Copper resistance electrode 3: Silver electrode
4: Printed resistor 5: Plating resist for additive 6: Adhesive for additive
Claims (1)
電極とが配設され、少なくとも抵抗電極同士の間隙には
めっきレジストが設けられ、抵抗電極同士に架橋するよ
うに印刷抵抗が、その抵抗電極上およびその間にあるめ
っきレジスト上に、形成されていることを特徴とする印
刷抵抗基板。 ２）基板上に、めっきレジストを形成した後、そのレジ
ストがない部分に、めっきによって、導体パターンとそ
れに連通する抵抗電極とを形成する工程と、 抵抗電極同士を架橋するように、印刷抵抗体を、抵抗電
極上およびめっきレジスト上に形成する工程を有するこ
とを特徴とする印刷抵抗基板の製造方法。 ３）前記めっきレジストを、感光性樹脂を基板全面に均
一に塗布した後、露光、現像処理により不要部分を取り
除いて形成する特許請求の範囲第２項記載の印刷抵抗基
板の製造方法。[Claims] 1) A conductor pattern and a resistive electrode communicating therewith are arranged on an insulating substrate, a plating resist is provided at least in the gap between the resistive electrodes, and printed so as to bridge the resistive electrodes. A printed resistance substrate characterized in that a resistance is formed on the resistance electrode and on a plating resist between the resistance electrodes. 2) After forming a plating resist on the substrate, a process of forming a conductive pattern and a resistive electrode communicating with it by plating on the part where the resist is not present, and printing a printed resistor so as to bridge the resistive electrodes. 1. A method for manufacturing a printed resistance substrate, comprising the step of forming on a resistance electrode and on a plating resist. 3) The method for manufacturing a printed resistor substrate according to claim 2, wherein the plating resist is formed by uniformly applying a photosensitive resin over the entire surface of the substrate, and then removing unnecessary portions by exposure and development.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32838687A JPH01171291A (en) | 1987-12-26 | 1987-12-26 | Printed resistor board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32838687A JPH01171291A (en) | 1987-12-26 | 1987-12-26 | Printed resistor board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171291A true JPH01171291A (en) | 1989-07-06 |
Family
ID=18209668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32838687A Pending JPH01171291A (en) | 1987-12-26 | 1987-12-26 | Printed resistor board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171291A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351991A (en) * | 2005-06-20 | 2006-12-28 | Toppan Printing Co Ltd | Resistive element, multilayer wiring board incorporating the same, and method of adjusting resistance value thereof |
-
1987
- 1987-12-26 JP JP32838687A patent/JPH01171291A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351991A (en) * | 2005-06-20 | 2006-12-28 | Toppan Printing Co Ltd | Resistive element, multilayer wiring board incorporating the same, and method of adjusting resistance value thereof |
| JP4701853B2 (en) * | 2005-06-20 | 2011-06-15 | 凸版印刷株式会社 | Multi-layer wiring board with built-in resistance element and resistance value adjustment method for the resistance element |
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