JPH01167074U - - Google Patents

Info

Publication number
JPH01167074U
JPH01167074U JP1988063902U JP6390288U JPH01167074U JP H01167074 U JPH01167074 U JP H01167074U JP 1988063902 U JP1988063902 U JP 1988063902U JP 6390288 U JP6390288 U JP 6390288U JP H01167074 U JPH01167074 U JP H01167074U
Authority
JP
Japan
Prior art keywords
connection terminal
terminal pattern
pattern
overlapping parts
patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988063902U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0717162Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988063902U priority Critical patent/JPH0717162Y2/ja
Priority to US07/351,646 priority patent/US4958050A/en
Publication of JPH01167074U publication Critical patent/JPH01167074U/ja
Application granted granted Critical
Publication of JPH0717162Y2 publication Critical patent/JPH0717162Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09245—Crossing layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP1988063902U 1988-05-13 1988-05-13 フレキシブルプリント基板 Expired - Lifetime JPH0717162Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988063902U JPH0717162Y2 (ja) 1988-05-13 1988-05-13 フレキシブルプリント基板
US07/351,646 US4958050A (en) 1988-05-13 1989-05-12 Flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988063902U JPH0717162Y2 (ja) 1988-05-13 1988-05-13 フレキシブルプリント基板

Publications (2)

Publication Number Publication Date
JPH01167074U true JPH01167074U (US07652168-20100126-C00068.png) 1989-11-22
JPH0717162Y2 JPH0717162Y2 (ja) 1995-04-19

Family

ID=13242713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988063902U Expired - Lifetime JPH0717162Y2 (ja) 1988-05-13 1988-05-13 フレキシブルプリント基板

Country Status (2)

Country Link
US (1) US4958050A (US07652168-20100126-C00068.png)
JP (1) JPH0717162Y2 (US07652168-20100126-C00068.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015012380A1 (ja) * 2013-07-26 2015-01-29 株式会社フジクラ フレキシブルプリント基板

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59009156D1 (de) * 1990-12-18 1995-06-29 Siemens Ag Hörgerät.
US5250758A (en) * 1991-05-21 1993-10-05 Elf Technologies, Inc. Methods and systems of preparing extended length flexible harnesses
US5276590A (en) * 1991-10-24 1994-01-04 International Business Machines Corporation Flex circuit electronic cards
US5362534A (en) * 1993-08-23 1994-11-08 Parlex Corporation Multiple layer printed circuit boards and method of manufacture
US5376232A (en) * 1993-08-23 1994-12-27 Parlex Corporation Method of manufacturing a printed circuit board
DE19619891C2 (de) * 1996-05-17 2001-07-26 Gkn Viscodrive Gmbh Vorrichtung zur Steuerung einer Kupplung
US6118666A (en) * 1998-01-12 2000-09-12 Asahi Kogaku Kogyo Kabushiki Kaisha Flexible printed wiring board and connecting structure thereof
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
KR100865060B1 (ko) * 2003-04-18 2008-10-23 이비덴 가부시키가이샤 플렉스 리지드 배선판
JP4062168B2 (ja) * 2003-05-19 2008-03-19 ソニー株式会社 端子部材の構造
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
JP4399337B2 (ja) * 2004-09-13 2010-01-13 株式会社フューチャービジョン 平面パターンを有する基板およびそれを用いた表示装置
JP2008186843A (ja) * 2007-01-26 2008-08-14 Olympus Corp フレキシブル基板の接合構造
CN103338582A (zh) * 2013-05-20 2013-10-02 业成光电（深圳）有限公司 软性电路板以及使用该软性电路板的电子装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
US4252391A (en) * 1979-06-19 1981-02-24 Shin-Etsu Polymer Co., Ltd. Anisotropically pressure-sensitive electroconductive composite sheets and method for the preparation thereof
AU572615B2 (en) * 1983-12-27 1988-05-12 Sony Corporation Electrically conductive adhesive sheet circuit board and electrical connection structure
GB2166603B (en) * 1984-09-28 1988-07-20 Yazaki Corp Electrical harness
US4642421A (en) * 1984-10-04 1987-02-10 Amp Incorporated Adhesive electrical interconnecting means
JPS6188136A (ja) * 1984-10-05 1986-05-06 Nec Corp 半導体マルチバイオセンサの製造方法
JPS60191228A (ja) * 1984-10-29 1985-09-28 Seiko Epson Corp 表示装置の接続構造
JPS61194896A (ja) * 1985-02-25 1986-08-29 ソニ−ケミカル株式会社 接続構造体
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
US4808112A (en) * 1986-09-25 1989-02-28 Tektronix, Inc. High density connector design using anisotropically pressure-sensitive electroconductive composite sheets

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015012380A1 (ja) * 2013-07-26 2015-01-29 株式会社フジクラ フレキシブルプリント基板
JP2015043399A (ja) * 2013-07-26 2015-03-05 株式会社フジクラ フレキシブルプリント基板
US10219372B2 (en) 2013-07-26 2019-02-26 Fujikura Ltd. Flexible printed board

Also Published As

Publication number Publication date
US4958050A (en) 1990-09-18
JPH0717162Y2 (ja) 1995-04-19

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