JPH01167062U - - Google Patents

Info

Publication number
JPH01167062U
JPH01167062U JP1988063886U JP6388688U JPH01167062U JP H01167062 U JPH01167062 U JP H01167062U JP 1988063886 U JP1988063886 U JP 1988063886U JP 6388688 U JP6388688 U JP 6388688U JP H01167062 U JPH01167062 U JP H01167062U
Authority
JP
Japan
Prior art keywords
light emitting
flexible substrate
semiconductor light
emitting device
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988063886U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988063886U priority Critical patent/JPH01167062U/ja
Publication of JPH01167062U publication Critical patent/JPH01167062U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は本考案の１実施例を示す半
導体発光装置の構成図である。第３図は本考案の
他の実施例を示す半導体発光装置の構成図である
。第４図及び第５図は従来の半導体発光ダイオー
ドアレイの構成図である。 １……集束性ロツドレンズアレイ、２……ヒー
トシンク、３……遮光板、４……コネクタ、５…
…Ｆ．Ｐ．Ｃ、６……基板、７……ＬＥＤチツプ
、８……ＩＣチツプ、９……ワイヤー、１０……
ペースト、１１……Ｆ．Ｐ．Ｃ取り付け板、１２
……Ｆ．Ｐ．Ｃ補強板、１３……取り付けビス、
１４……Ｆ．Ｐ．Ｃ押さえラバー、１５……Ｆ．
Ｐ．Ｃ押さえ板、１６……押さえネジ。 1 and 2 are configuration diagrams of a semiconductor light emitting device showing one embodiment of the present invention. FIG. 3 is a block diagram of a semiconductor light emitting device showing another embodiment of the present invention. FIGS. 4 and 5 are configuration diagrams of conventional semiconductor light emitting diode arrays. 1... Focusing rod lens array, 2... Heat sink, 3... Light shielding plate, 4... Connector, 5...
…F. P. C, 6... Board, 7... LED chip, 8... IC chip, 9... Wire, 10...
Paste, 11...F. P. C mounting plate, 12
...F. P. C reinforcing plate, 13...installation screw,
14...F. P. C holding rubber, 15...F.
P. C holding plate, 16...holding screw.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 裏面にフレキシブル基板を連結したプリント基
板と、該プリント基板を取り付けるヒートシンク
と、前記フレキシブル基板の一端に接続された発
光素子とを具備してして成る半導体発光装置にお
いて、前記ヒートシンクに貫通孔が穿設され、前
記発光素子の電極端子は前記貫通孔に挿入された
前記フレキシブル基板の他端より取り出されるこ
とを特徴とする半導体発光装置。 In a semiconductor light emitting device comprising a printed circuit board with a flexible substrate connected to its back surface, a heat sink to which the printed circuit board is attached, and a light emitting element connected to one end of the flexible substrate, a through hole is formed in the heat sink. A semiconductor light emitting device, wherein the electrode terminal of the light emitting element is taken out from the other end of the flexible substrate inserted into the through hole.
JP1988063886U 1988-05-13 1988-05-13 Pending JPH01167062U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988063886U JPH01167062U (en) 1988-05-13 1988-05-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988063886U JPH01167062U (en) 1988-05-13 1988-05-13

Publications (1)

Publication Number Publication Date
JPH01167062U true JPH01167062U (en) 1989-11-22

Family

ID=31289374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988063886U Pending JPH01167062U (en) 1988-05-13 1988-05-13

Country Status (1)

Country Link
JP (1) JPH01167062U (en)

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