JPH01163324U - - Google Patents
Info
- Publication number
- JPH01163324U JPH01163324U JP5897288U JP5897288U JPH01163324U JP H01163324 U JPH01163324 U JP H01163324U JP 5897288 U JP5897288 U JP 5897288U JP 5897288 U JP5897288 U JP 5897288U JP H01163324 U JPH01163324 U JP H01163324U
- Authority
- JP
- Japan
- Prior art keywords
- lead member
- seated
- protrusion
- chassis base
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 2
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は、本考案に係る貫通リード部材を用い
た高周波機器における組立構体の平面図、第２図
は第１図のＡ―Ａ線に沿つた断面図、第３図は本
考案の実施例による高周波機器に用いた貫通リー
ド部材の要部断面図、第４図は第３図の組立状態
を示す部分断面図、第５図は従来の組立体の斜視
図及び第６図は第５図の平面図である。
１１……シヤーシベース、１２……プリント配
線体、１３……貫通リード部材、１４……接地導
体、１５……中心導体、１８……突出部、１９…
…半田フイレツト。
Fig. 1 is a plan view of an assembled structure of a high-frequency device using a through lead member according to the present invention, Fig. 2 is a sectional view taken along the line A-A in Fig. 1, and Fig. 3 is an implementation of the present invention. FIG. 4 is a partial sectional view showing the assembled state of FIG. 3, FIG. 5 is a perspective view of a conventional assembly, and FIG. FIG. DESCRIPTION OF SYMBOLS 11... Chassis base, 12... Printed wiring body, 13... Penetrating lead member, 14... Ground conductor, 15... Center conductor, 18... Projection, 19...
...Solder fillet.
Claims (1)
線基板の導出とする高周波機器において、前記貫
通リード部材が座着される前記シヤーシベース位
置に突出部を設け、この突出部と貫通リード部材
の接地部とを半田固着したことを特徴とする貫通
リード部材の取付構体。 In a high-frequency device in which a through lead member is seated on a chassis base to lead out a wiring board, a protrusion is provided at the chassis base position where the through lead member is seated, and this protrusion and the grounding portion of the through lead member are connected. A mounting structure for a penetrating lead member, characterized in that it is fixed by solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5897288U JPH01163324U (en) | 1988-04-30 | 1988-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5897288U JPH01163324U (en) | 1988-04-30 | 1988-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01163324U true JPH01163324U (en) | 1989-11-14 |
Family
ID=31284763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5897288U Pending JPH01163324U (en) | 1988-04-30 | 1988-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01163324U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5934619A (en) * | 1982-08-20 | 1984-02-25 | 三洋電機株式会社 | Method of fixing through condenser |
-
1988
- 1988-04-30 JP JP5897288U patent/JPH01163324U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5934619A (en) * | 1982-08-20 | 1984-02-25 | 三洋電機株式会社 | Method of fixing through condenser |