JPH0221790U - - Google Patents
Info
- Publication number
- JPH0221790U JPH0221790U JP10020788U JP10020788U JPH0221790U JP H0221790 U JPH0221790 U JP H0221790U JP 10020788 U JP10020788 U JP 10020788U JP 10020788 U JP10020788 U JP 10020788U JP H0221790 U JPH0221790 U JP H0221790U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- chassis base
- soldered
- wiring board
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案のプリント配線板とシヤーシベ
ースとの回路基板の組立構体を示す分解斜視図、
第２図乃至第４図は本考案の他の実施例を示す部
分斜視図、第５図は従来例を示す分解斜視図及び
第６は第５図の部分断面図である。
図において、１１はシヤーシベース、１２はプ
リント配線板、１３，１４は平板状半田付補助部
材である。
FIG. 1 is an exploded perspective view showing an assembly structure of a circuit board of the present invention including a printed wiring board and a chassis base;
2 to 4 are partial perspective views showing other embodiments of the present invention, FIG. 5 is an exploded perspective view showing a conventional example, and FIG. 6 is a partial sectional view of FIG. 5. In the figure, 11 is a chassis base, 12 is a printed wiring board, and 13 and 14 are flat soldering auxiliary members.
Claims (1)
定位置で両者を半田結合するものにおいて、平板
状半田付補助部材を前記シヤーシベースとプリン
ト配線体の半田結合位置に対応配置し、この半田
付補助部材の半田付部を介して前記シヤーシベー
スと前記プリント配線板とを半田付することを特
徴とする回路基板の組立構体。 In a device in which a printed wiring board is housed in a chassis base and the two are soldered together at a predetermined position, a flat soldering auxiliary member is arranged corresponding to the soldering joint position of the chassis base and the printed wiring body, and the soldering auxiliary member is soldered. A circuit board assembly structure, characterized in that the chassis base and the printed wiring board are soldered to each other through a portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10020788U JPH0221790U (en) | 1988-07-28 | 1988-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10020788U JPH0221790U (en) | 1988-07-28 | 1988-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221790U true JPH0221790U (en) | 1990-02-14 |
Family
ID=31328077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10020788U Pending JPH0221790U (en) | 1988-07-28 | 1988-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221790U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5843778U (en) * | 1981-09-18 | 1983-03-24 | 富士通株式会社 | power supply terminal |
-
1988
- 1988-07-28 JP JP10020788U patent/JPH0221790U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5843778U (en) * | 1981-09-18 | 1983-03-24 | 富士通株式会社 | power supply terminal |